LX2120SE71826B
| Part Description |
ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 12 Core, 64-Bit 1.8GHz 1517-FCPBGA (40x40) |
|---|---|
| Quantity | 238 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | LX2120S |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A72 | Device Package | 1517-FCPBGA (40x40) | ECCN | N/A | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 100Gbps (2) | Graphics Acceleration | Yes | HTS Code | N/A | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 12 Core, 64-Bit | Operating Temperature | 0°C ~ 105°C (TJ) | Package / Case | 1517-BBGA, FCBGA | ||
| RAM Controllers | DDR4 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| SATA | SATA 3.0 (4) | Security Features | Secure Boot, TrustZone® | Speed | 1.8GHz | ||
| Supplier Device Package | 1517-FCPBGA (40×40) | USB | USB 3.0 (2) + PHY (2) | Voltage – I/O | 1.2V, 1.8V, 3.3V |
Overview of LX2120SE71826B – IC MPU QORLQ 1.8GHZ 1517FCPBGA
The LX2120SE71826B from NXP Semiconductors is an ARM® Cortex®-A72 based microprocessor IC delivering 12 cores of 64-bit compute at 1.8 GHz in a compact 1517-FCPBGA (40×40) package. Designed for embedded and networking-focused systems, it packs multi-core performance, integrated I/O and security primitives to address compute-intensive networking, edge processing and embedded infrastructure applications.
Its combination of multi-core ARM architecture, DDR4 memory support and high-speed I/O enables developers to implement control and data-plane functions, edge compute, and secure connectivity in constrained board space while maintaining system integration and power efficiency.
Key Features
- CPU Core ARM® Cortex®-A72 architecture, 12 cores, 64-bit operation at 1.8 GHz for multi-threaded embedded processing.
- Memory DDR4 memory controllers supported to serve high-throughput packet and application workloads.
- High-speed Ethernet Dual 100 Gbps Ethernet capability for broadband networking and high-throughput data-plane interfaces.
- Storage and USB SATA 3.0 interfaces (×4) plus USB 3.0 (×2) and PHY support for direct storage and peripheral connectivity.
- Security Secure Boot and Arm TrustZone® security features to enable trusted boot and hardware-backed isolation.
- Additional Interfaces CANbus support and other integrated I/O for control and sensor interfacing in embedded systems.
- Graphics Acceleration Graphics acceleration capability to support embedded display or offload tasks that require acceleration.
- Package & Mounting 1517-BBGA FCBGA package (supplier package: 1517-FCPBGA, 40×40), surface-mount mounting type suitable for compact boards.
- Operating Range Specified operating temperature range of 0 °C to 105 °C for a variety of industrial and embedded environments.
- Compliance RoHS-compliant manufacturing status.
Typical Applications
- Networking Infrastructure Control-plane and data-plane processing for switches, routers and white-box networking where high-speed Ethernet and multi-core processing are required.
- Data Center Offload Edge and appliance designs that require packet processing, compression or security offload capabilities while preserving server-class interfaces.
- 5G Packet Processing Centralized and distributed unit functions in 5G infrastructure that need deterministic packet throughput and hardware-accelerated security.
- Industrial & Edge Systems Embedded gateway, automation and edge compute nodes leveraging DDR4, CANbus and robust operating temperature support for field deployments.
Unique Advantages
- Multi-core ARM 64-bit performance: 12 Cortex‑A72 cores at 1.8 GHz provide scalable CPU throughput for concurrent network and application workloads.
- High-bandwidth I/O integration: Dual 100 Gbps Ethernet along with SATA 3.0 and USB 3.0 reduce external bridging and simplify system BOM.
- Built-in security primitives: Secure Boot and TrustZone® enable hardware-backed platform security without adding discrete security components.
- Compact, board-friendly package: 1517-FCPBGA (40×40) FCBGA package supports high integration in space-constrained designs.
- Software ecosystem support: Layerscape-compatible tooling and software stacks (Linux SDK, development tools referenced in product documentation) accelerate bring-up and development.
- Wide operating window: 0 °C to 105 °C operating range supports deployment in a variety of embedded and networking environments.
Why Choose LX2120SE71826B?
The LX2120SE71826B positions itself as a high-performance, highly integrated microprocessor for embedded networking and edge compute applications. With a 12-core ARM Cortex‑A72 cluster, DDR4 memory support and dual 100 Gbps Ethernet capability, it delivers the compute and I/O bandwidth required for modern networked systems while minimizing external components.
Engineers building control-plane processors, edge appliances, or embedded gateways will find the combination of multi-core performance, integrated storage and peripheral interfaces, and hardware security features useful for reducing system complexity and accelerating time-to-market. Long-term software support options referenced in product documentation further help with platform development and maintenance.
Request a quote or submit an inquiry to receive pricing and availability information for LX2120SE71826B and to discuss how it can fit your next embedded or networking design.

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