LX2120SE71826B

IC MPU QORLQ 1.8GHZ 1517FCPBGA
Part Description

ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 12 Core, 64-Bit 1.8GHz 1517-FCPBGA (40x40)

Quantity 238 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLX2120S
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A72Device Package1517-FCPBGA (40x40)ECCNN/A
Ethernet100Gbps (2)Graphics AccelerationYesHTS CodeN/A
Moisture Sensitivity LevelN/AMounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width12 Core, 64-BitOperating Temperature0°C ~ 105°C (TJ)Package / Case1517-BBGA, FCBGA
RAM ControllersDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3.0 (4)Security FeaturesSecure Boot, TrustZone®Speed1.8GHz
Supplier Device Package1517-FCPBGA (40×40)USBUSB 3.0 (2) + PHY (2)Voltage – I/O1.2V, 1.8V, 3.3V

Overview of LX2120SE71826B – IC MPU QORLQ 1.8GHZ 1517FCPBGA

The LX2120SE71826B from NXP Semiconductors is an ARM® Cortex®-A72 based microprocessor IC delivering 12 cores of 64-bit compute at 1.8 GHz in a compact 1517-FCPBGA (40×40) package. Designed for embedded and networking-focused systems, it packs multi-core performance, integrated I/O and security primitives to address compute-intensive networking, edge processing and embedded infrastructure applications.

Its combination of multi-core ARM architecture, DDR4 memory support and high-speed I/O enables developers to implement control and data-plane functions, edge compute, and secure connectivity in constrained board space while maintaining system integration and power efficiency.

Key Features

  • CPU Core  ARM® Cortex®-A72 architecture, 12 cores, 64-bit operation at 1.8 GHz for multi-threaded embedded processing.
  • Memory  DDR4 memory controllers supported to serve high-throughput packet and application workloads.
  • High-speed Ethernet  Dual 100 Gbps Ethernet capability for broadband networking and high-throughput data-plane interfaces.
  • Storage and USB  SATA 3.0 interfaces (×4) plus USB 3.0 (×2) and PHY support for direct storage and peripheral connectivity.
  • Security  Secure Boot and Arm TrustZone® security features to enable trusted boot and hardware-backed isolation.
  • Additional Interfaces  CANbus support and other integrated I/O for control and sensor interfacing in embedded systems.
  • Graphics Acceleration  Graphics acceleration capability to support embedded display or offload tasks that require acceleration.
  • Package & Mounting  1517-BBGA FCBGA package (supplier package: 1517-FCPBGA, 40×40), surface-mount mounting type suitable for compact boards.
  • Operating Range  Specified operating temperature range of 0 °C to 105 °C for a variety of industrial and embedded environments.
  • Compliance  RoHS-compliant manufacturing status.

Typical Applications

  • Networking Infrastructure  Control-plane and data-plane processing for switches, routers and white-box networking where high-speed Ethernet and multi-core processing are required.
  • Data Center Offload  Edge and appliance designs that require packet processing, compression or security offload capabilities while preserving server-class interfaces.
  • 5G Packet Processing  Centralized and distributed unit functions in 5G infrastructure that need deterministic packet throughput and hardware-accelerated security.
  • Industrial & Edge Systems  Embedded gateway, automation and edge compute nodes leveraging DDR4, CANbus and robust operating temperature support for field deployments.

Unique Advantages

  • Multi-core ARM 64-bit performance: 12 Cortex‑A72 cores at 1.8 GHz provide scalable CPU throughput for concurrent network and application workloads.
  • High-bandwidth I/O integration: Dual 100 Gbps Ethernet along with SATA 3.0 and USB 3.0 reduce external bridging and simplify system BOM.
  • Built-in security primitives: Secure Boot and TrustZone® enable hardware-backed platform security without adding discrete security components.
  • Compact, board-friendly package: 1517-FCPBGA (40×40) FCBGA package supports high integration in space-constrained designs.
  • Software ecosystem support: Layerscape-compatible tooling and software stacks (Linux SDK, development tools referenced in product documentation) accelerate bring-up and development.
  • Wide operating window: 0 °C to 105 °C operating range supports deployment in a variety of embedded and networking environments.

Why Choose LX2120SE71826B?

The LX2120SE71826B positions itself as a high-performance, highly integrated microprocessor for embedded networking and edge compute applications. With a 12-core ARM Cortex‑A72 cluster, DDR4 memory support and dual 100 Gbps Ethernet capability, it delivers the compute and I/O bandwidth required for modern networked systems while minimizing external components.

Engineers building control-plane processors, edge appliances, or embedded gateways will find the combination of multi-core performance, integrated storage and peripheral interfaces, and hardware security features useful for reducing system complexity and accelerating time-to-market. Long-term software support options referenced in product documentation further help with platform development and maintenance.

Request a quote or submit an inquiry to receive pricing and availability information for LX2120SE71826B and to discuss how it can fit your next embedded or networking design.

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