LX2120SN71826B
| Part Description |
ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 12 Core, 64-Bit 1.8GHz 1517-FCPBGA (40x40) |
|---|---|
| Quantity | 462 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | LX2120S |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A72 | Device Package | 1517-FCPBGA (40x40) | ECCN | N/A | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 100Gbps (2) | Graphics Acceleration | Yes | HTS Code | N/A | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 12 Core, 64-Bit | Operating Temperature | 0°C ~ 105°C (TJ) | Package / Case | 1517-BBGA, FCBGA | ||
| RAM Controllers | DDR4 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| SATA | SATA 3.0 (4) | Security Features | Secure Boot, TrustZone® | Speed | 1.8GHz | ||
| Supplier Device Package | 1517-FCPBGA (40×40) | USB | USB 3.0 (2) + PHY (2) | Voltage – I/O | 1.2V, 1.8V, 3.3V |
Overview of LX2120SN71826B – IC MPU QORLQ 1.8GHZ 1517FCPBGA
The LX2120SN71826B is an NXP Layerscape embedded microprocessor built around ARM® Cortex®-A72 cores. This device implements a 12-core, 64-bit architecture running at 1.8 GHz and is targeted at compute‑intensive embedded applications that require high throughput and integrated I/O.
With DDR4 memory controllers, multi‑100 Gbps networking capability, onboard storage and USB interfaces, and hardware security features such as Secure Boot and TrustZone®, the LX2120SN71826B is designed to deliver integrated performance and platform-level security for embedded networking and edge compute systems.
Key Features
- Processor Core 12× ARM® Cortex®-A72 cores, 64‑bit, operating at 1.8 GHz to provide multi-threaded compute capacity for control and data‑plane tasks.
- Memory DDR4 memory controllers for modern high-speed system memory support.
- High‑Speed Networking Dual 100 Gbps Ethernet capability to support high-throughput networking and data transport requirements.
- Storage and USB Four SATA 3.0 ports and two USB 3.0 ports plus PHY support for flexible local storage and peripheral connectivity.
- Security Hardware security features including Secure Boot and Arm TrustZone® for platform integrity and trusted execution.
- Interfaces & Expansion CANbus and additional peripheral interfaces for in-vehicle or industrial connectivity; graphics acceleration is included.
- Package & Mounting 1517‑FCPBGA (40×40) surface‑mount package for compact board integration.
- Operating Range & Compliance Rated for operation from 0 °C to 105 °C and RoHS compliant for environmental regulatory requirements.
Typical Applications
- Networking Equipment High‑throughput control and data‑plane processing in routers, switches, and aggregation platforms leveraging dual 100 Gbps Ethernet.
- Edge and Data‑Center Offload Edge compute nodes and offload appliances that require multi‑core processing and integrated I/O for compression, security, or packet processing.
- 5G Infrastructure Packet and control-plane functions in 5G network elements where multi‑core processing and high‑speed I/O are needed.
- Industrial Systems Industrial controllers and gateways that benefit from robust temperature range, CANbus connectivity, and secure boot capabilities.
- Autonomous Systems Central connectivity hubs and sensor data management tasks that use multi‑core processing and diverse I/O options.
Unique Advantages
- Multi‑Core 64‑Bit Performance: Twelve Cortex‑A72 cores at 1.8 GHz enable parallel processing for control and data‑plane workloads.
- Integrated High‑Speed I/O: Dual 100 Gbps Ethernet, SATA 3.0, and USB 3.0 reduce external interface complexity and simplify board design.
- Platform Security Built In: Secure Boot and Arm TrustZone® provide a foundation for trusted firmware and secure system deployment.
- Compact, Surface‑Mount Package: 1517‑FCPBGA (40×40) packaging allows dense PCB integration for space‑constrained embedded systems.
- Industrial Temperature Capability: 0 °C to 105 °C operating range supports deployment in demanding embedded and industrial environments.
- Standards‑Oriented Connectivity: Support for DDR4 memory and common peripheral interfaces streamlines system integration and component selection.
Why Choose LX2120SN71826B?
The LX2120SN71826B positions itself as a highly integrated embedded processor for engineers designing high‑performance networking, edge compute, 5G, and industrial systems. Its 12‑core Cortex‑A72 architecture paired with DDR4 memory controllers and multi‑100 Gbps networking capability delivers the compute and I/O density required for modern embedded designs.
Backed by NXP’s Layerscape platform and supported software ecosystems, the LX2120SN71826B offers a combination of performance, security, and integration that helps reduce BOM complexity and accelerate time to market for scalable embedded solutions.
Request a quote or submit an inquiry for the LX2120SN71826B to check pricing and availability for your next design.

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