LX2120XC72029B

IC MPU QORLQ LX2 2GHZ 1517FCPBGA
Part Description

ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 12 Core, 64-Bit 2GHz 1517-FCPBGA (40x40)

Quantity 264 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLX2120X
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A72Device Package1517-FCPBGA (40x40)ECCNN/A
Ethernet100Gbps (2)Graphics AccelerationYesHTS CodeN/A
Moisture Sensitivity LevelN/AMounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width12 Core, 64-BitOperating Temperature-40°C ~ 105°C (TJ)Package / Case1517-BBGA, FCBGA
RAM ControllersDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3.0 (4)Security FeaturesSecure Boot, TrustZone®Speed2GHz
Supplier Device Package1517-FCPBGA (40×40)USBUSB 3.0 (2) + PHY (2)Voltage – I/O1.2V, 1.8V, 3.3V

Overview of LX2120XC72029B – 12‑Core ARM® Cortex®‑A72 2 GHz MPU (1517‑FCPBGA)

The LX2120XC72029B is an NXP Layerscape microprocessor integrating a 12‑core, 64‑bit ARM® Cortex®‑A72 CPU fabric running at 2 GHz. It combines high‑performance compute with broad I/O integration and industrial qualification for networking, edge compute and embedded control applications.

Designed for systems requiring multi‑core processing, high‑speed interfaces and hardware security, this device delivers DDR4 memory support, dual 100 Gbps Ethernet connectivity, SATA 3.0 and USB 3.0 while operating across an industrial temperature range.

Key Features

  • Core and Architecture Twelve ARM® Cortex®‑A72 64‑bit cores running at 2 GHz provide scalable multi‑threaded compute for control plane and edge processing tasks.
  • Memory Integrated DDR4 memory controller support enables high‑speed system memory operation for packet buffering and application workloads.
  • High‑Speed Networking Dual 100 Gbps Ethernet ports support demanding throughput requirements for networking and data‑plane applications.
  • Storage and USB Four SATA 3.0 ports and two USB 3.0 ports (plus two USB PHYs) provide flexible local storage and peripheral connectivity.
  • Security Secure Boot and Arm TrustZone® support enable platform integrity and hardware‑assisted isolation for secure system designs.
  • Additional Interfaces CANbus and other peripheral interfaces broaden integration options for industrial and control systems.
  • Graphics Acceleration On‑chip graphics acceleration supports visual processing and display offload where required.
  • Package and Mounting Supplied in a 1517‑FCPBGA (40×40) surface‑mount package (1517‑BBGA, FCBGA), simplifying board‑level integration.
  • Operating Range Industrial qualification with an operating temperature range of −40 °C to 105 °C supports harsh‑environment deployments.
  • Compliance RoHS‑compliant manufacturing and materials.

Typical Applications

  • Network Infrastructure Use as a control or data‑plane processor in switches, routers and network appliances that require 100 Gbps connectivity and multi‑core processing.
  • Edge and Data‑Center Offload Host compute‑intensive edge services or offload functions where high throughput, DDR4 memory and storage interfaces are needed.
  • Industrial Control Deploy in industrial automation and control systems leveraging CANbus, wide temperature range and industrial qualification.
  • 5G and Telecom Integrate into packet processing and control elements that benefit from multi‑core compute and high‑speed Ethernet connectivity.

Unique Advantages

  • High core count with 64‑bit ARM architecture: Twelve Cortex‑A72 cores deliver parallel compute for multi‑threaded workloads while maintaining 64‑bit processing.
  • Broad high‑speed I/O set: Dual 100 Gbps Ethernet, SATA 3.0 and USB 3.0 reduce the need for external controllers and simplify BOM.
  • Built‑in platform security: Secure Boot and TrustZone® provide hardware‑rooted security primitives for trusted system designs.
  • Industrial temperature rating: −40 °C to 105 °C operation enables deployment in a wide range of environmental conditions.
  • Compact BGA package: 1517‑FCPBGA (40×40) packaging supports high‑density board implementations and surface‑mount assembly.

Why Choose LX2120XC72029B?

The LX2120XC72029B positions itself where multi‑core performance, robust I/O and security converge for embedded networking and edge compute designs. Its combination of 12 ARM® Cortex®‑A72 cores, DDR4 memory support, dual 100 Gbps Ethernet and industrial operating range makes it well suited for systems that demand sustained throughput and platform integrity.

Engineers building network appliances, industrial controllers or edge servers will find a scalable, integrated building block that reduces external component count and supports secure deployment models while meeting industrial temperature requirements.

Request a quote or submit your project requirements to receive pricing, lead‑time and availability for LX2120XC72029B from our sales team.

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