LX2120XE71826B

The LX2120XE71826B is a 12-core, 64-bit microprocessor IC based on the ARM® Cortex®-A72 architecture, operating at 1.8 GHz. Designed for embedded and networking applications, it combines multi-core compute with a broad set of high-speed interfaces and industrial qualification for deployment in constrained board-space and thermal environments.

This device delivers integrated memory and I/O capabilities, on-chip security primitives, and graphics acceleration to support networking, edge compute, and industrial gateway use cases where performance, integration, and temperature robustness are required.

Key Features

• CPU Cores  12-core ARM® Cortex®-A72 64-bit processor running at 1.8 GHz for multi-threaded and packet-processing workloads.
• Memory  DDR4 memory controller support. Family-level documentation highlights dual DDR4 72-bit channels with ECC support and high-speed operation to meet large memory footprint requirements.
• High-speed Ethernet  Two 100 Gbps Ethernet ports specified; the Layerscape family supports multi-port, high-throughput networking configurations for data-plane and control-plane designs.
• Storage and USB  Four SATA 3.0 ports and two USB 3.0 ports plus PHY support provide flexible mass-storage and peripheral connectivity.
• Additional Interfaces  CANbus support and a variety of peripheral interfaces for industrial and embedded communication tasks.
• Security  Secure Boot and Arm TrustZone® technologies are included to establish a hardware-backed root of trust for secure system boot and trusted execution environments.
• Graphics Acceleration  Integrated graphics acceleration to offload display or graphical processing tasks from the CPU cores.
• Package & Mounting  1517-FCPBGA (40 × 40 mm) surface-mount package for compact system integration.
• Industrial Qualification & Temperature  Industrial qualification with an operating range of −40 °C to 105 °C for deployment in demanding thermal environments.
• Compliance  RoHS compliant to meet environmental requirements.

Typical Applications

• Network Infrastructure  Control and data-plane processing in routers, switches and edge appliances that require multi-core packet handling and high-speed Ethernet.
• Data Center Offload  Offload and control functions in NICs and appliances where integrated I/O and multi-core processing reduce external subsystem load.
• 5G Packet Processing  Packet and protocol processing in 5G infrastructure elements that need deterministic performance and high throughput.
• Industrial Gateways and Edge Compute  Industrial edge devices and gateways that need robust temperature operation, fieldbus/CAN connectivity, and secure boot capabilities.

Unique Advantages

• High compute density: 12 ARM® Cortex®-A72 cores at 1.8 GHz provide substantial parallel processing for networking and edge workloads.
• Integrated high-speed I/O: Native support for 100 Gbps Ethernet ports, multiple SATA 3.0 ports and USB 3.0 simplifies BOM and board routing for high-bandwidth systems.
• Industrial-ready operation: −40 °C to 105 °C operating range and industrial qualification enable reliable deployment in harsh environments.
• Security foundation: Secure Boot and TrustZone® provide a hardware-backed starting point for trusted system architectures and secure firmware management.
• Compact surface-mount package: 1517-FCPBGA (40×40 mm) package offers a balance of I/O density and board-space efficiency for compact systems.
• Scalable Layerscape family compatibility: Family-level pin compatibility between multi-core members supports design scalability across different core counts.

Why Choose LX2120XE71826B?

The LX2120XE71826B blends multi-core ARM® Cortex®-A72 processing with a comprehensive set of high-speed interfaces and embedded security features, targeted at networking, edge computing, and industrial applications. Its industrial temperature range and RoHS compliance make it suitable for designs that require both performance and operational robustness.

Backed by NXP Semiconductors and the Layerscape ecosystem, this device is a practical choice for teams building scalable, secure, and high-throughput embedded systems that demand integrated memory and I/O capabilities in a compact package.

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