LX2120SE72232B

The LX2120SE72232B is an NXP Layerscape LX2120S series microprocessor IC featuring a 12‑core, 64‑bit ARM® Cortex®‑A72 architecture running up to 2.2 GHz. It combines high‑performance CPU cores with broad system integration to address embedded and compute‑intensive networking, edge and industrial applications.

Designed to simplify board design and accelerate time to market, the device integrates DDR4 memory support, dual 100 Gb/s Ethernet, multiple storage and peripheral interfaces, hardware security features, and a compact 1517 FCPBGA package.

Key Features

• Core and Architecture  Twelve ARM® Cortex®‑A72 64‑bit processor cores running up to 2.2 GHz for multi‑threaded embedded workloads.
• Memory  DDR4 memory controller support for modern system memory configurations.
• High‑Speed Networking  Two 100 Gb/s Ethernet interfaces to support high‑bandwidth network and edge processing use cases.
• Storage Interfaces  Four SATA 3.0 ports for high‑performance local storage connectivity.
• Peripheral I/O  Two USB 3.0 ports plus two USB PHYs and CANbus for flexible peripheral and control interfaces.
• Security  Hardware security features including Secure Boot and Arm TrustZone® to enable platform integrity and trusted execution.
• Graphics Acceleration  Integrated graphics acceleration to support visual or display‑oriented tasks.
• Package and Mounting  1517‑FCPBGA (40×40) surface‑mount package for compact system integration.
• Operating Range & Compliance  Operates from 0 °C to 105 °C and is RoHS compliant for environmental regulatory alignment.

Typical Applications

• Networking and Telecom  Control and data‑plane processing where dual 100 Gb/s Ethernet connectivity and multi‑core compute accelerate packet handling.
• Data Center Offload  Edge and offload functions that benefit from high core counts and integrated I/O to reduce system complexity.
• 5G and Wireless Infrastructure  Packet processing and control functions requiring scalable CPU performance and rich I/O.
• Industrial and Edge Computing  Local compute, storage and secure boot requirements in constrained footprints and elevated temperature ranges.
• Autonomous Systems  Sensor data aggregation and connectivity hub roles that need multi‑core processing, storage and security features.

Unique Advantages

• High‑density compute: Twelve Cortex‑A72 cores at up to 2.2 GHz deliver strong multi‑threaded performance for embedded workloads.
• Dual 100 Gb/s networking: Native support for two 100 Gb/s Ethernet links enables high‑bandwidth edge and switching applications.
• Comprehensive I/O suite: SATA 3.0, USB 3.0, CANbus and DDR4 support reduce external bridging components and simplify board design.
• Built‑in platform security: Secure Boot and Arm TrustZone® provide hardware‑level foundations for trusted systems.
• Compact FCBGA footprint: 1517‑FCPBGA (40×40) surface‑mount package balances integration density and manufacturability.
• Industrial temperature capability: 0 °C to 105 °C operating range supports deployment in thermally challenging embedded environments.

Why Choose LX2120SE72232B?

The LX2120SE72232B positions itself as a performance‑oriented, highly integrated Layerscape microprocessor ideal for designers building embedded networking, edge compute and industrial systems. Its combination of 12 ARM Cortex‑A72 cores, DDR4 memory support, dual 100 Gb/s Ethernet and extensive peripheral interfaces enables compact, feature‑rich platforms with robust security foundations.

As part of the Layerscape ecosystem, the device is supported by processor toolchains and software offerings that accelerate development and deployment, helping teams deliver scalable, reliable products with reduced BOM and board complexity.

Request a quote or submit your specifications to receive pricing and availability for the LX2120SE72232B.