LX2120SC72029B

IC MPU QORLQ LX2 2GHZ 1517FCPBGA
Part Description

ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 12 Core, 64-Bit 2GHz 1517-FCPBGA (40x40)

Quantity 503 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLX2120S
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A72Device Package1517-FCPBGA (40x40)ECCNN/A
Ethernet100Gbps (2)Graphics AccelerationYesHTS CodeN/A
Moisture Sensitivity LevelN/AMounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width12 Core, 64-BitOperating Temperature0°C ~ 105°C (TJ)Package / Case1517-BBGA, FCBGA
RAM ControllersDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3.0 (4)Security FeaturesSecure Boot, TrustZone®Speed2GHz
Supplier Device Package1517-FCPBGA (40×40)USBUSB 3.0 (2) + PHY (2)Voltage – I/O1.2V, 1.8V, 3.3V

Overview of LX2120SC72029B – ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 12 Core, 64-Bit 2GHz 1517-FCPBGA (40×40)

The LX2120SC72029B is a high-performance Layerscape-class microprocessor from NXP Semiconductors featuring a 12-core, 64-bit ARM® Cortex®-A72 CPU architecture running at 2 GHz. It targets compute‑intensive embedded networking and edge use cases that require multi‑core processing, extensive I/O integration and robust security features.

Designed for applications in networking, data center offload, 5G and industrial edge systems, the device delivers tightly integrated memory and I/O support with on‑chip security to simplify system design and accelerate time to market.

Key Features

  • Core 12× ARM® Cortex®-A72 64‑bit cores running at 2 GHz for scalable multi‑threaded processing.
  • Memory DDR4 memory controller support for modern system memory topologies.
  • High‑speed Ethernet Dual 100 Gbps Ethernet capability to address high-throughput networking and data plane traffic.
  • Storage and USB Four SATA 3.0 ports and two USB 3.0 ports (plus two PHYs) for storage and high‑speed peripheral connectivity.
  • Peripheral interfaces Integrated CANbus and additional system interfaces to support industrial and automotive adjacent I/O requirements.
  • Security Secure Boot and Arm TrustZone® technology for hardware‑assisted platform security and trusted execution.
  • Graphics Acceleration On‑chip graphics acceleration to support visual processing tasks in edge applications.
  • Package & Mounting 1517‑FCPBGA (40×40) package, surface mount, optimized for compact embedded board designs.
  • Operating Range Qualified for consumer applications with an operating temperature range of 0 °C to 105 °C.
  • Compliance RoHS compliant to support regulatory and environmental requirements.

Typical Applications

  • Networking & Telecom — Control‑plane and data‑plane processing in switches, routers and network appliances leveraging dual 100 Gbps Ethernet.
  • Data Center Offload — Host control functions and acceleration tasks for packet processing and secure offload in edge and cloud gateway designs.
  • 5G & Wireless Infrastructure — Edge compute and packet handling for RAN and CU/DU functions where multi‑core processing and high I/O bandwidth are required.
  • Industrial Edge Systems — Local compute and connectivity hub for industrial control, telemetry and protocol bridging using built‑in CAN and diverse I/O.
  • Embedded Storage & Media Appliances — High‑throughput storage gateways and media processing platforms using SATA3 and USB3 connectivity plus graphics acceleration.

Unique Advantages

  • High multi‑core throughput: Twelve 64‑bit Cortex‑A72 cores at 2 GHz provide the compute headroom needed for parallel packet and application workloads.
  • Integrated high‑bandwidth networking: Dual 100 Gbps Ethernet capability reduces external PHY/count complexity for bandwidth‑intensive applications.
  • Rich I/O set: SATA3, USB3 and CANbus interfaces consolidate peripherals and storage on a single SoC, lowering BOM and board complexity.
  • Hardware security primitives: Secure Boot and Arm TrustZone® allow designers to implement trusted boot and isolated execution environments.
  • Industrial operating range: 0 °C to 105 °C support enables deployment in edge and industrial environments within the specified consumer qualification class.
  • EMC and environmental compliance: RoHS compliance supports regulatory requirements for commercial and industrial products.

Why Choose LX2120SC72029B?

The LX2120SC72029B combines a 12‑core ARM® Cortex®‑A72 architecture with extensive high‑speed networking and peripheral integration to address compute‑intensive embedded designs. Its balance of multi‑core performance, integrated I/O and on‑chip security makes it well suited for networking, edge compute, 5G and industrial gateway applications.

Designed to streamline system designs and accelerate development, the Layerscape family offers a software ecosystem including Linux SDK and embedded development tools to help bring products to market with reduced integration effort and long‑term scalability.

Request a quote or submit an inquiry to receive pricing and availability details for LX2120SC72029B and to discuss how this device can fit your next embedded system design.

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