LX2120CA72232B

The LX2120CA72232B is a high-performance microprocessor IC in a 1517-FCPBGA (40×40) package built around 64-bit ARM® Cortex®-A72 cores. With a 12-core architecture running up to 2.2 GHz and DDR4 memory controller support, it is targeted at compute-intensive embedded networking and edge processing applications.

Its combination of multi-core CPU performance, high-speed I/O options and a compact surface-mount package make it suitable for systems that require integrated processing, high-bandwidth connectivity and industrial operating temperature support.

Key Features

• CPU Cores — 12 × ARM® Cortex®-A72 64-bit cores, operating up to 2.2 GHz for multi-threaded and control-plane workloads.
• Memory — DDR4 memory controller support for modern high-speed system memory implementations.
• High-speed Ethernet — Supports Ethernet at 100G, 10G and 1G speeds to accommodate a range of networking bandwidth requirements.
• SATA and USB — Four SATA 3.0 ports and two USB 3.0 ports plus two USB PHYs for storage and peripheral connectivity.
• Additional Interfaces — CANbus interface available for vehicle and industrial connectivity use cases.
• Graphics Acceleration — Graphics acceleration capability indicated for offloading graphical processing tasks.
• Package & Mounting — 1517-FCPBGA (40×40) supplier device package; surface-mount mounting type for compact board designs.
• Operating Temperature — Industrial-grade range from −40 °C to 105 °C for robust environmental performance.
• Security — No dedicated security features indicated in the product data.

Typical Applications

• High-performance networking — Use in routers, switches and network controllers where multi-core processing and multi-gigabit Ethernet are required.
• Edge and gateway compute — On-device processing for edge analytics and protocol handling that benefit from 12 cores and DDR4 memory support.
• Data plane acceleration — Deployment in systems requiring high-throughput I/O with SATA 3.0 and USB 3.0 connectivity.
• 5G and telecom infrastructure — Suitable for packet processing and control-plane tasks that demand sustained multi-core performance and high-speed Ethernet.

Unique Advantages

• Multi-core processing capacity — Twelve 64-bit Cortex-A72 cores up to 2.2 GHz enable parallel processing for control and data-plane tasks.
• Broad high-speed I/O — Native support for 100G/10G/1G Ethernet alongside SATA 3.0 and USB 3.0 provides flexible connectivity options.
• Industrial temperature range — −40 °C to 105 °C rating supports deployments in harsh and industrial environments.
• Compact surface-mount package — 1517-FCPBGA (40×40) package helps minimize board area while integrating a high level of functionality.
• DDR4 memory support — Modern memory interface for high-bandwidth system memory designs.
• CANbus available — Adds deterministic communication options for industrial and embedded control systems.

Why Choose LX2120CA72232B?

The LX2120CA72232B combines a 12-core ARM Cortex-A72 architecture with a range of high-speed interfaces in a compact surface-mount BGA package, making it well-suited for embedded networking, edge compute and telecom applications that require sustained multi-core performance and broad I/O. Its industrial operating temperature range and integrated connectivity options help simplify designs that must operate reliably in constrained spaces.

Designers can leverage the Layerscape ecosystem and available software support to accelerate development and integration for platforms that demand multi-gigabit networking, storage and peripheral interfacing.

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