LX2082RE82029B

The LX2082RE82029B is an NXP Semiconductors QorIQ LX series microprocessor IC built around ARM® Cortex®-A72 64-bit cores. This device integrates eight Cortex‑A72 cores running at 2 GHz and is designed for embedded applications that require multi‑core processing, extensive memory interfacing, and a broad set of high-speed I/O.

Typical use cases include networking and edge compute, industrial control and connectivity hubs, and other embedded systems where integrated storage and peripheral interfaces, compact surface‑mount packaging, and extended temperature operation are important.

Key Features

• CPU Core Eight ARM® Cortex®-A72 64‑bit cores running at 2 GHz, delivering multi‑threaded processing capability for embedded workloads.
• Memory Support Integrated controllers for DDR4 and SDRAM to support system memory needs and high throughput data buffering.
• Storage & High-Speed I/O Four SATA 6 Gbps ports and one USB 3.0 port provide high‑performance storage and peripheral connectivity for data‑intensive applications.
• Automotive/Field Bus Interface CANbus interface(s) for robust field connectivity and real‑time communication in industrial and control applications.
• Package & Mounting 1150‑FBGA package (23 × 23 mm) in a surface‑mount form factor for compact board designs and high pin density.
• Operating Range Qualified to operate from 5 °C to 105 °C, supporting deployments in a wide range of embedded environments.
• Regulatory Status RoHS compliant, enabling integration into assemblies with lead‑free requirements.

Typical Applications

• Networking & Edge Compute: Multi‑core ARM processing and high‑speed I/O make the device suitable for control-plane or edge compute tasks in networking equipment.
• Data Center Offload & Acceleration: Use where local packet processing, storage interfacing and protocol handling are needed at the edge of data center networks.
• Industrial Control & Automation: CANbus connectivity, extended operating temperature, and compact package fit industrial controllers and gateway devices.
• 5G and Wireless Infrastructure: Embedded compute and interface density can support control and processing tasks in wireless and packet processing applications.

Unique Advantages

• Balanced Multi‑Core Performance: Eight 64‑bit Cortex‑A72 cores at 2 GHz provide a strong foundation for parallel and compute‑intensive embedded workloads.
• Comprehensive Storage Options: Four SATA 6 Gbps ports plus USB 3.0 support local storage and high‑speed data transfer without external bridging components.
• Flexible Memory Interface: DDR4 and SDRAM controller support enables scalable system memory configurations to match application needs.
• Compact, High‑Density Packaging: 1150‑FBGA (23×23 mm) surface‑mount package enables compact PCB layouts while exposing plentiful I/O.
• Wide Operating Temperature: 5 °C to 105 °C operation supports deployment in thermally demanding embedded environments.
• Vendor Backing: Manufactured by NXP Semiconductors, with available product documentation and datasheet resources for design integration.

Why Choose LX2082RE82029B?

The LX2082RE82029B positions itself as a multi‑core embedded processor that blends sustained compute capability with a broad set of integrated I/O and memory interfaces. Its combination of eight ARM Cortex‑A72 cores, DDR4/SDRAM support, multiple SATA ports and CANbus connectivity targets designs that need both processing headroom and rich peripheral connectivity in a compact, surface‑mount package.

This part is suited to engineering teams building networking equipment, edge compute nodes, industrial gateways, and other embedded systems that demand a balanced mix of processing performance, high‑speed storage interfaces, and extended temperature operation—supported by NXP documentation for design integration.

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