LX2080XN71826B

IC MPU QORLQ 1.8GHZ 1517FCPBGA
Part Description

ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 8 Core, 64-Bit 1.8GHz 1517-FCPBGA (40x40)

Quantity 943 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLX2080X
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A72Device Package1517-FCPBGA (40x40)ECCNN/A
Ethernet100Gbps (2)Graphics AccelerationYesHTS CodeN/A
Moisture Sensitivity LevelN/AMounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width8 Core, 64-BitOperating Temperature-40°C ~ 105°C (TJ)Package / Case1517-BBGA, FCBGA
RAM ControllersDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3.0 (4)Security FeaturesSecure Boot, TrustZone®Speed1.8GHz
Supplier Device Package1517-FCPBGA (40×40)USBUSB 3.0 (2) + PHY (2)Voltage – I/O1.2V, 1.8V, 3.3V

Overview of LX2080XN71826B – ARM Cortex‑A72 8‑Core 1.8 GHz MPU (1517‑FCPBGA)

The LX2080XN71826B is an NXP Semiconductors Layerscape LX2080X series microprocessor IC featuring an ARM® Cortex®‑A72 64‑bit CPU with eight cores running at 1.8 GHz. Designed for embedded and compute‑intensive networking applications, it combines multi‑core processing with broad I/O and industrial‑grade operating range.

With DDR4 memory support, dual 100 Gbps Ethernet capability, multiple SATA and USB interfaces, and hardware security features, this device targets high‑throughput edge, networking and industrial designs that require performance, integration and extended temperature operation.

Key Features

  • Core/Processor ARM® Cortex®‑A72 architecture, 8 cores, 64‑bit, running at 1.8 GHz to handle multi‑threaded embedded workloads.
  • Memory DDR4 memory controller support for modern system memory performance and capacity.
  • High‑Speed Networking Two 100 Gbps Ethernet interfaces are provided for demanding networking and packet processing tasks.
  • Storage and USB Four SATA 3.0 ports for high‑throughput storage connectivity plus 2 × USB 3.0 ports and 2 × USB PHYs for peripheral expansion.
  • Additional Interfaces CANbus support and other peripheral interfaces to simplify integration into industrial and automotive adjacent systems.
  • Security Secure Boot and Arm TrustZone® technologies included to help establish a secure platform foundation.
  • Package & Mounting 1517‑FCPBGA (40 × 40) package, surface mount, suitable for compact, high‑density board designs.
  • Qualification & Temperature Industrial qualification with an operating temperature range of −40 °C to 105 °C for robust field operation.
  • Compliance RoHS‑compliant to meet environmental and assembly requirements.
  • Graphics Acceleration Graphics acceleration capability to assist graphics or display‑related tasks where required.

Typical Applications

  • Network Equipment — Control‑plane and data‑plane processing in routers, switches and white box networking where dual 100 Gbps Ethernet and multi‑core compute are required.
  • Edge and Data Center Offload — Offload engines and appliance controllers that benefit from high throughput I/O, DDR4 memory bandwidth and multiple storage interfaces.
  • 5G Infrastructure — Packet processing and control functions in 5G radio/network elements leveraging high bandwidth interfaces and secure boot capabilities.
  • Industrial Systems — Industrial controllers and connectivity hubs requiring CANbus, SATA, USB and an extended −40 °C to 105 °C operating range.
  • Autonomous and Embedded Platforms — Compute nodes for sensor aggregation, connectivity and local processing in embedded architectures.

Unique Advantages

  • Multi‑Core ARM Performance: Eight 64‑bit Cortex‑A72 cores at 1.8 GHz deliver scalable processing for parallel workloads.
  • High‑Bandwidth Networking: Dual 100 Gbps Ethernet interfaces enable deployment in high‑throughput networking and edge systems.
  • Comprehensive I/O Suite: Multiple SATA 3.0 ports, USB 3.0, CANbus and DDR4 support reduce external bridge requirements and simplify system design.
  • Industrial Reliability: Industrial qualification and a −40 °C to 105 °C operating range support demanding field environments.
  • Platform Security: Secure Boot and Arm TrustZone® provide hardware‑anchored security primitives to protect system integrity.
  • Compact BGA Package: 1517‑FCPBGA (40 × 40) provides a space‑efficient footprint for dense board layouts.

Why Choose LX2080XN71826B?

The LX2080XN71826B balances multi‑core processing capability with a broad set of high‑speed I/O and industrial‑grade reliability, making it well suited for embedded networking, edge compute and industrial control applications. Its combination of ARM® Cortex®‑A72 cores, DDR4 memory support, dual 100 Gbps Ethernet and robust security features helps designers build scalable, secure and compact systems.

As part of the NXP Layerscape LX2080X series, this device is targeted at customers who need long‑term platform stability, tightly integrated I/O and the temperature and qualification characteristics required for deployment in industrial and high‑availability environments.

Request a quote or submit a pricing request for LX2080XN71826B to get availability, lead time and pricing for your next design.

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