LX2080XE72029B

IC MPU QORLQ LX2 2GHZ 1517FCPBGA
Part Description

ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 8 Core, 64-Bit 2GHz 1517-FCPBGA (40x40)

Quantity 213 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLX2080X
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A72Device Package1517-FCPBGA (40x40)ECCNN/A
Ethernet100Gbps (2)Graphics AccelerationYesHTS CodeN/A
Moisture Sensitivity LevelN/AMounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width8 Core, 64-BitOperating Temperature-40°C ~ 105°C (TJ)Package / Case1517-BBGA, FCBGA
RAM ControllersDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3.0 (4)Security FeaturesSecure Boot, TrustZone®Speed2GHz
Supplier Device Package1517-FCPBGA (40×40)USBUSB 3.0 (2) + PHY (2)Voltage – I/O1.2V, 1.8V, 3.3V

Overview of LX2080XE72029B – IC MPU QORLQ LX2 2GHZ 1517FCPBGA

The LX2080XE72029B is an NXP Layerscape LX2080A-series microprocessor IC featuring an ARM® Cortex®-A72 64-bit core cluster with eight cores running at 2 GHz. Designed for embedded and networking applications, this industrial-qualified device delivers multi-core compute, broad high-speed I/O and built-in security primitives for demanding edge and control-plane tasks.

With integrated DDR4 memory controllers, dual 100 Gbps Ethernet capability, multiple high-speed peripheral interfaces and industrial temperature range, the LX2080XE72029B is targeted at compute‑intensive networking, edge processing and industrial embedded designs that require performance, integration and long-term platform scalability.

Key Features

  • Core & Performance ARM® Cortex®-A72 architecture, 8 cores, 64-bit, up to 2 GHz clock rate for multi-threaded embedded processing.
  • Memory DDR4 memory controller support for high-bandwidth system memory. (Datasheet family details reference dual-channel DDR4 with ECC capability and support for high-speed DDR4 operation.)
  • High-speed Networking Dual 100 Gbps Ethernet ports to support high-throughput network and data-plane workloads.
  • Storage and USB Four SATA 3.0 ports for storage connectivity and two USB 3.0 ports plus two USB PHY interfaces for peripheral expansion.
  • Peripheral Interfaces CANbus support and additional common interfaces suitable for embedded control and communication tasks.
  • Security Hardware-supported Secure Boot and Arm TrustZone® for system integrity and runtime isolation.
  • Package & Mounting 1517-FCPBGA (40 × 40 mm) package, surface-mount construction for board-level integration.
  • Temperature & Qualification Industrial qualification with operating temperature range of −40 °C to 105 °C for harsh-environment deployments.
  • Compliance RoHS compliant for regulatory alignment in standard electronics manufacturing.

Typical Applications

  • Network Infrastructure — Control-plane and data-plane processing in routers, switches and white‑box networking equipment requiring multi‑core compute and dual 100 Gbps interfaces.
  • Edge and Cloud Offload — Edge compute and data‑center offload functions that benefit from high-speed Ethernet and integrated memory controllers.
  • 5G and Telecom — Packet processing and control functions in 5G network elements where secure boot and high throughput are required.
  • Industrial Control & Automation — Embedded controllers and gateways operating across an extended temperature range with CANbus and multiple I/O options.
  • Autonomous Systems — Compute hub and connectivity aggregation for systems that require mixed I/O, storage and secure runtime environments.

Unique Advantages

  • Multi-core 64-bit compute: Eight ARM® Cortex®-A72 cores running at 2 GHz provide sustained multi-threaded processing for embedded networking and control tasks.
  • High-throughput I/O: Dual 100 Gbps Ethernet plus multiple SATA and USB 3.0 ports simplify high-performance connectivity and storage integration.
  • Built‑in platform security: Secure Boot and Arm TrustZone® support help establish root-of-trust and runtime isolation for sensitive workloads.
  • Industrial-ready: Industrial qualification and −40 °C to 105 °C operating range enable deployment in harsh or temperature-variable environments.
  • Compact BGA package: 1517-FCPBGA (40 × 40 mm) package supports dense board layouts while providing the high pin count needed for rich I/O.
  • Family scalability: Part of the Layerscape LX2 family, enabling design scalability across pin‑compatible members with different core counts in the same family.

Why Choose LX2080XE72029B?

The LX2080XE72029B combines an ARM® Cortex®-A72 multi-core architecture with industrial qualification and advanced I/O to deliver a balanced platform for embedded networking, edge compute and industrial control. Its mix of high-speed Ethernet, storage and peripheral interfaces—together with Secure Boot and TrustZone®—makes it suitable for systems that require performance, integration and baseline platform security.

Engineers and system designers seeking a scalable Layerscape solution can leverage the LX2080XE72029B for compact, high-throughput designs that require long-term availability, rugged operating range and a broad peripheral set for complex embedded applications.

Request a quote or submit an inquiry to receive pricing, availability and technical support information for LX2080XE72029B.

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