LX2080XE72232B
| Part Description |
ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 8 Core, 64-Bit 2.2GHz 1517-FCPBGA (40x40) |
|---|---|
| Quantity | 423 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | LX2080X |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A72 | Device Package | 1517-FCPBGA (40x40) | ECCN | N/A | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 100Gbps (2) | Graphics Acceleration | Yes | HTS Code | N/A | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 8 Core, 64-Bit | Operating Temperature | -40°C ~ 105°C (TJ) | Package / Case | 1517-BBGA, FCBGA | ||
| RAM Controllers | DDR4 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| SATA | SATA 3.0 (4) | Security Features | Secure Boot, TrustZone® | Speed | 2.2GHz | ||
| Supplier Device Package | 1517-FCPBGA (40×40) | USB | USB 3.0 (2) + PHY (2) | Voltage – I/O | 1.2V, 1.8V, 3.3V |
Overview of LX2080XE72232B – IC MPU QORLQ 2.2GHz 8‑Core, 1517‑FCPBGA
The LX2080XE72232B is an NXP Semiconductors Layerscape LX2080X series microprocessor IC featuring an ARM® Cortex®-A72 core architecture. It provides eight 64-bit cores running at up to 2.2 GHz and is targeted at compute‑intensive embedded and networking applications that require high throughput and on‑board integration.
Designed with industrial qualification and a wide operating temperature range, the device combines multi‑core processing, DDR4 memory support and extensive high‑speed I/O to address networking, edge compute and industrial control designs while offering on‑chip security features for system integrity.
Key Features
- Core & Performance Eight ARM® Cortex®-A72 64‑bit cores running up to 2.2 GHz for multi‑threaded application processing and packet handling.
- Memory Integrated DDR4 memory controllers to support high‑speed external memory interfaces (DDR4).
- High‑Speed Networking Dual 100 Gbps Ethernet ports (2 × 100Gbps) suitable for high‑bandwidth network and edge processing tasks.
- Storage & USB Four SATA 3.0 ports for storage connectivity and two USB 3.0 ports plus two USB PHYs for peripheral and high‑speed I/O.
- Security Secure Boot and Arm TrustZone® provide hardware‑rooted security domains for trusted execution and secure boot chains.
- Additional Interfaces CANbus support and graphics acceleration expand connectivity and multimedia offload options for embedded systems.
- Package & Mounting 1517‑FCPBGA (40 × 40 mm) surface‑mount package for high‑density board designs.
- Environmental & Qualification Industrial qualification with an operating temperature range of −40 °C to 105 °C and RoHS compliance for deployment in rugged environments.
Typical Applications
- Networking & Edge Computing Multi‑core processing and dual 100 Gbps Ethernet enable control and data‑plane functions in switches, routers and edge appliances.
- Telecom & 5G Infrastructure High throughput and multiple high‑speed interfaces make the device suitable for packet processing and control functions in telecom equipment.
- Industrial Control & Automation Industrial temperature range, CANbus and secure boot support embedded controllers and industrial gateways requiring robust operation.
- Storage & RAID Controllers Four SATA 3.0 ports and USB 3.0 connectivity support high‑performance storage subsystems and appliance integration.
Unique Advantages
- High multi‑core compute: Eight ARM® Cortex®-A72 cores at up to 2.2 GHz deliver parallel processing capacity for demanding embedded workloads.
- Extensive high‑speed I/O: Dual 100 Gbps Ethernet, multiple SATA and USB 3.0 interfaces reduce the need for external bridging components.
- Built‑in security: Secure Boot and TrustZone® enable hardware‑assisted platform security for trusted execution and secure system initialization.
- Industrial readiness: Qualification and a −40 °C to 105 °C operating range support deployment in rugged and industrial environments.
- Compact high‑density package: 1517‑FCPBGA (40×40) surface‑mount footprint facilitates dense board layouts for space‑constrained systems.
- System connectivity breadth: CANbus and graphics acceleration broaden application scope from control networks to multimedia‑assisted embedded functions.
Why Choose LX2080XE72232B?
The LX2080XE72232B combines multi‑core ARM® Cortex®-A72 performance with a wide set of high‑speed interfaces and integrated security features, making it a strong candidate for networking, telecom edge, industrial and storage‑oriented embedded systems. Its industrial qualification and extended temperature range support reliable operation in demanding environments.
As a member of the LX2080X series from NXP Semiconductors, the device offers a balance of compute, I/O integration and security for teams looking to consolidate functionality, simplify BOM and accelerate time to market for complex embedded platforms.
Request a quote or submit a pricing and availability inquiry to evaluate how the LX2080XE72232B can meet your next embedded or networking design requirement.

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