LX2080XC72029B

IC MPU QORLQ LX2 2GHZ 1517FCPBGA
Part Description

ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 8 Core, 64-Bit 2GHz 1517-FCPBGA (40x40)

Quantity 613 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLX2080X
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A72Device Package1517-FCPBGA (40x40)ECCNN/A
Ethernet100Gbps (2)Graphics AccelerationYesHTS CodeN/A
Moisture Sensitivity LevelN/AMounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width8 Core, 64-BitOperating Temperature-40°C ~ 105°C (TJ)Package / Case1517-BBGA, FCBGA
RAM ControllersDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3.0 (4)Security FeaturesSecure Boot, TrustZone®Speed2GHz
Supplier Device Package1517-FCPBGA (40×40)USBUSB 3.0 (2) + PHY (2)Voltage – I/O1.2V, 1.8V, 3.3V

Overview of LX2080XC72029B – IC MPU QORLQ LX2 2GHZ 1517FCPBGA

The LX2080XC72029B is an NXP Layerscape LX2080X series microprocessor featuring an ARM® Cortex®-A72, 8-core 64-bit architecture running at 2 GHz. Designed for embedded and compute-intensive networking and industrial edge applications, this device combines multi-core processing with high-speed I/O and security features for robust, deterministic system designs.

With industrial qualification and an extended operating range, the LX2080XC72029B delivers the processing, connectivity, and reliability required for network control, data plane processing, industrial automation, and other embedded systems.

Key Features

  • Processor Core  ARM® Cortex®-A72 architecture, 8 cores, 64-bit, up to 2 GHz for multi-threaded compute and control tasks.
  • Memory  DDR4 memory controller support for high-throughput system memory configurations.
  • High-Speed Ethernet  Two 100 Gbps Ethernet interfaces to support high-bandwidth networking and packet processing applications.
  • Storage Interfaces  Four SATA 3.0 ports for multiple high-speed storage connections or RAID-capable subsystems.
  • USB Connectivity  Two USB 3.0 ports plus two PHY interfaces for high-speed peripheral connectivity.
  • Security  Secure Boot and Arm TrustZone® technologies for hardware-assisted platform integrity and trusted execution.
  • Additional Interfaces  Integrated CANbus for vehicle or industrial field-bus connectivity.
  • Graphics Acceleration  On-chip graphics acceleration to support user interfaces or hardware-accelerated display tasks.
  • Package & Mounting  1517-FCPBGA package (40×40 mm), surface-mount for compact board integration.
  • Qualification & Temperature  Industrial qualification with an operating temperature range of −40 °C to 105 °C for demanding environments.
  • Compliance  RoHS compliant.

Typical Applications

  • Networking & Edge Appliances  Use as a control or packet-processing engine in edge routers, switches, and network appliances where multi-core compute and high-speed Ethernet are required.
  • Industrial Automation  Embedded control, gateway, and protocol-conversion applications leveraging industrial qualification and CANbus connectivity.
  • Data Plane Acceleration  High-throughput storage and I/O consolidation in systems that require multiple SATA ports and USB 3.0 connectivity.
  • Telecommunications & 5G Infrastructure  Edge compute and control plane roles in telecom equipment benefiting from multi-core processing and secure boot functionality.
  • Human-Machine Interfaces  Systems requiring graphics acceleration for displays and local user interfaces.

Unique Advantages

  • Multi-core 64-bit Performance: 8 Cortex‑A72 cores at 2 GHz provide the compute headroom needed for parallel processing and real-time tasks.
  • High-bandwidth Connectivity: Dual 100 Gbps Ethernet and multiple high-speed I/O options minimize bottlenecks for networking and data-intensive applications.
  • Comprehensive Storage & Peripheral Support: Four SATA 3.0 ports plus USB 3.0 and PHY interfaces simplify integration of storage and peripherals.
  • Industrial-grade Reliability: Industrial qualification and −40 °C to 105 °C operation support deployment in harsh and wide-temperature environments.
  • Built-in Platform Security: Secure Boot and TrustZone® enable hardware-rooted trust and partitioning for secure system designs.
  • Compact BGA Package: 1517-FCPBGA (40×40) allows dense board layouts while supporting the I/O integration required by embedded systems.

Why Choose LX2080XC72029B?

The LX2080XC72029B positions itself as a high-performance, highly integrated embedded processor for applications that demand multi-core compute, extensive I/O, and industrial reliability. Its ARM® Cortex®-A72 cores, industrial temperature rating, and comprehensive connectivity make it well suited for networking, edge compute, industrial control, and telecom equipment designs.

Engineers and system designers will find this device valuable for projects requiring scalable compute, secure boot capability, and a compact BGA package that simplifies board-level integration while supporting robust field operation.

Request a quote or submit an inquiry to receive pricing, availability, and lead‑time information for the LX2080XC72029B.

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