LX2080XE71826B
| Part Description |
ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 8 Core, 64-Bit 1.8GHz 1517-FCPBGA (40x40) |
|---|---|
| Quantity | 795 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | LX2080X |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A72 | Device Package | 1517-FCPBGA (40x40) | ECCN | N/A | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 100Gbps (2) | Graphics Acceleration | Yes | HTS Code | N/A | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 8 Core, 64-Bit | Operating Temperature | -40°C ~ 105°C (TJ) | Package / Case | 1517-BBGA, FCBGA | ||
| RAM Controllers | DDR4 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| SATA | SATA 3.0 (4) | Security Features | Secure Boot, TrustZone® | Speed | 1.8GHz | ||
| Supplier Device Package | 1517-FCPBGA (40×40) | USB | USB 3.0 (2) + PHY (2) | Voltage – I/O | 1.2V, 1.8V, 3.3V |
Overview of LX2080XE71826B – IC MPU QORLQ 1.8GHZ 1517FCPBGA
The LX2080XE71826B is an NXP Semiconductors Layerscape microprocessor IC based on the ARM® Cortex®‑A72 architecture. This device implements an 8‑core, 64‑bit processor running at 1.8 GHz and is targeted at compute‑intensive embedded networking and industrial edge applications.
With integrated high‑speed I/O, DDR4 memory controllers and hardware security features, the LX2080XE71826B delivers a compact, industrial‑qualified building block for networking, data‑plane offload, 5G infrastructure and industrial control systems where performance, integration and temperature robustness are required.
Key Features
- Core and Performance
ARM® Cortex®‑A72 64‑bit CPU architecture with an 8‑core configuration at 1.8 GHz, providing multi‑threaded compute capacity for embedded networking and edge workloads. - Memory
Integrated DDR4 memory controllers to support high‑bandwidth system memory for packet processing and application workloads. - High‑Speed Networking
Two 100 Gbit/s Ethernet interfaces to support demanding network throughput and modern data‑plane requirements. - Storage and USB
Four SATA 3.0 ports for storage and up to two USB 3.0 ports plus two USB PHYs for peripheral and host connectivity. - Peripheral Interfaces
Additional interfaces include CANbus for industrial control networks and other common serial interfaces. - Security
Secure Boot and Arm TrustZone® support to enable a hardware‑rooted security model for trusted system boot and trusted execution environments. - Graphics Acceleration
On‑chip graphics acceleration to support display and graphics offload where required by the application. - Package and Mounting
1517‑FCPBGA (40×40) FCBGA package, designed for surface‑mount assembly to minimize board footprint. - Industrial Qualification & Temperature Range
Industrial qualification with an operating range from ‑40 °C to 105 °C for deployment in extended‑temperature environments. - Compliance
RoHS compliant construction to meet lead‑free regulatory requirements.
Typical Applications
- Networking & Communications
Control and data‑plane processing in network appliances and white‑box switching where multi‑core processing and 100 Gbit/s Ethernet connectivity are needed. - Data Center Offload
Platform for host offload and appliance designs that require high throughput, multiple storage and PCIe/USB interfaces for accelerators and peripherals. - 5G Infrastructure
Packet processing and control plane functions in 5G packet processing and baseband offload deployments. - Industrial Edge
Edge compute and gateway systems that require industrial temperature operation, CANbus connectivity and hardware security for trusted deployments.
Unique Advantages
- Scalable Multi‑Core Processing: Eight Cortex‑A72 cores at 1.8 GHz provide balanced multi‑threaded performance for embedded and networking workloads.
- Integrated High‑Speed I/O: Native support for dual 100 Gbit/s Ethernet, SATA 3.0 and USB 3.0 reduces external chip count and simplifies board design.
- Industrial‑Grade Reliability: Qualified for industrial use with an operating temperature range of ‑40 °C to 105 °C to support harsh environments.
- Hardware Security Foundation: Secure Boot and TrustZone® enable a secure platform for trusted boot and partitioned execution.
- Compact, Surface‑Mount Package: 1517‑FCPBGA (40×40) packaging enables dense system integration and footprint reduction.
- Regulatory Compliance: RoHS compliant to support modern regulatory and manufacturing requirements.
Why Choose LX2080XE71826B?
The LX2080XE71826B delivers a compact, industrially qualified platform that combines multi‑core Cortex‑A72 processing, DDR4 memory support and high‑speed I/O to address demanding embedded networking, edge compute and 5G infrastructure designs. Its integrated security features and broad peripheral set simplify system architecture while maintaining the performance needed for packet processing and control‑plane tasks.
This device is well suited to designers seeking a robust, scalable Layerscape‑based solution from NXP with the connectivity and thermal range required for long‑lifecycle industrial deployments, along with software ecosystem support for embedded Linux and development tools.
Request a quote or submit a sales inquiry to discuss pricing, availability and design‑in support for the LX2080XE71826B. Our team can provide technical details and help with procurement and project planning.

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Headquarters: Eindhoven, North Brabant, Netherlands
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