LX2080XE71826B

IC MPU QORLQ 1.8GHZ 1517FCPBGA
Part Description

ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 8 Core, 64-Bit 1.8GHz 1517-FCPBGA (40x40)

Quantity 795 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLX2080X
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A72Device Package1517-FCPBGA (40x40)ECCNN/A
Ethernet100Gbps (2)Graphics AccelerationYesHTS CodeN/A
Moisture Sensitivity LevelN/AMounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width8 Core, 64-BitOperating Temperature-40°C ~ 105°C (TJ)Package / Case1517-BBGA, FCBGA
RAM ControllersDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3.0 (4)Security FeaturesSecure Boot, TrustZone®Speed1.8GHz
Supplier Device Package1517-FCPBGA (40×40)USBUSB 3.0 (2) + PHY (2)Voltage – I/O1.2V, 1.8V, 3.3V

Overview of LX2080XE71826B – IC MPU QORLQ 1.8GHZ 1517FCPBGA

The LX2080XE71826B is an NXP Semiconductors Layerscape microprocessor IC based on the ARM® Cortex®‑A72 architecture. This device implements an 8‑core, 64‑bit processor running at 1.8 GHz and is targeted at compute‑intensive embedded networking and industrial edge applications.

With integrated high‑speed I/O, DDR4 memory controllers and hardware security features, the LX2080XE71826B delivers a compact, industrial‑qualified building block for networking, data‑plane offload, 5G infrastructure and industrial control systems where performance, integration and temperature robustness are required.

Key Features

  • Core and Performance 
    ARM® Cortex®‑A72 64‑bit CPU architecture with an 8‑core configuration at 1.8 GHz, providing multi‑threaded compute capacity for embedded networking and edge workloads.
  • Memory 
    Integrated DDR4 memory controllers to support high‑bandwidth system memory for packet processing and application workloads.
  • High‑Speed Networking 
    Two 100 Gbit/s Ethernet interfaces to support demanding network throughput and modern data‑plane requirements.
  • Storage and USB 
    Four SATA 3.0 ports for storage and up to two USB 3.0 ports plus two USB PHYs for peripheral and host connectivity.
  • Peripheral Interfaces 
    Additional interfaces include CANbus for industrial control networks and other common serial interfaces.
  • Security 
    Secure Boot and Arm TrustZone® support to enable a hardware‑rooted security model for trusted system boot and trusted execution environments.
  • Graphics Acceleration 
    On‑chip graphics acceleration to support display and graphics offload where required by the application.
  • Package and Mounting 
    1517‑FCPBGA (40×40) FCBGA package, designed for surface‑mount assembly to minimize board footprint.
  • Industrial Qualification & Temperature Range 
    Industrial qualification with an operating range from ‑40 °C to 105 °C for deployment in extended‑temperature environments.
  • Compliance 
    RoHS compliant construction to meet lead‑free regulatory requirements.

Typical Applications

  • Networking & Communications 
    Control and data‑plane processing in network appliances and white‑box switching where multi‑core processing and 100 Gbit/s Ethernet connectivity are needed.
  • Data Center Offload 
    Platform for host offload and appliance designs that require high throughput, multiple storage and PCIe/USB interfaces for accelerators and peripherals.
  • 5G Infrastructure 
    Packet processing and control plane functions in 5G packet processing and baseband offload deployments.
  • Industrial Edge 
    Edge compute and gateway systems that require industrial temperature operation, CANbus connectivity and hardware security for trusted deployments.

Unique Advantages

  • Scalable Multi‑Core Processing: Eight Cortex‑A72 cores at 1.8 GHz provide balanced multi‑threaded performance for embedded and networking workloads.
  • Integrated High‑Speed I/O: Native support for dual 100 Gbit/s Ethernet, SATA 3.0 and USB 3.0 reduces external chip count and simplifies board design.
  • Industrial‑Grade Reliability: Qualified for industrial use with an operating temperature range of ‑40 °C to 105 °C to support harsh environments.
  • Hardware Security Foundation: Secure Boot and TrustZone® enable a secure platform for trusted boot and partitioned execution.
  • Compact, Surface‑Mount Package: 1517‑FCPBGA (40×40) packaging enables dense system integration and footprint reduction.
  • Regulatory Compliance: RoHS compliant to support modern regulatory and manufacturing requirements.

Why Choose LX2080XE71826B?

The LX2080XE71826B delivers a compact, industrially qualified platform that combines multi‑core Cortex‑A72 processing, DDR4 memory support and high‑speed I/O to address demanding embedded networking, edge compute and 5G infrastructure designs. Its integrated security features and broad peripheral set simplify system architecture while maintaining the performance needed for packet processing and control‑plane tasks.

This device is well suited to designers seeking a robust, scalable Layerscape‑based solution from NXP with the connectivity and thermal range required for long‑lifecycle industrial deployments, along with software ecosystem support for embedded Linux and development tools.

Request a quote or submit a sales inquiry to discuss pricing, availability and design‑in support for the LX2080XE71826B. Our team can provide technical details and help with procurement and project planning.

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