LX2080XC71826B

IC MPU QORLQ 1.8GHZ 1517FCPBGA
Part Description

ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 8 Core, 64-Bit 1.8GHz 1517-FCPBGA (40x40)

Quantity 568 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLX2080X
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A72Device Package1517-FCPBGA (40x40)ECCNN/A
Ethernet100Gbps (2)Graphics AccelerationYesHTS CodeN/A
Moisture Sensitivity LevelN/AMounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width8 Core, 64-BitOperating Temperature-40°C ~ 105°C (TJ)Package / Case1517-BBGA, FCBGA
RAM ControllersDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3.0 (4)Security FeaturesSecure Boot, TrustZone®Speed1.8GHz
Supplier Device Package1517-FCPBGA (40×40)USBUSB 3.0 (2) + PHY (2)Voltage – I/O1.2V, 1.8V, 3.3V

Overview of LX2080XC71826B – IC MPU QORLQ 1.8GHZ 1517FCPBGA

The LX2080XC71826B is an NXP Layerscape QorIQ microprocessor featuring an ARM® Cortex®-A72 architecture configured as an 8-core, 64-bit MPU running at 1.8 GHz. Designed for embedded and industrial systems, it integrates high-speed I/O, multiple storage and peripheral interfaces, and hardware security features to address compute- and connectivity‑intensive applications.

With industrial qualification and broad I/O—dual 100 Gbit/s Ethernet, SATA 3.0, USB 3.0, CANbus and DDR4 memory controllers—the device targets edge networking, industrial control, and embedded compute platforms that require performance, integration and extended temperature operation.

Key Features

  • ARM® Cortex®-A72 CPU — Eight 64-bit Cortex-A72 cores running at 1.8 GHz for multi-threaded embedded compute and control tasks.
  • Memory — Integrated DDR4 memory controller support for high-bandwidth system memory.
  • High‑speed Ethernet — Two 100 Gbit/s Ethernet interfaces for high-throughput networking and data forwarding.
  • Storage and USB — Four SATA 3.0 ports and two USB 3.0 ports plus PHY support to serve storage and peripheral connectivity needs.
  • Peripheral and vehicle interfaces — CANbus support for robust control and management connectivity in industrial or control networks.
  • Security — Secure Boot and Arm TrustZone® to provide hardware-backed platform integrity and trusted execution domains.
  • Graphics acceleration — On-chip graphics acceleration to offload basic display and UI tasks from the CPU cores.
  • Industrial qualification & temperature range — Industrial qualification with operating temperature from −40 °C to 105 °C for harsh-environment deployment.
  • Package & mounting — 1517‑FCPBGA (40 × 40 mm) FCBGA package, surface mount for compact board integration.
  • Compliance — RoHS compliant for environmental and regulatory requirements.

Typical Applications

  • Edge and telecom networking: Dual 100 Gbit/s Ethernet and high‑performance CPU cores enable control-plane and data-plane tasks in edge routers, switches and network appliances.
  • Industrial control systems: Industrial qualification, CANbus and wide temperature range support real‑time control, gateways and automation controllers.
  • Storage and server offload: SATA 3.0 ports and high-throughput interfaces suit NAS, storage controllers and data‑offload modules.
  • Embedded compute and HMI: Graphics acceleration combined with multicore CPU resources supports human‑machine interfaces, protocol processing and device management.

Unique Advantages

  • Balanced multi-core performance: Eight 64-bit Cortex‑A72 cores at 1.8 GHz provide a blend of single-thread responsiveness and multi-thread throughput for embedded workloads.
  • High I/O integration: Dual 100 Gbit/s Ethernet, SATA and USB reduce external controller requirements and simplify board design.
  • Industrial readiness: Industrial qualification and −40 °C to 105 °C operating range enable reliable deployment in demanding environments.
  • Hardware security primitives: Secure Boot and TrustZone® support platform integrity and secure software partitioning without additional external security modules.
  • Compact packaging: 1517‑FCPBGA (40×40) FCBGA surface-mount package provides a high-density solution for space-constrained systems.
  • Standards and compliance: RoHS compliance streamlines regulatory acceptance and simplifies sourcing for commercial production.

Why Choose LX2080XC71826B?

The LX2080XC71826B positions itself as a high‑integration, industrial‑grade embedded processor that brings multi-core ARM® Cortex®‑A72 performance together with extensive I/O and security features. It is suited to designers building edge networking devices, industrial controllers, storage appliances, and embedded systems that require a combination of compute density, connectivity and environmental robustness.

Backed by NXP Layerscape ecosystem support and a feature set tailored to connectivity and secure embedded applications, the LX2080XC71826B delivers a scalable platform for designs that need long‑lifecycle availability, integrated peripherals and industrial operating range.

Request a quote or submit an inquiry to obtain pricing, lead times and technical support for LX2080XC71826B. Our team can assist with procurement, lifecycle information and integration considerations.

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