LX2120CC72232B

LAYERSCAPE 64-BIT ARM CORTEX-A72
Part Description

Microprocessor IC - 1517-FCPBGA (40x40)

Quantity 384 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLX2120C
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A72Device Package1517-FCPBGA (40x40)ECCNN/A
Ethernet100G, 10G, 1GGraphics AccelerationYesHTS CodeN/A
Moisture Sensitivity LevelN/AMounting MethodSurface MountNumber of Cores/Bus Width12 Core, 64-Bit
Operating Temperature-40 °C – 105 °CPackage / Case1517-BBGA, FCBGAQualificationAutomotive
RAM ControllersDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3.0 (4)Speed2.2 GHzUSBUSB 3.0 (2) + PHY (2)
Voltage – I/O1.2 V – 3.3 V

Overview of LX2120CC72232B – LAYERSCAPE 64-BIT ARM CORTEX-A72

The LX2120CC72232B is a high-performance Layerscape microprocessor based on the 64-bit ARM® Cortex®-A72 architecture. With a 12-core implementation running up to 2.2 GHz and DDR4 memory controllers, it is designed for compute-intensive embedded networking and edge applications.

Targeted use cases include networking, data center offload, 5G packet processing, industrial edge compute and autonomous systems. The device emphasizes high integration, multi‑core processing, hardware security acceleration and broad I/O to enable compact, high-throughput designs.

Key Features

  • Core & Performance  12 × ARM® Cortex®‑A72 64‑bit cores, up to 2.2 GHz for multi‑threaded packet and control-plane workloads.
  • Memory Subsystem  DDR4 memory controllers for high-bandwidth system memory support.
  • Ethernet & Networking  Supports 100G, 10G and 1G Ethernet speeds; architecture and datasheet series detail high-throughput Layer‑2 switching and wire‑rate I/O processing.
  • Security & Acceleration  Integrated security features and hardware acceleration (datasheet series describes multi‑Gb/s security and compression offload engines) to offload compute and protect data flows.
  • Storage & USB  Four SATA 3.0 ports and two USB 3.0 ports plus PHYs for high‑performance storage and peripheral connectivity.
  • Additional Interfaces  CANbus support and a broad set of system interfaces for flexible integration into embedded platforms.
  • Graphics & Offload  Graphics acceleration capability is listed for display or GPU‑assisted tasks.
  • Package & Mounting  1517‑FCPBGA (40×40) FCBGA supplier device package, surface‑mount construction for board‑level integration.
  • Operating Range & Compliance  Industrial operating temperature range of −40 °C to 105 °C and RoHS compliance.

Typical Applications

  • High‑Performance Networking  Control and data plane processing for switches and routers requiring multi‑core packet handling and high-speed Ethernet.
  • Data Center Offload  Offloading security, compression and network functions in NICs and appliance designs to reduce host CPU load.
  • 5G Packet Processing  Packet and control‑plane processing in 5G infrastructure such as CU/DU functions and C‑RAN elements.
  • Industrial & Edge Compute  Edge gateways, protocol conversion and real‑time data aggregation where robust temperature range and broad I/O are required.
  • Autonomous Systems  Central connectivity and sensor data management in architectures that require multi‑core compute and hardware acceleration.

Unique Advantages

  • Highly integrated multi‑core platform: Multiple Cortex‑A72 cores and on‑chip accelerators reduce external component count and simplify system design.
  • Broad high‑speed connectivity: Native support for 100G/10G/1G Ethernet plus SATA and USB 3.0 enables flexible, high‑bandwidth I/O architectures.
  • Hardware security and compression offload: Dedicated accelerators enable high throughput without tying up general‑purpose cores.
  • Industrial operating range: −40 °C to 105 °C supports deployment in temperature‑challenging environments.
  • Compact BGA package: 1517‑FCPBGA (40×40) footprint supports dense board layouts while maintaining surface‑mount manufacturability.
  • Software ecosystem support: Datasheet series references Linux SDK and embedded development tools to accelerate bring‑up and software development.

Why Choose LX2120CC72232B?

The LX2120CC72232B combines a 12‑core ARM Cortex‑A72 processor subsystem with robust I/O, storage and security acceleration to address demanding embedded networking and edge compute applications. Its balance of multi‑core performance, integrated offloads and broad connectivity makes it suitable for designs that require consolidated compute and packet processing in a compact footprint.

Designed for engineers and system architects seeking a scalable platform, it benefits projects that need high throughput, on‑chip acceleration and a software ecosystem to shorten development cycles and reduce BOM complexity.

Request a quote or submit an inquiry to receive pricing, availability and support information for the LX2120CC72232B. Our team can provide technical details and help evaluate fit for your design.

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