LX2120CC72232B
| Part Description |
Microprocessor IC - 1517-FCPBGA (40x40) |
|---|---|
| Quantity | 384 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | LX2120C |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A72 | Device Package | 1517-FCPBGA (40x40) | ECCN | N/A | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 100G, 10G, 1G | Graphics Acceleration | Yes | HTS Code | N/A | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Number of Cores/Bus Width | 12 Core, 64-Bit | ||
| Operating Temperature | -40 °C – 105 °C | Package / Case | 1517-BBGA, FCBGA | Qualification | Automotive | ||
| RAM Controllers | DDR4 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| SATA | SATA 3.0 (4) | Speed | 2.2 GHz | USB | USB 3.0 (2) + PHY (2) | ||
| Voltage – I/O | 1.2 V – 3.3 V |
Overview of LX2120CC72232B – LAYERSCAPE 64-BIT ARM CORTEX-A72
The LX2120CC72232B is a high-performance Layerscape microprocessor based on the 64-bit ARM® Cortex®-A72 architecture. With a 12-core implementation running up to 2.2 GHz and DDR4 memory controllers, it is designed for compute-intensive embedded networking and edge applications.
Targeted use cases include networking, data center offload, 5G packet processing, industrial edge compute and autonomous systems. The device emphasizes high integration, multi‑core processing, hardware security acceleration and broad I/O to enable compact, high-throughput designs.
Key Features
- Core & Performance 12 × ARM® Cortex®‑A72 64‑bit cores, up to 2.2 GHz for multi‑threaded packet and control-plane workloads.
- Memory Subsystem DDR4 memory controllers for high-bandwidth system memory support.
- Ethernet & Networking Supports 100G, 10G and 1G Ethernet speeds; architecture and datasheet series detail high-throughput Layer‑2 switching and wire‑rate I/O processing.
- Security & Acceleration Integrated security features and hardware acceleration (datasheet series describes multi‑Gb/s security and compression offload engines) to offload compute and protect data flows.
- Storage & USB Four SATA 3.0 ports and two USB 3.0 ports plus PHYs for high‑performance storage and peripheral connectivity.
- Additional Interfaces CANbus support and a broad set of system interfaces for flexible integration into embedded platforms.
- Graphics & Offload Graphics acceleration capability is listed for display or GPU‑assisted tasks.
- Package & Mounting 1517‑FCPBGA (40×40) FCBGA supplier device package, surface‑mount construction for board‑level integration.
- Operating Range & Compliance Industrial operating temperature range of −40 °C to 105 °C and RoHS compliance.
Typical Applications
- High‑Performance Networking Control and data plane processing for switches and routers requiring multi‑core packet handling and high-speed Ethernet.
- Data Center Offload Offloading security, compression and network functions in NICs and appliance designs to reduce host CPU load.
- 5G Packet Processing Packet and control‑plane processing in 5G infrastructure such as CU/DU functions and C‑RAN elements.
- Industrial & Edge Compute Edge gateways, protocol conversion and real‑time data aggregation where robust temperature range and broad I/O are required.
- Autonomous Systems Central connectivity and sensor data management in architectures that require multi‑core compute and hardware acceleration.
Unique Advantages
- Highly integrated multi‑core platform: Multiple Cortex‑A72 cores and on‑chip accelerators reduce external component count and simplify system design.
- Broad high‑speed connectivity: Native support for 100G/10G/1G Ethernet plus SATA and USB 3.0 enables flexible, high‑bandwidth I/O architectures.
- Hardware security and compression offload: Dedicated accelerators enable high throughput without tying up general‑purpose cores.
- Industrial operating range: −40 °C to 105 °C supports deployment in temperature‑challenging environments.
- Compact BGA package: 1517‑FCPBGA (40×40) footprint supports dense board layouts while maintaining surface‑mount manufacturability.
- Software ecosystem support: Datasheet series references Linux SDK and embedded development tools to accelerate bring‑up and software development.
Why Choose LX2120CC72232B?
The LX2120CC72232B combines a 12‑core ARM Cortex‑A72 processor subsystem with robust I/O, storage and security acceleration to address demanding embedded networking and edge compute applications. Its balance of multi‑core performance, integrated offloads and broad connectivity makes it suitable for designs that require consolidated compute and packet processing in a compact footprint.
Designed for engineers and system architects seeking a scalable platform, it benefits projects that need high throughput, on‑chip acceleration and a software ecosystem to shorten development cycles and reduce BOM complexity.
Request a quote or submit an inquiry to receive pricing, availability and support information for the LX2120CC72232B. Our team can provide technical details and help evaluate fit for your design.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
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