LX2122RE82029B

The LX2122RE82029B is an NXP QorIQ Layerscape microprocessor featuring a 12-core, 64-bit ARM® Cortex®-A72 architecture running at 2 GHz. It is designed for embedded and compute-intensive networking applications that require multi-core performance, integrated I/O, and robust thermal range.

Typical market segments include networking and communications, data center offload, industrial systems, 5G infrastructure, and autonomous systems where high core counts and extensive peripheral integration reduce system complexity and board space.

Key Features

• CPU Core ARM® Cortex®-A72 cores, 12-core 64-bit configuration running at 2 GHz for parallel compute and control-plane workloads.
• Memory Interfaces Integrated DDR4 and SDRAM memory controller support for high-bandwidth system memory configurations.
• Storage and USB Four SATA 6 Gbps ports and one USB 3.0 port provide high-speed storage and peripheral connectivity.
• Additional I/O CANbus interface support for control and industrial communication networks.
• Package & Mounting 1150-FBGA (23 × 23 mm) supplier device package, surface-mount construction for compact board designs.
• Operating Range Rated for operation from 5 °C to 105 °C, suitable for elevated-temperature embedded environments.
• Compliance RoHS compliant material and manufacturing status.
• Graphics No graphics acceleration—optimized for compute, networking and control tasks rather than GPU workloads.

Typical Applications

• Networking & Communications Multi-core processing and integrated high-speed I/O make it suitable for control-plane and packet-processing functions in networking equipment.
• Data Center Offload High core density supports offload and acceleration tasks where multi-threaded processing and storage connectivity are required.
• 5G Infrastructure Core performance and I/O integration support virtualized and real-time network functions in 5G packet-processing elements.
• Industrial Systems CANbus support, robust temperature range, and surface-mount 1150-FBGA package suit industrial control and automation platforms.
• Autonomous & Edge Compute Multi-core architecture enables aggregation and preprocessing of sensor and network data at the edge.

Unique Advantages

• High Core Count for Parallel Workloads: 12 ARM Cortex-A72 cores at 2 GHz deliver scalable multi-threaded performance for control and data-plane tasks.
• Integrated High-Speed Storage I/O: Four SATA 6 Gbps ports and USB 3.0 simplify connectivity for storage and peripherals without external bridges.
• Flexible Memory Support: DDR4 and SDRAM controller support enables high-bandwidth memory configurations tailored to application demands.
• Compact, Surface-Mount Package: 1150-FBGA (23 × 23 mm) package reduces PCB footprint for dense embedded designs.
• Wide Operating Temperature: Rated 5 °C to 105 °C for reliable operation in elevated-temperature embedded environments.
• Standards Compliance: RoHS compliance supports regulatory and environmental requirements.

Why Choose LX2122RE82029B?

The LX2122RE82029B combines a 12-core ARM® Cortex®-A72 architecture with integrated memory controllers and multiple high-speed I/O options to deliver a balanced platform for embedded networking, edge compute, and industrial applications. Its 1150-FBGA package and surface-mount form factor enable compact system designs while the extended operating temperature range supports deployment in demanding environments.

This device is suited to engineers building multi-threaded control and data-plane systems that require on-board storage interfaces, CAN connectivity, and scalable CPU performance with RoHS-compliant manufacturing provenance.

Request a quote or submit an inquiry to get pricing and availability information for the LX2122RE82029B and to discuss integration details for your project.