LX2160SC71826B

IC MPU QORLQ 1.8GHZ 1517FCPBGA
Part Description

ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 16 Core, 64-Bit 1.8GHz 1517-FCPBGA (40x40)

Quantity 1,522 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLX2160S
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A72Device Package1517-FCPBGA (40x40)ECCN5A002A1 NXP
Ethernet100Gbps (2)Graphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity LevelN/AMounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width16 Core, 64-BitOperating Temperature0°C ~ 105°C (TJ)Package / Case1517-BBGA, FCBGA
RAM ControllersDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3.0 (4)Security FeaturesSecure Boot, TrustZone®Speed1.8GHz
Supplier Device Package1517-FCPBGA (40×40)USBUSB 3.0 (2) + PHY (2)Voltage – I/O1.2V, 1.8V, 3.3V

Overview of LX2160SC71826B – ARM Cortex‑A72 16‑Core 1.8 GHz MPU

The LX2160SC71826B is an NXP Semiconductors QorIQ microprocessor IC built on a 64‑bit ARM® Cortex®‑A72 architecture with sixteen cores running at 1.8 GHz. It combines high-density compute with extensive I/O integration to address compute‑intensive embedded networking and edge processing applications.

Designed for embedded and networking markets, this device delivers multi‑core performance, robust security features, and broad connectivity options—enabling solutions that require high data throughput, protocol offload, and integrated peripheral support.

Key Features

  • CPU & Architecture Sixteen 64‑bit ARM® Cortex®‑A72 cores operating at 1.8 GHz for parallel compute and control tasks.
  • Memory Subsystem DDR4 memory controllers with support for high‑speed DRAM. (Datasheet references dual DDR4 channels with ECC support and high transfer rates.)
  • On‑chip Cache & Packet Buffer Integrated cache and packet buffering reduce external memory dependency and lower latency for packet processing. (Series datasheet documents on‑chip caching and a packet cache buffer.)
  • High‑Speed Networking Dual 100 Gbit/s Ethernet ports and support for multiple Ethernet MACs to handle demanding network throughput and switching tasks.
  • Storage & Peripherals Four SATA 3.0 ports, two USB 3.0 ports plus PHYs, CANbus interfaces and PCIe Gen3 lanes for flexible peripheral and storage connectivity.
  • Security Secure Boot and Arm TrustZone® support to enable hardware‑rooted secure boot and trusted execution environments.
  • Acceleration Engines Built‑in acceleration for security and data compression/decompression (series datasheet lists dedicated offload engines), reducing host CPU load for heavy packet or crypto workloads.
  • Package & Mounting 1517‑FCPBGA (40×40) package, surface‑mount device suitable for compact board designs.
  • Operating Range & Compliance Operating temperature 0 °C to 105 °C and RoHS compliant; qualification status: Consumer.
  • Graphics & Additional Interfaces Graphics acceleration available and additional interfaces such as CANbus to support diverse embedded use cases.

Typical Applications

  • High‑performance Networking Control and data‑plane processing, white‑box switching and top‑of‑rack/east‑of‑rack switch controllers requiring multi‑port Ethernet and wire‑rate I/O.
  • Data Center Offload Network function offload, packet processing and acceleration tasks where integrated security and compression engines lower host CPU load.
  • 5G Packet Processing Packet and control plane processing for 5G infrastructure components that need high throughput and low latency connectivity.
  • Industrial & Edge Compute Edge gateways, industrial controllers and centralized connectivity hubs that benefit from multiple I/O, CANbus support, and broad temperature operation.

Unique Advantages

  • High Multi‑core Throughput: Sixteen Cortex‑A72 cores provide parallel processing headroom for complex networking and compute workloads.
  • Integrated High‑Speed I/O: Dual 100 Gbit/s Ethernet plus SATA, USB and PCIe options reduce the need for external bridges and simplify board design.
  • Security Built In: Secure Boot and TrustZone® support enable layered security models and trusted execution without external security controllers.
  • Acceleration for Heavy Workloads: On‑chip accelerators for security and compression lower overall system power and free CPU cycles for application logic.
  • Compact, RoHS‑Compliant Package: 1517‑FCPBGA (40×40) surface‑mount package supports compact system layouts while meeting RoHS requirements.
  • Designed for Embedded Networking: Feature set and I/O mix match common requirements for networking, edge compute, and industrial embedded designs.

Why Choose LX2160SC71826B?

The LX2160SC71826B combines a sixteen‑core ARM® Cortex®‑A72 compute cluster with integrated high‑speed networking, storage and peripheral interfaces to deliver a compact, highly integrated platform for embedded networking and edge processing designs. Its security features and on‑chip acceleration engines provide a balanced approach to performance and system-level efficiency.

This part is targeted at engineers and system designers who require multicore processing, robust I/O options and hardware security primitives in a single device, enabling reduced BOM complexity and streamlined board implementations.

Request a quote or submit an inquiry to receive pricing, availability and technical support for LX2160SC71826B and discuss how it fits your next embedded networking or edge compute design.

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