LX2160SE72029B
| Part Description |
ARM® Cortex®-A72 Microprocessor IC QorlQ LX2 16 Core, 64-Bit 2GHz 1517-FCPBGA (40x40) |
|---|---|
| Quantity | 1,247 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | LX2160S |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A72 | Device Package | 1517-FCPBGA (40x40) | ECCN | 5A002A1 NXP | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 100Gbps (2) | Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 16 Core, 64-Bit | Operating Temperature | 0°C ~ 105°C (TJ) | Package / Case | 1517-BBGA, FCBGA | ||
| RAM Controllers | DDR4 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| SATA | SATA 3.0 (4) | Security Features | Secure Boot, TrustZone® | Speed | 2GHz | ||
| Supplier Device Package | 1517-FCPBGA (40×40) | USB | USB 3.0 (2) + PHY (2) | Voltage – I/O | 1.2V, 1.8V, 3.3V |
Overview of LX2160SE72029B – IC MPU QORLQ LX2 2GHZ 1517FCPBGA
The LX2160SE72029B from NXP Semiconductors is a high-integration ARM® Cortex®-A72 based microprocessor IC featuring sixteen 64-bit cores running at 2 GHz in a 1517-FCPBGA (40x40) package. It is designed for compute‑intensive embedded networking and edge processing applications that demand multi‑core compute, abundant I/O and integrated acceleration.
Built for data‑plane and control‑plane workloads, the device combines high throughput Ethernet and SerDes, hardware security and compression engines, and large on‑chip packet caching to deliver low‑latency, space‑efficient designs for networking, data center offload, 5G and industrial applications.
Key Features
- Core and Architecture Sixteen ARM® Cortex®-A72 64‑bit CPU cores running at 2 GHz with an architecture targeted at high-performance embedded compute.
- On‑chip Cache Integrated cache to support high throughput packet and workload processing.
- Memory Subsystem Dual DDR4 controllers with support for ECC, enabling high-bandwidth external memory configurations.
- High‑Speed Networking and SerDes Dual 100 Gbit/s Ethernet capability (2×100 Gbps) with up to 16 Ethernet ports and 24 SerDes lanes operating up to 25 GHz for flexible high‑speed I/O.
- Layer‑2 Switching and Offload Integrated Layer‑2 switching performance and hardware offload engines for compression and security to accelerate networking workloads.
- PCIe and Expansion Up to 24 PCIe Gen3 lanes supporting multiple ports and wide link configurations for host and accelerator connectivity.
- Storage and USB Four SATA 3.0 ports and two USB 3.0 ports (plus two USB PHY) for storage and peripheral connectivity.
- Security Secure Boot and Arm TrustZone® support plus a 50 Gbit/s security accelerator for hardware‑assisted cryptography and packet security offload.
- Additional Interfaces CANbus support and a range of peripheral interfaces including SD, eMMC, DUART and I2C.
- Package and Reliability 1517‑BBGA FCBGA package (supplier device package: 1517‑FCPBGA (40x40)), surface mount; operating temperature range 0 °C to 105 °C; RoHS compliant.
- Software Ecosystem Supported by Layerscape software including Linux SDK and CodeWarrior embedded development tools for Armv8 64‑bit processors.
- Graphics Acceleration Includes graphics acceleration capability to support display or acceleration offload requirements.
Typical Applications
- Edge Networking and White‑Box Switching Use as a control‑plane or data‑plane processor in top‑of‑rack and edge switch platforms leveraging high‑speed Ethernet and integrated L2 switching.
- Data Center Offload Deploy for NIC host control, packet processing and compression/security offload with PCIe and multi‑GbE connectivity.
- 5G Packet Processing Suitable for C‑RAN, O‑RAN and distributed unit applications that require packet throughput, hardware security and compression acceleration.
- Industrial and Autonomous Systems Central compute hub for sensor and connectivity aggregation, leveraging multi‑core compute, CANbus and extensive I/O.
Unique Advantages
- High‑density Multi‑core Compute: Sixteen Cortex‑A72 cores provide parallel processing for multi‑threaded networking and edge compute workloads.
- Integrated Networking Engines: Dual 100 Gbit/s Ethernet capability, integrated L2 switching and SerDes reduce external components and board complexity.
- Hardware Acceleration: Built‑in security and compression accelerators offload CPU cores to increase throughput and lower system latency.
- Flexible I/O and Expansion: Rich mix of PCIe lanes, SATA, USB, CAN and multiple Ethernet port options enable versatile system architectures.
- Robust Software Support: Layerscape Linux SDK and CodeWarrior tool support accelerate development and deployment on Armv8 64‑bit platforms.
- Compact, Industry‑grade Package: 1517‑FCPBGA (40x40) surface‑mount package and wide operating temperature range support dense board designs.
Why Choose LX2160SE72029B?
The LX2160SE72029B positions itself as a highly integrated, multi‑core processor for demanding embedded networking and edge compute designs. With 16 Cortex‑A72 cores, hardware security and compression engines, extensive high‑speed I/O and robust software support, it addresses applications that require sustained packet throughput, on‑chip acceleration and flexible expansion.
This device is well suited for system designers targeting control‑plane and data‑plane processing, data center offload modules, 5G packet engines and complex industrial or autonomous system hubs where integration, throughput and development ecosystem support drive time‑to‑market and system efficiency.
Request a quote or submit an inquiry for LX2160SE72029B to receive pricing, availability and lead‑time information for your design planning and procurement.

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