LX2160SN72232B

The LX2160SN72232B is a high-performance Layerscape microprocessor featuring sixteen 64-bit Arm® Cortex®-A72 cores running up to 2.2 GHz. Designed for compute-intensive networking and edge-processing applications, it integrates high-throughput I/O, hardware accelerators and advanced security to enable compact, low-power systems.

With integrated DDR4 memory controllers, multi‑100 Gbit/s Ethernet capability and packet caching, this device targets networking control and data-plane, data-center offload, 5G packet processing and edge/industrial deployments that require high integration and deterministic packet handling.

Key Features

• Core and CPU Architecture Sixteen 64-bit Arm® v8 Cortex®-A72 cores running up to 2.2 GHz with an integrated 16 MB cache for multi-threaded, low-latency processing.
• Memory Subsystem Dual DDR4 72-bit controllers with ECC, supporting up to 3200 MT/s and a maximum memory capacity of 256 GB; includes a 2 MB on-chip packet caching buffer to reduce external memory traffic.
• High-speed SerDes and PCIe 24 SerDes lanes operating up to 25 GHz and up to 24 PCIe Gen3 lanes (supporting up to six ports, as wide as x8) for high-bandwidth host and accelerators connectivity.
• Ethernet and Switching Dual 100 Gbit/s Ethernet capability, support for up to 16 Ethernet ports and an integrated 122 Gbit/s Layer‑2 Ethernet switch for wire-rate packet handling and aggregation.
• Storage and USB Four SATA 3.0 ports and two USB 3.0 ports plus two USB PHYs for storage and peripheral connectivity.
• Security and Acceleration Integrated 50 Gbit/s security accelerator, secure boot and Arm TrustZone® support for hardware-rooted security and crypto offload.
• Data Compression Integrated 100 Gbit/s compression/decompression engine to accelerate data-plane throughput and reduce bandwidth use.
• Additional Interfaces CAN interfaces (including CAN FD optional), SD, eMMC, UART, and multiple I2C ports for control and sensor connectivity.
• Package, Mounting and Thermal Supplied in a 1517-FCPBGA (40×40) FCBGA package for surface-mount assembly; operating temperature range 0 °C to 105 °C. RoHS compliant.
• Power and Process Low FinFET power characteristics support high performance with attention to power efficiency.
• Software Ecosystem Supported by a Linux® SDK for Layerscape processors and CodeWarrior® Embedded Software Development Tools for Armv8 64-bit development.

Typical Applications

• Networking Control and Data Plane — Use as a control-plane CPU or data‑plane processor in switches and routers where multi-core packet processing and integrated switching are required.
• Data Center Offload — Host virtualization, NIC offload, and compression/security acceleration for server and appliance offload functions.
• 5G Packet Processing — Packet and security processing in C-RAN, CU/DU functions and other mobile infrastructure elements requiring high throughput and low latency.
• Industrial and Edge Compute — Edge gateways and industrial controllers that require deterministic packet handling, storage interfaces and robust I/O connectivity.

Unique Advantages

• High Core Density: Sixteen Cortex‑A72 cores at up to 2.2 GHz provide the compute headroom for parallel packet processing and virtualized workloads.
• Integrated Networking Fabric: Dual 100 Gbit/s Ethernet ports, up to 16 Ethernet ports total and a 122 Gbit/s L2 switch reduce external switching components and simplify board design.
• Hardware Accelerators: Built-in security and compression engines (50 Gbit/s and 100 Gbit/s respectively) offload CPU cycles and increase system throughput.
• Robust Memory and Packet Handling: Dual DDR4 with ECC to 3200 MT/s, 2 MB packet cache and large memory capacity support high-throughput buffering with lower external memory dependency.
• Wide I/O Flexibility: High‑speed SerDes, PCIe Gen3 lanes, SATA, USB3.0 and CAN enable diverse peripheral and network interface topologies from a single device.
• Production-ready Software Support: Availability of Linux SDK and CodeWarrior tooling accelerates software bring-up and integration into embedded platforms.

Why Choose LX2160SN72232B?

The LX2160SN72232B delivers a balanced combination of multicore performance, integrated network-centric I/O and hardware accelerators, making it suitable for designs that demand datacenter-class processing in constrained board- and power-budget environments. Its on-chip packet caching, security offload and compression capabilities enable streamlined system architectures with fewer external components.

Ideal for OEMs and system designers building networking appliances, edge servers, 5G infrastructure and industrial gateways, this device provides a scalable software and hardware platform with vendor-supported SDKs and development tools to reduce time-to-market.

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