LX2160SE72232B

The LX2160SE72232B is a high-performance Layerscape microprocessor featuring sixteen ARM® Cortex®-A72 64-bit cores running at up to 2.2 GHz in a 1517-FCPBGA (40×40) package. It combines dense compute, high-speed SerDes I/O and integrated networking and security accelerators to address compute‑intensive embedded networking and edge processing applications.

Designed for systems that require high throughput, on-chip packet handling and extensive I/O integration, this device targets use cases such as networking control and data-plane processing, data center offload, 5G packet processing and other embedded communications solutions.

Key Features

• Core & Performance Sixteen 64-bit ARM® Cortex®-A72 CPU cores operating up to 2.2 GHz provide multi-threaded compute capability for control-plane and data-plane workloads.
• Memory & Cache Dual DDR4 controllers with ECC support (72-bit), DDR4 operation to 3200 MT/s and a 16 MB cache plus a 2 MB packet cache buffer for reduced external memory dependency and lower latency.
• Networking & Offload Integrated high-speed networking with dual 100 Gbit/s Ethernet ports, up to 16 Ethernet ports supported, a 122 Gbit/s Layer‑2 switch, and a 50 Gbit/s security accelerator for IPsec and related offload tasks.
• High-speed SerDes & PCIe 24 SerDes lanes operating up to 25 GHz and up to 24 PCIe Gen3 lanes (supporting up to six ports) enable flexible, high-bandwidth peripheral and transport connectivity.
• Storage & USB Four SATA 3.0 ports and two USB 3.0 ports plus two USB PHYs provide native high-speed storage and host connectivity.
• Security & Trust On-chip Secure Boot and Arm TrustZone® support provide hardware-rooted trust and isolation for secure system designs.
• Additional Interfaces Integrated interfaces include SD, eMMC, DUART, multiple I2C, and CAN (with CAN FD optional), enabling broad peripheral support.
• Graphics Acceleration Graphics acceleration is available for offloading relevant workloads (feature present in product data).
• Package & Thermal Supplied in a 1517-FCPBGA (40×40) surface-mount package with an operating temperature range of 0 °C to 105 °C.
• Compliance RoHS compliant.

Typical Applications

• White box switching and enterprise networking — Control-plane and L2 switching applications leveraging integrated 100 Gbit/s Ethernet ports and the 122 Gbit/s Layer‑2 switch to host control software or offload functions.
• Data center offload — Use as a control or offload processor with PCIe Gen3 connectivity and security/compression accelerators to relieve server CPUs.
• 5G packet processing — Packet processing for C-RAN, O-RAN or distributed units where high I/O bandwidth and security/compression offloads are required.
• Industrial networking and edge compute — High-density I/O, CAN interfaces and wide temperature range support embedded communications and edge processing tasks.

Unique Advantages

• High compute density: Sixteen Cortex‑A72 cores at up to 2.2 GHz deliver scalable multi-core performance for parallel packet and control workloads.
• Integrated networking accelerators: Dual 100 Gbit/s Ethernet ports, a high-capacity L2 switch and a 50 Gbit/s security engine reduce reliance on external NICs and offload processors.
• Broad, high-speed I/O: 24 SerDes lanes at up to 25 GHz, up to 24 PCIe Gen3 lanes, SATA3 and USB3 provide flexible connectivity for peripherals and high-bandwidth transports.
• On-chip packet caching and large cache: 2 MB packet cache plus 16 MB system cache lowers external memory traffic, reducing latency and system BOM.
• Security building blocks: Secure Boot and Arm TrustZone® enable hardware-rooted secure system designs and software isolation.
• Ready for embedded deployments: Surface-mount 1517-FCPBGA package, consumer qualification and RoHS compliance support production-ready integration.

Why Choose LX2160SE72232B?

The LX2160SE72232B positions performance, integration and I/O density in a single Layerscape device. Its combination of sixteen Cortex‑A72 cores, high-speed SerDes, extensive PCIe and Ethernet options, and dedicated security and compression accelerators make it well-suited for demanding networking, edge and data‑plane applications that require consolidated processing and high throughput.

For system designers seeking to reduce board-level complexity while retaining scalability, this device offers a compact package, broad peripheral support and vendor-backed software ecosystems to accelerate development and deployment.

Request a quote or submit an inquiry to receive pricing and availability for LX2160SE72232B and to discuss how it fits your design requirements.