LX2160SC72029B

The LX2160SC72029B is a high‑performance microprocessor IC from NXP's Layerscape LX2160S family featuring an ARM® Cortex®‑A72 architecture. This 16‑core, 64‑bit MPU is specified at 2 GHz and is supplied in a 1517‑FCPBGA (40×40) package for surface‑mount applications.

Designed for compute‑intensive networking and edge processing use cases, the device targets applications such as networking control and data plane, data center offload, 5G packet processing, industrial systems and autonomous driving solutions where integrated I/O, security and packet handling accelerate system design.

Key Features

• CPU Cores  Sixteen 64‑bit ARM® Cortex®‑A72 cores operating at 2 GHz provide the multi‑threaded compute capability for control and data‑plane tasks.
• Memory Subsystem  Integrated support for DDR4 memory controllers and series‑level capability for dual 72‑bit DDR4 with ECC; on‑chip 16 MB cache and packet caching buffer reduce external memory pressure.
• High‑Speed SerDes & PCIe  Series architecture includes high‑speed SerDes lanes and up to 24 PCIe Gen3 lanes to support wide, low‑latency I/O interconnects.
• Ethernet & Switching  Dual 100 Gbit/s Ethernet capability with multiple integrated MACs and a 122 Gbit/s Layer‑2 switch for high‑bandwidth networking applications.
• Security & Acceleration  Integrated security features include Secure Boot and Arm TrustZone® plus series‑level security and compression accelerators to offload cryptographic and data‑plane workloads.
• Storage & Peripheral Interfaces  On‑chip support for 4× SATA 3.0, 2× USB 3.0 (plus PHYs), SD/eMMC, DUART, I²C and CAN (with FD optional) for broad peripheral connectivity.
• Graphics & Additional I/O  Graphics acceleration and additional interfaces enable multimedia and display use cases alongside networking functions.
• Package & Thermal  Supplied in a 1517‑FCPBGA (40×40) ball‑grid array, surface‑mount package with an operating temperature range of 0 °C to 105 °C.
• Compliance  RoHS compliant.

Typical Applications

• Network Routing & Switching  Use as a control‑plane or data‑plane processor with integrated 100 Gbit/s Ethernet ports and a high‑throughput Layer‑2 switch.
• Data Center Offload  Host workload offload and VM control with high PCIe lane counts and hardware compression/security accelerators.
• 5G Packet Processing  Packet processing and security offload for C‑RAN, O‑RAN and baseband front‑end applications.
• Industrial & Edge Compute  Edge gateways and industrial controllers leveraging DDR4, CANbus and extended temperature operation for robust field deployments.
• Autonomous Systems  Central connectivity and L2–L4 compute tasks where multi‑core processing, high I/O density and security are required.

Unique Advantages

• High Core Density: Sixteen ARM® Cortex®‑A72 cores at 2 GHz deliver substantial parallel compute capacity for multi‑threaded networking workloads.
• Integrated Network I/O: Dual 100 Gbit/s Ethernet ports, multiple MACs and a high‑capacity Layer‑2 switch reduce external components and simplify board design.
• Built‑In Security & Acceleration: Secure Boot and TrustZone® combined with dedicated security/compression accelerators offload critical tasks from the CPU cores.
• Broad Peripheral Support: Native SATA3.0, USB3.0, CANbus and multiple serial and storage interfaces enable flexible system integration.
• On‑Chip Caching: Large cache and packet caching buffer minimize external memory bandwidth requirements, lowering system latency and BOM costs.
• Commercial Temperature Range: 0 °C to 105 °C operating range supports a wide set of consumer and industrial edge deployments.

Why Choose LX2160SC72029B?

The LX2160SC72029B combines a 16‑core ARM® Cortex®‑A72 CPU cluster with extensive, integrated networking and security features in a compact 1517‑FCPBGA package. Its combination of multi‑core performance, on‑chip caching, high‑speed SerDes/PCIe connectivity and dedicated accelerators is targeted at designers building high‑throughput networking, edge compute and 5G packet processing systems.

This part suits customers who require a scalable, integrated processor platform with strong I/O density and hardware offloads, enabling reduced external components and streamlined system architecture while maintaining industry‑grade software ecosystem support.

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