LX2160CA72232B

The LX2160CA72232B is a high-performance Layerscape microprocessor built around 16 Arm® v8 Cortex®-A72 64‑bit cores running up to 2.2 GHz. It targets compute‑intensive networking and edge processing applications that require high core density, integrated I/O and packet acceleration.

Designed for systems that need large on-chip packet buffering, multi‑100G networking, and hardware offloads, this device delivers a balance of performance, integration and thermal range for demanding embedded and network infrastructure designs.

Key Features

• CPU Cores  Sixteen Arm® v8 Cortex®‑A72 64‑bit cores operating up to 2.2 GHz for high parallel compute throughput.
• Cache & Memory  16 MB on-chip cache with support for 2× DDR4 72b including ECC up to 3200 MT/s and maximum memory capacity information provided for system scaling.
• High‑Speed SerDes & I/O  24 SerDes lanes operating up to 25 GHz enable broad high‑speed connectivity and multi‑lane link aggregation.
• Ethernet & Switching  Integrated MACs supporting wired networking up to 100 Gbit/s, with multiple Ethernet speeds including 100G, 10G and 1G and a 122 Gbit/s Layer‑2 switch capability.
• Security & Acceleration  Integrated hardware acceleration including a 50 Gbit/s security engine and compression/decompression engines for offload of packet and data processing tasks.
• Storage & USB  Four SATA 3.0 ports and two USB 3.0 controllers plus PHY support for storage and peripheral connectivity.
• Additional Interfaces  CANbus support and a range of system interfaces (SD, eMMC, DUART, I2C listed in product documentation) to simplify integration.
• Graphics Acceleration  On‑chip graphics acceleration is available for designs that require graphical or media processing support.
• Package & Mounting  Supplied in a 1517 FCPBGA (40×40) surface‑mount package for high‑density board designs.
• Operating Range & Qualification  Operating temperature range −40 °C to 105 °C; datasheet indicates AEC‑Q100 Grade 3 to 105 °C in family documentation.

Typical Applications

• Network Infrastructure  Control‑plane and data‑plane processing for top‑of‑rack, end‑of‑row and white‑box switching with multi‑100G Ethernet support.
• Data Center Offload  Compute and offload duties such as IPsec and compression acceleration for NICs and host offload functions.
• 5G Packet Processing  Packet and protocol processing in 5G infrastructure including C‑RAN and O‑RAN central and distributed units.
• Edge & Industrial Compute  Edge processing and centralized connectivity for industrial applications requiring sustained throughput and broad I/O.
• Autonomous Systems  L2–L4 compute, sensor data management and central connectivity roles referenced in product family documentation.

Unique Advantages

• High Compute Density: Sixteen 64‑bit Cortex‑A72 cores and 16 MB cache provide multi‑threaded performance for parallel networking workloads.
• Integrated Packet & Security Offloads: On‑chip 50 Gbit/s security acceleration and compression engines reduce CPU load and lower system latency.
• Broad, High‑Speed I/O: 24 SerDes lanes up to 25 GHz, dual 100G Ethernet capability and a 122 Gbit/s L2 switch enable extensive high‑bandwidth system designs.
• System Simplification: Multiple integrated interfaces (SATA3, USB3, CANbus, SD/eMMC, PCIe lanes as listed in documentation) reduce BOM and board complexity.
• Industrial Temperature Range: −40 °C to 105 °C operating range supports deployment in thermally demanding environments.
• Family Scalability: The Layerscape family documentation describes pin‑compatible members, enabling platform scalability across core counts.

Why Choose LX2160CA72232B?

The LX2160CA72232B positions itself as a highly integrated processor for system designs that demand sustained networking throughput, hardware offloads and broad I/O in a compact BGA package. Its combination of 16 Cortex‑A72 cores, large on‑chip cache, SerDes bandwidth and accelerators make it suitable for edge, networking and compute‑offload applications where board space and integration matter.

Designed for engineers needing a single‑chip solution with hardware acceleration and high‑speed links, this part benefits from Layerscape software support and documentation that facilitate evaluation and deployment in complex embedded systems.

Request a quote or submit an inquiry for LX2160CA72232B to begin your evaluation and secure pricing and availability information for your design needs.