LX2122RC82029B

The LX2122RC82029B is a 12-core, 64-bit microprocessor IC based on the ARM® Cortex®-A72 architecture, running at 2 GHz and supplied by NXP Semiconductors. Designed for embedded applications, it combines multi-core processing with integrated memory and I/O support to address compute-intensive networking, edge, and industrial use cases.

Key Features

• Core & Architecture  12 ARM® Cortex®-A72 64-bit cores at 2 GHz provide multi-threaded compute capability for embedded and networking workloads.
• Memory  DDR4 and SDRAM memory controller support enables high-bandwidth system memory configurations.
• Storage & USB  Four SATA 6 Gbps ports and one USB 3.0 port provide high-speed local storage and peripheral connectivity.
• Interfaces  Additional interfaces include CANbus for robust field and control networking in embedded systems.
• Package & Mounting  Supplied in a 1150-FBGA package (23 × 23 mm) for surface-mount PCB assembly in space-constrained designs.
• Operating Temperature  Rated for operation from 5 °C to 105 °C to support a broad range of embedded environments.
• Compliance  RoHS compliant to meet standard environmental and material requirements.
• Graphics  No graphics acceleration included, focusing device resources on CPU and I/O performance.

Typical Applications

• Networking & Edge Compute  Multi-core ARM® processing with integrated I/O suits control-plane and edge compute tasks in networking equipment.
• Storage Controllers  Multiple SATA 6 Gbps ports and DDR4 memory interface enable local storage management and caching applications.
• Industrial Systems  CANbus support and a broad operating temperature range make the device suitable for industrial control and automation.
• 5G & Packet Processing  High core count and 64-bit architecture provide the compute headroom required for packet and protocol processing at the edge.

Unique Advantages

• High multi-core throughput: 12 Cortex-A72 cores at 2 GHz deliver parallel processing capacity for compute-intensive embedded workloads.
• Integrated storage connectivity: Four SATA 6 Gbps ports and USB 3.0 reduce the need for external bridging components.
• Flexible memory support: DDR4 and SDRAM controller compatibility allows designers to optimize memory bandwidth and capacity for application needs.
• Compact, surface-mount package: 1150-FBGA (23×23 mm) enables dense board-level integration in space-constrained systems.
• Wide operating range: Rated for 5 °C to 105 °C operation, supporting deployment in varied embedded environments.
• RoHS compliant: Meets common material and environmental requirements for modern electronics production.

Why Choose LX2122RC82029B?

The LX2122RC82029B balances multi-core ARM® performance with integrated memory and I/O features to simplify design and accelerate time-to-market for embedded networking, storage, and industrial applications. Its 12-core, 64-bit Cortex-A72 architecture and support for DDR4, multiple SATA ports, USB 3.0, and CANbus give system designers a compact, capable building block for high-throughput edge designs.

Backed by NXP Semiconductors, this part is positioned for customers needing scalable compute, integrated interfaces, and a compact package for surface-mount assembly. The combination of performance, integration, and compliance makes it suitable for demanding embedded projects that require robust processing and connectivity.

Request a quote or submit a procurement inquiry to get pricing and availability for LX2122RC82029B and accelerate your design cycle.