1ST280EY2F55I2LG

The 1ST280EY2F55I2LG is an Intel Stratix® 10 TX field programmable gate array offered in a 2912-BBGA (55×55) surface-mount package. As part of the Stratix 10 TX family, this device targets high-bandwidth, compute-intensive systems by combining a dense monolithic core fabric with advanced transceiver and system-in-package innovations.

Built around the Stratix 10 TX architecture, the family emphasizes high core performance, power-efficient dual-mode transceivers, and deep on-chip RAM to address demanding applications in networking, communications, and hardware acceleration.

Key Features

• Core & Logic — Monolithic Stratix 10 TX fabric with 2,800,000 logic elements to support very high logic density and complex designs.
• Memory — 240,123,904 total RAM bits available on-chip for large buffering and state storage requirements.
• Transceivers & I/O — Family-level dual-mode transceivers support up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation; this device exposes 296 user I/O pins for system interfacing.
• Hard IP & DSP — Stratix 10 TX family includes hardened IP such as PCI Express Gen3 and high-rate Ethernet MACs, plus variable-precision DSP blocks for compute-heavy signal processing.
• Package & Mounting — 2912-BBGA (FCBGA), surface mount in a 55×55 footprint (supplier package: 2912-FBGA, FC (55×55)).
• Power — Core voltage supply range specified at 820 mV to 880 mV for the device core.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Compliance — RoHS compliant.

Typical Applications

• High‑Speed Networking — Line cards, switches, and routers that require multi‑terabit aggregate bandwidth using high‑rate PAM4/NRZ transceivers and hardened Ethernet MACs.
• Telecom and Optical Transport — Backplane and chip‑to‑module applications leveraging high‑speed transceiver channels and robust on‑chip memory for packet buffering and framing.
• Hardware Acceleration — Compute‑intensive FPGA acceleration for data center or edge systems, using dense logic resources and variable‑precision DSP blocks.
• Embedded Systems with High I/O Density — Systems that require significant I/O count and on-chip RAM for protocol processing and system control.

Unique Advantages

• Extremely high logic density: 2.8 million logic elements enable large, complex designs without partitioning across multiple devices.
• Massive on‑chip memory: 240,123,904 total RAM bits provide deep buffering and state storage for packet processing and streaming workloads.
• High‑rate serial connectivity: Family transceivers capable of 57.8 Gbps PAM4 and 28.9 Gbps NRZ support next‑generation link speeds and flexible physical layer deployment.
• Industrial temperature range: −40 °C to 100 °C rating supports deployment in harsh or temperature‑variable environments.
• Compact, serviceable package: 2912‑BBGA surface‑mount package in a 55×55 footprint balances integration density with board‑level assembly needs.
• Standards and compliance: RoHS compliance aids regulatory acceptance and simplifies global manufacturing considerations.

Why Choose 1ST280EY2F55I2LG?

The 1ST280EY2F55I2LG leverages the Stratix 10 TX family architecture to deliver a highly integrated FPGA platform for systems demanding large logic capacity, substantial on‑chip memory, and high‑speed serial connectivity. Its combination of 2.8 million logic elements, extensive RAM resources, and multi‑gigabit transceiver support makes it well suited to advanced networking, telecom, and compute acceleration designs that require both performance and rugged industrial operation.

Choosing this device provides designers with a scalable FPGA fabric and family-level features such as hardened PCIe and Ethernet MAC IP, FPGA‑optimized DSP resources, and packaging options that support dense, high‑performance boards while conforming to industrial temperature requirements.

Request a quote or contact sales to discuss availability, lead times, and tailored support for integrating the 1ST280EY2F55I2LG into your next high‑performance design.