1ST280EY2F55E2VGS1

The 1ST280EY2F55E2VGS1 is a Stratix® 10 TX field programmable gate array (FPGA) in a 2912-BBGA FCBGA package. It integrates a high-performance monolithic FPGA fabric with Intel Hyperflex core architecture and high-speed dual-mode transceivers to address bandwidth- and compute-intensive system designs.

Designed for next-generation data-movement and processing tasks, this device targets applications that require large programmable logic capacity, extensive on-chip RAM, and high-density I/O. Key value comes from its combination of up to 2.8 million logic elements, high-speed transceiver capability (series-level), and advanced packaging for dense, surface-mount board integration.

Key Features

• Core Capacity — 2,800,000 logic elements provide substantial programmable logic resources for complex FPGA designs.
• On-chip Memory — 240,123,904 total RAM bits for large buffering, lookup tables, and state storage within the fabric.
• I/O Density — 296 I/Os delivered in a 2912-BBGA (55 × 55 mm) FCBGA package for flexible board-level connectivity and high-pin-count designs.
• High-speed Transceivers (Series-level) — Stratix 10 TX devices feature dual-mode transceivers capable of PAM4 and NRZ operation with data rates described in the series overview, suitable for chip-to-chip, chip-to-module, and backplane links.
• Advanced Architecture — Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) process are included in the series overview to enable higher core performance in supported devices.
• Power and Voltage — Core voltage supply range of 770 mV to 970 mV supports the device’s operating requirements.
• Operating Conditions & Grade — Extended-grade device with an operating temperature range of 0 °C to 100 °C and RoHS compliance.
• Package & Mounting — 2912-BBGA FCBGA package, surface-mount mounting type, supplier package specified as 2912-FBGA (55 × 55 mm) for high-density board assembly.

Typical Applications

• High-speed data transport and switching — On-board logic and series-level transceiver technology support chip-to-chip, module, and backplane data links.
• Network and communications infrastructure — Large logic capacity and extensive on-chip RAM enable protocol processing, packet buffering, and MAC/FEC implementations as described in the series overview.
• Compute-accelerated systems — The FPGA fabric and series-level DSP and hardened IP blocks support hardware-accelerated signal processing and compute offload.

Unique Advantages

• Large programmable capacity: 2.8 million logic elements allow implementation of extensive custom logic, reducing the need for multiple devices on a board.
• Substantial on-chip RAM: 240,123,904 total RAM bits enable significant local buffering and state storage for high-throughput designs.
• High I/O count in a compact package: 296 I/Os in a 2912-BBGA (55 × 55 mm) surface-mount package supports dense, multi-channel connectivity with a single device.
• Series-level transceiver capability: Dual-mode transceivers described for Stratix 10 TX provide the physical-layer flexibility required for a range of high-speed link topologies.
• Extended-grade reliability: Rated for 0 °C to 100 °C operation and RoHS compliant for environments aligned with the device’s expressed temperature and supply ranges.
• Platform-level architecture: Series-level features such as Hyperflex core architecture and 14 nm tri-gate technology support higher core performance in designs targeting this family.

Why Choose 1ST280EY2F55E2VGS1?

The 1ST280EY2F55E2VGS1 positions itself for systems that demand abundant programmable logic, large on-chip memory, and high-density I/O in a single surface-mount package. Its extended-grade operating range and RoHS compliance make it suitable for designs that require robust thermal and regulatory characteristics within the specified limits.

This device is appropriate for customers building high-bandwidth interconnects, advanced networking equipment, or compute-accelerated platforms that can leverage the Stratix 10 TX series architecture and device-level resources to consolidate functionality and streamline board-level design.

Request a quote or submit a sales inquiry to obtain pricing, availability, and ordering information for 1ST280EY2F55E2VGS1.