1ST280EY2F55E2LGS1

The 1ST280EY2F55E2LGS1 is an Intel Stratix® 10 TX field programmable gate array (FPGA) in a 2912-ball BGA FCBGA package. Built on the Stratix 10 TX architecture, this device combines a monolithic 14 nm FPGA fabric with high-speed transceiver tiles and hardened IP to address demanding bandwidth and compute requirements.

Targeted at high-performance networking, compute acceleration, and advanced communications systems, the device delivers a balance of large programmable fabric, abundant on-chip RAM, and high-speed I/O to support system-level integration and throughput-sensitive designs.

Key Features

• Core Architecture 
  Intel HyperFlex® core architecture implemented in a 14 nm tri-gate (FinFET) process; monolithic core fabric with up to 2,800,000 logic elements.
• High-Speed Transceivers 
  Dual-mode transceivers supporting PAM4 up to 57.8 Gbps and NRZ up to 28.9 Gbps; architecture supports large aggregate transceiver bandwidth and up to 144 full-duplex transceiver channels in the family.
• Hardened IP 
  Includes hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC blocks with Reed-Solomon FEC options described for NRZ and PAM4 signals.
• On-Chip Memory 
  Total internal RAM of 240,123,904 bits, with embedded SRAM block resources for high-throughput buffering and on-chip storage.
• I/O and Packaging 
  296 user I/O pins; supplied in a 2912-BBGA FCBGA package (supplier package: 2912-FBGA, FC (55×55)); surface-mount device suited for high-density board designs.
• Power and Operating Range 
  Core voltage supply range 820 mV to 880 mV; operating temperature range 0 °C to 100 °C; Extended grade device.
• Integration & Packaging Technology 
  Heterogeneous 3D SiP transceiver tiles and Intel EMIB packaging enable integration of high-speed channels alongside the monolithic fabric.
• Standards and Compliance 
  RoHS compliant.

Typical Applications

• High-Speed Networking 
  Use as a programmable switching or routing element where multi-gigabit PAM4/NRZ transceivers and hardened Ethernet MACs accelerate packet processing and line-rate functions.
• Data Center Acceleration 
  Implement custom offload engines, packet brokers, or protocol bridges leveraging large logic capacity and abundant on-chip RAM for buffering and low-latency processing.
• Telecom & Optical Transport 
  Deploy for chip-to-chip and backplane interfaces using high-data-rate transceivers and Reed-Solomon FEC support for improved link robustness.
• High-Performance Computing & DSP 
  Realize custom compute pipelines and variable-precision signal processing by mapping algorithms into the device fabric and DSP resources.

Unique Advantages

• Large Programmable Fabric: 2.8 million logic elements provide capacity for complex, system-level designs without partitioning to multiple devices.
• High Aggregate Bandwidth: Dual-mode transceivers and hardened MAC/PCIe IP enable multi-terabit system throughput for bandwidth-intensive applications.
• Integrated Memory Resources: Over 240 million bits of on-chip RAM support deep buffering and memory-intensive algorithms within the FPGA.
• Advanced Packaging: 2912-ball FCBGA (55×55) and heterogeneous SiP transceiver tiles allow dense routing of high-speed I/O while maintaining a compact board footprint.
• Power and Thermal Parameters: Defined core voltage range (820–880 mV) and 0 °C to 100 °C operating range simplify system power delivery and thermal planning for extended-grade deployments.
• Standards-Ready IP: Built-in PCIe Gen3 and multi-rate Ethernet MACs reduce development time for common high-speed interfaces.

Why Choose 1ST280EY2F55E2LGS1?

The 1ST280EY2F55E2LGS1 positions itself as a high-capacity, high-bandwidth Stratix 10 TX device suited for designers who need extensive programmable logic, significant on-chip memory, and multi-gigabit serial connectivity in a single, surface-mount package. Its combination of HyperFlex core architecture, hardened interface IP, and advanced packaging addresses complex system requirements where integration and throughput matter.

Choose this device for scalable designs in networking, data center acceleration, telecom transport, and DSP-heavy applications that require a robust FPGA platform backed by Intel's Stratix 10 TX architecture and ecosystem.

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