1ST280EY2F55E2LGS1

IC FPGA 296 I/O 2912BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 296 2800000 2912-BBGA, FCBGA

Quantity 1,611 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time9 Weeks
Datasheet

Specifications & Environmental

Device Package2912-FBGA, FC (55x55)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2912-BBGA, FCBGANumber of I/O296Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1ST280EY2F55E2LGS1 – Stratix® 10 TX FPGA, 2912-BBGA (55×55)

The 1ST280EY2F55E2LGS1 is an Intel Stratix® 10 TX field programmable gate array (FPGA) in a 2912-ball BGA FCBGA package. Built on the Stratix 10 TX architecture, this device combines a monolithic 14 nm FPGA fabric with high-speed transceiver tiles and hardened IP to address demanding bandwidth and compute requirements.

Targeted at high-performance networking, compute acceleration, and advanced communications systems, the device delivers a balance of large programmable fabric, abundant on-chip RAM, and high-speed I/O to support system-level integration and throughput-sensitive designs.

Key Features

  • Core Architecture 
    Intel HyperFlex® core architecture implemented in a 14 nm tri-gate (FinFET) process; monolithic core fabric with up to 2,800,000 logic elements.
  • High-Speed Transceivers 
    Dual-mode transceivers supporting PAM4 up to 57.8 Gbps and NRZ up to 28.9 Gbps; architecture supports large aggregate transceiver bandwidth and up to 144 full-duplex transceiver channels in the family.
  • Hardened IP 
    Includes hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC blocks with Reed-Solomon FEC options described for NRZ and PAM4 signals.
  • On-Chip Memory 
    Total internal RAM of 240,123,904 bits, with embedded SRAM block resources for high-throughput buffering and on-chip storage.
  • I/O and Packaging 
    296 user I/O pins; supplied in a 2912-BBGA FCBGA package (supplier package: 2912-FBGA, FC (55×55)); surface-mount device suited for high-density board designs.
  • Power and Operating Range 
    Core voltage supply range 820 mV to 880 mV; operating temperature range 0 °C to 100 °C; Extended grade device.
  • Integration & Packaging Technology 
    Heterogeneous 3D SiP transceiver tiles and Intel EMIB packaging enable integration of high-speed channels alongside the monolithic fabric.
  • Standards and Compliance 
    RoHS compliant.

Typical Applications

  • High-Speed Networking 
    Use as a programmable switching or routing element where multi-gigabit PAM4/NRZ transceivers and hardened Ethernet MACs accelerate packet processing and line-rate functions.
  • Data Center Acceleration 
    Implement custom offload engines, packet brokers, or protocol bridges leveraging large logic capacity and abundant on-chip RAM for buffering and low-latency processing.
  • Telecom & Optical Transport 
    Deploy for chip-to-chip and backplane interfaces using high-data-rate transceivers and Reed-Solomon FEC support for improved link robustness.
  • High-Performance Computing & DSP 
    Realize custom compute pipelines and variable-precision signal processing by mapping algorithms into the device fabric and DSP resources.

Unique Advantages

  • Large Programmable Fabric: 2.8 million logic elements provide capacity for complex, system-level designs without partitioning to multiple devices.
  • High Aggregate Bandwidth: Dual-mode transceivers and hardened MAC/PCIe IP enable multi-terabit system throughput for bandwidth-intensive applications.
  • Integrated Memory Resources: Over 240 million bits of on-chip RAM support deep buffering and memory-intensive algorithms within the FPGA.
  • Advanced Packaging: 2912-ball FCBGA (55×55) and heterogeneous SiP transceiver tiles allow dense routing of high-speed I/O while maintaining a compact board footprint.
  • Power and Thermal Parameters: Defined core voltage range (820–880 mV) and 0 °C to 100 °C operating range simplify system power delivery and thermal planning for extended-grade deployments.
  • Standards-Ready IP: Built-in PCIe Gen3 and multi-rate Ethernet MACs reduce development time for common high-speed interfaces.

Why Choose 1ST280EY2F55E2LGS1?

The 1ST280EY2F55E2LGS1 positions itself as a high-capacity, high-bandwidth Stratix 10 TX device suited for designers who need extensive programmable logic, significant on-chip memory, and multi-gigabit serial connectivity in a single, surface-mount package. Its combination of HyperFlex core architecture, hardened interface IP, and advanced packaging addresses complex system requirements where integration and throughput matter.

Choose this device for scalable designs in networking, data center acceleration, telecom transport, and DSP-heavy applications that require a robust FPGA platform backed by Intel's Stratix 10 TX architecture and ecosystem.

Request a quote or submit a pricing inquiry to check availability, lead times, and volume pricing for the 1ST280EY2F55E2LGS1.

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