1ST280EY1F55I2VGAS

The 1ST280EY1F55I2VGAS is an Intel Stratix® 10 TX field programmable gate array in a 2912-BBGA FCBGA package. It pairs a high-density core fabric with hardened transceiver and IP features to address bandwidth‑intensive applications in industrial and communications systems.

Designed for high-performance designs, this device delivers 2,800,000 logic elements, large on-chip RAM, and a comprehensive I/O and packaging set to support multi‑Gbps serial links, external memory interfaces, and embedded processing in a surface-mount 55×55 mm FBGA package.

Key Features

• Core Architecture  Monolithic Stratix 10 TX core fabric with 2,800,000 logic elements, built on Intel’s HyperFlex core architecture as described for the Stratix 10 TX family.
• High‑Density Memory  Total internal RAM of 240,123,904 bits to support large buffering, packet processing, and on‑chip data storage requirements.
• Transceivers and High‑Speed IP  Device family supports dual‑mode transceivers (PAM4 and NRZ modes) and includes hardened IP blocks such as PCI Express Gen3 and high‑speed Ethernet MACs for multi‑100 Gbps connectivity (features described in the Stratix 10 TX overview).
• I/O  296 programmable I/Os to interface with external components, memory, and high‑speed link partners.
• Embedded Processing (select devices)  Family includes options with an embedded quad‑core 64‑bit Arm Cortex‑A53 hard processor system (HPS) for application‑class processing and system integration (available in select Stratix 10 TX devices).
• Package and Mounting  Surface‑mount 2912‑BBGA (FBGA) package, supplier device package listed as 2912‑FBGA, FC (55×55 mm).
• Power and Temperature  Operating supply range of 770 mV to 970 mV and an industrial operating temperature range of −40 °C to 100 °C.
• System and Fabric Innovations  Stratix 10 TX family innovations include Intel 14 nm process technology, heterogeneous 3D SiP transceiver tiles, fractional synthesis and ultra‑low jitter PLLs, hardened DSP and memory controllers as described in the device overview.

Typical Applications

• Telecom & Networking: High‑bandwidth line cards, backplane interfaces and packet processors that leverage the device’s high logic density, large on‑chip RAM, and hardened Ethernet/PCIe IP.
• Data Center & Storage: Switches, acceleration cards and storage controllers requiring dense logic, multi‑Gbps transceivers, and robust memory buffering.
• High‑Speed Board‑to‑Board and Module Interfaces: Chip‑to‑chip and chip‑to‑module applications using the Stratix 10 TX dual‑mode transceivers for PAM4 and NRZ operation.
• Embedded Processing Systems: Systems that benefit from a combination of FPGA fabric and the optional quad‑core Arm Cortex‑A53 HPS for offloaded control and application tasks.

Unique Advantages

• Exceptional logic capacity: 2,800,000 logic elements provide the headroom for large, complex designs without partitioning across multiple devices.
• Large on‑chip RAM: 240,123,904 bits of internal RAM reduce external memory dependence for buffering and accelerators.
• High‑speed connectivity: Hardened transceiver and IP capabilities in the Stratix 10 TX family enable multi‑Gbps link and protocol integration for networking and storage applications.
• Industrial temperature range: Specified operation from −40 °C to 100 °C supports deployment in demanding environments.
• Robust packaging: 2912‑BBGA FCBGA (55×55 mm) surface‑mount package provides a compact, high‑pin‑count solution for board designs.
• Integrated system options: Select devices include an embedded quad‑core 64‑bit Arm Cortex‑A53 HPS for combined hardware/software system designs.

Why Choose 1ST280EY1F55I2VGAS?

The 1ST280EY1F55I2VGAS combines a high‑density Stratix 10 TX fabric with large on‑chip RAM, extensive I/O, and advanced transceiver and IP capabilities to address bandwidth‑intensive, industrial applications. Its industrial temperature rating, surface‑mount 2912‑BBGA package, and defined supply range make it suitable for robust system designs that require both logic scale and reliable operation.

This device is well suited to engineering teams building high‑performance networking, data center, and embedded processing systems who need scalable logic capacity, integrated high‑speed interfaces, and the option of embedded processing for complex control or application tasks.

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