1ST280EY1F55I2VG
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 296 2800000 2912-BBGA, FCBGA |
|---|---|
| Quantity | 1,833 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2912-FBGA, FC (55x55) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2912-BBGA, FCBGA | Number of I/O | 296 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1ST280EY1F55I2VG – Stratix® 10 TX FPGA, 2,800,000 logic elements, 296 I/O, 2912-BBGA
The 1ST280EY1F55I2VG is an Intel Stratix® 10 TX Field Programmable Gate Array (FPGA) offered in a 2912-ball FCBGA package. As a member of the Stratix 10 TX family, it leverages the HyperFlex core architecture and heterogeneous transceiver tiles to address high-bandwidth, power-sensitive system designs.
This device targets applications that require very large logic capacity and dense I/O while supporting advanced high-speed serial connectivity and hardened protocol IP blocks for PCI Express and multi-rate Ethernet.
Key Features
- Core Logic Monolithic fabric with 2,800,000 logic elements providing very high logic density for complex digital designs.
- Memory Extensive on-chip RAM with 240,123,904 total bits of internal memory to support large buffers, packet processing, and on-chip data storage.
- Transceivers & Bandwidth Stratix 10 TX family dual‑mode transceivers support PAM4 up to 57.8 Gbps and NRZ up to 28.9 Gbps, with family-level support for up to 144 full-duplex channels and aggregate bandwidth measured in terabits per second.
- Hardened Protocol IP Family-level support includes hardened PCI Express Gen3 and multi-rate 10/25/100 Gbps Ethernet MACs with forward error correction options.
- I/O & Package 296 I/O pins in a 2912-BBGA FCBGA package (2912-FBGA, 55×55 mm supplier package) for high-density board integration; surface-mount mount type.
- Power Supply Range Core voltage operation specified from 770 mV to 970 mV to support the device’s core power requirements.
- Operating Range Rated for industrial temperature operation from −40°C to 100°C.
- Compliance RoHS compliant.
Typical Applications
- High‑Speed Networking Use in switches, routers, and line cards leveraging multi‑rate 10/25/100 Gbps Ethernet MACs and high‑speed transceivers for backplane and board‑level links.
- Data Center & Accelerators Integration into accelerator boards and NICs where large logic capacity and hardened PCI Express Gen3 interfaces are required.
- Chip‑to‑Chip and Backplane Interconnects Backplane and chip‑to‑chip applications taking advantage of PAM4 and NRZ dual‑mode transceivers for high aggregate bandwidth.
- Embedded Processing Systems Deploy in systems that require high logic and memory capacity with option for integrated processor subsystems in select Stratix 10 TX configurations.
Unique Advantages
- Very high logic density: 2,800,000 logic elements enable consolidation of large functions and deep datapath designs on a single device.
- Massive on‑chip RAM: 240,123,904 bits of internal memory reduce external memory dependency for buffering and packet processing.
- Advanced serial connectivity: Dual‑mode transceivers and family-level support for PAM4/NRZ up to 57.8 Gbps enable high-throughput board and system interfaces.
- Hardened protocol support: Built-in PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks speed development of standard-compliant interfaces.
- Industrial temperature rating: −40°C to 100°C operation simplifies deployment in temperature‑challenging environments.
- High I/O density and compact package: 296 I/Os in a 2912-ball FCBGA (55×55 mm) package facilitates dense system designs while maintaining board-level integration flexibility.
Why Choose 1ST280EY1F55I2VG?
The 1ST280EY1F55I2VG delivers a combination of exceptional logic capacity, extensive on‑chip memory, and high‑speed serial connectivity that addresses demanding, bandwidth‑centric applications. Its industrial temperature rating, RoHS compliance, and compact 2912-BBGA FCBGA package make it suitable for robust system implementations where integration density and thermal considerations matter.
This device is well suited for design teams building high-throughput networking equipment, data center accelerators, and advanced board-level interconnects who require a scalable, high‑performance FPGA platform with hardened protocol IP and extensive on‑chip resources.
Request a quote or submit an inquiry to receive pricing, availability, and lead‑time information for the 1ST280EY1F55I2VG. Our team can provide details to help evaluate this FPGA for your next design.

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