1ST280EY1F55I2LG

The 1ST280EY1F55I2LG is an Intel Stratix® 10 TX field programmable gate array (FPGA) in a 2912-BBGA FCBGA package. It integrates a high-performance HyperFlex® core architecture and a monolithic 14 nm FPGA fabric, delivering large programmable logic capacity and extensive high-speed I/O for demanding communications, data center, and networking designs.

Designed for applications that require high transceiver bandwidth, large on-chip memory, and hardened interface IP, this device balances performance, integration, and industrial-grade operating range to support complex system-level implementations.

Key Features

• Core Architecture  HyperFlex® core architecture implemented in Intel 14 nm FinFET process; documented to deliver 2× the core performance compared to previous-generation high-performance FPGAs.
• Logic Capacity  2,800,000 logic elements (LEs) to implement large, complex logic designs and system-level integration.
• On‑Chip Memory  240,123,904 total RAM bits; series includes M20K internal SRAM blocks and select devices can include embedded eSRAM (47.25 Mbit) for large on-chip storage.
• High‑Speed Transceivers & Interfaces  Dual-mode transceivers supporting 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation; series supports up to 144 full-duplex transceiver channels and includes hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP with Reed‑Solomon FEC.
• DSP and Processor Options  Hardened floating-point DSP blocks and variable precision DSP resources for signal processing; select devices include an embedded quad-core 64-bit Arm® Cortex‑A53 hard processor system (HPS) for application-class processing.
• I/O and Packaging  296 programmable I/O signals in a 2912-BBGA (2912-FBGA, FC 55×55) surface-mount package, supporting dense board-level integration.
• Power and Thermal  Documented core supply voltage range of 820 mV to 880 mV and industrial operating temperature range from −40°C to 100°C to meet robust deployment conditions.
• Compliance  RoHS compliant device and configured for surface-mount assembly.

Typical Applications

• High‑Speed Networking  Implements 10/25/100 Gbps Ethernet and Reed‑Solomon FEC IP for routers, switches, and line cards that require dense MAC and transceiver integration.
• Telecom & Optical Transport  Supports PAM4 and NRZ dual-mode transceivers and large aggregate bandwidth for backplane, chip-to-module, and chip-to-chip transport designs.
• Data Center Acceleration  Large logic and memory resources plus hardened PCIe Gen3 IP enable FPGA-based acceleration and offload functions in server and appliance deployments.
• Signal Processing & DSP Systems  Variable precision and floating-point DSP blocks provide the compute fabric needed for high-throughput signal processing and multi-channel data-paths.

Unique Advantages

• Highly integrated fabric: Monolithic 14 nm FPGA core combined with heterogeneous transceiver tiles consolidates logic, memory, and high-speed I/O in a single device to reduce board-level complexity.
• Massive logic and memory: 2.8 million logic elements and 240,123,904 RAM bits enable consolidation of multiple functions into one FPGA, reducing BOM and inter-chip latency.
• Flexible, high-throughput connectivity: Dual-mode transceivers up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ plus hardened Ethernet and PCIe IP accelerate time-to-market for high-bandwidth interfaces.
• System-level performance options: Hardened DSP blocks and optional quad-core Arm Cortex‑A53 HPS provide both hardware acceleration and application-class processing on the same device.
• Industrial operating range: Documented −40°C to 100°C operating temperature and surface-mount 2912-BBGA packaging support deployment in robust environments.

Why Choose 1ST280EY1F55I2LG?

The 1ST280EY1F55I2LG Stratix® 10 TX FPGA is positioned for designs that demand substantial programmable logic, extensive on-chip memory, and advanced high-speed serial connectivity. Its HyperFlex® architecture and 14 nm implementation provide the raw logic performance needed for large designs, while hardened IP blocks and dual-mode transceivers simplify integration of industry-standard interfaces.

This device is suited to systems engineering teams and procurement focused on high-bandwidth networking, telecom transport, data center acceleration, and complex signal processing applications that benefit from consolidated logic, memory, and transceiver resources within an industrial temperature-rated package.

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