1ST280EY1F55I2LGAS

The 1ST280EY1F55I2LGAS is an Intel Stratix® 10 TX field programmable gate array in a 2912-ball BGA FCBGA package designed for demanding, high-performance system designs. It combines a large programmable fabric (approximately 2,800,000 logic elements) with extensive on-chip RAM (240,123,904 total bits) and 296 I/O to support bandwidth-intensive, compute-heavy applications.

This device leverages Stratix 10 TX family innovations—including the Intel Hyperflex core architecture, advanced 14 nm process technology, and high-speed, dual-mode transceivers—to deliver integration and performance for industrial-class deployments requiring robust thermal and voltage operating ranges.

Key Features

• Core Logic  Approximately 2,800,000 logic elements for large-scale logic integration and complex custom processing pipelines.
• On-chip Memory  240,123,904 total RAM bits to support large buffers, lookup tables, and on-chip data storage.
• I/O and Packaging  296 I/O with a 2912-BBGA FCBGA package (2912-FBGA, FC 55×55), optimized for high-density board-level integration and surface-mount assembly.
• High-speed Transceivers  Dual-mode transceivers in the Stratix 10 TX family support both 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation and scale across transceiver tiles for high aggregate bandwidth (series capability).
• Hardened Interfaces and IP  Series-level hardened IP includes PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC blocks, enabling protected, high-throughput protocol implementations.
• Advanced Architecture  Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) process technology provide stepped improvements in logic performance and efficiency (as described for the Stratix 10 TX family).
• Power and Voltage  Specified operating voltage range between 820 mV and 880 mV to meet core supply requirements.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, supporting industrial-environment deployments.
• Compliance  RoHS compliant.

Typical Applications

• Network Infrastructure  High-throughput packet processing, switch/accelerator designs, and line-rate Ethernet implementations leveraging hardened MAC IP and high-speed transceivers.
• Telecommunications  Backplane and module-level PHY implementations using dual-mode transceivers for PAM4 and NRZ signaling in SERDES applications.
• Data Center & Acceleration  Custom acceleration engines and offload functions that require large logic capacity and substantial on-chip RAM for buffering and state storage.
• Industrial Systems  Deterministic control, protocol bridging, and heavy I/O count applications within the −40 °C to 100 °C operating range.

Unique Advantages

• High Logic Density: Approximately 2.8 million logic elements enable consolidation of complex functions into a single device, reducing system BOM and board count.
• Large On-Chip Memory: 240 million+ bits of RAM support extensive buffering, state machines, and data-path implementations without immediate external memory dependence.
• Advanced High-speed I/O: Dual-mode transceivers and series-level support for up to multi-tens-of-gigabit signaling provide flexible connectivity options for modern high-bandwidth links.
• Industrial Temperature Rating: −40 °C to 100 °C operation allows deployment in a wide range of industrial environments without derating.
• System-level IP: Hardened PCIe Gen3 and multi-rate Ethernet MAC IP simplify integration of common protocol functions and speed time-to-market.
• Compact, High-density Package: 2912-ball FCBGA (55×55) package offers a compact board footprint for high-pin-count applications while supporting surface-mount manufacturing.

Why Choose 1ST280EY1F55I2LGAS?

The 1ST280EY1F55I2LGAS delivers a combination of very high logic capacity, substantial on-chip RAM, and a dense I/O complement in an industrial-temperature-rated, surface-mount FCBGA package. It is suited for designs that require significant programmable resources, high aggregate bandwidth, and integration of protocol-level IP blocks.

Designed as part of the Stratix 10 TX family, this device brings family-level architectural advantages—such as the Hyperflex core, 14 nm process benefits, and high-speed transceiver capability—into applications where performance, scalability, and robust operating conditions are key selection criteria.

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