1ST280EY2F55E1VGS1

The 1ST280EY2F55E1VGS1 is an Intel Stratix® 10 TX FPGA device combining a high-density monolithic core fabric with advanced transceiver and system-level features. It targets high-bandwidth, compute- and I/O-intensive designs that require large programmable logic capacity, substantial on-chip memory, and multi‑mode high-speed SerDes connectivity.

Built on the Stratix 10 TX architecture, the device provides the performance and integration needed for networking, data center, and communications applications while supporting extended-grade operation and modern packaging options.

Key Features

• Core Logic: Monolithic FPGA fabric with 2,800,000 logic elements, delivering large programmable logic capacity for complex designs.
• HyperFlex Architecture: Intel HyperFlex core architecture (series-level) designed to improve core performance and timing characteristics for high-performance implementations.
• On‑chip Memory: 240,123,904 total RAM bits of on-chip RAM to support large buffering, packet processing, and data-path implementations.
• High‑speed Transceivers: Dual-mode transceivers in the Stratix 10 TX family capable of both 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation for chip-to-chip, chip-to-module, and backplane links.
• Interfaces & Hard IP: 296 device I/Os and series-level hardened IP such as PCI Express Gen3 and multi-rate Ethernet MACs with Reed‑Solomon FEC support for high-speed networking use cases.
• Package & Mounting: Surface-mount 2912‑BBGA (2912‑FBGA, FC 55×55) package suitable for high-density board designs.
• Power Supply: Core voltage range specified at 770 mV to 970 mV to match system power architectures for Stratix 10 TX devices.
• Operating Range & Grade: Extended grade with an operating temperature range of 0 °C to 100 °C.
• Security & Configuration: Series-level features include secure device management and configuration options to support protected bitstreams and system configuration workflows.
• Compliance: RoHS compliant.

Typical Applications

• Telecommunications & Optical Transport: Implements high-throughput line cards and transponder functions leveraging the device’s multi‑Gbps transceivers and on-chip memory for packet buffering and FEC.
• Data Center Networking: Accelerates Ethernet and PCIe-based data paths and offloads using the large logic element count and hardened MAC/PCIe IP.
• High‑Performance Compute & Acceleration: Builds custom compute pipelines and data-plane accelerators that require massive programmable logic, RAM, and deterministic I/O.
• Backplane & Chip‑to‑Module Connectivity: Supports high-speed NRZ and PAM4 signaling for board-level or module-level interconnect where high aggregate bandwidth is required.

Unique Advantages

• Extensive Programmable Logic Capacity: 2.8 million logic elements enable large, complex designs without partitioning across multiple FPGAs.
• High Aggregate Bandwidth: Series-level support for multi‑rate transceivers and hardened Ethernet/PCIe IP provides the bandwidth needed for networking and data-center applications.
• Significant On‑Chip Memory: 240,123,904 bits of RAM support deep buffering and data-path implementations directly in the FPGA fabric.
• Compact, High‑Density Packaging: 2912‑BBGA package provides a compact footprint while supporting extensive I/O and thermal handling for high-performance boards.
• Design‑Ready Feature Set: Hardware support for PCIe Gen3 and Ethernet MACs with FEC simplifies implementation of industry-standard interfaces.
• Extended‑Grade Operation: 0 °C to 100 °C operating range and RoHS compliance align the device for demanding commercial and communications environments.

Why Choose 1ST280EY2F55E1VGS1?

The 1ST280EY2F55E1VGS1 combines a large monolithic logic fabric, substantial on-chip memory, and Stratix 10 TX series-level transceiver and hardened IP capabilities to address high-bandwidth networking, data-center acceleration, and compute-intensive applications. Its packaging, I/O count, and extended-grade thermal range make it suitable for densely integrated board designs that require robust performance and system-level features.

For design teams needing a scalable, high‑capacity FPGA platform with built-in interface IP and modern core architecture, this device offers a clear path to implement complex, high-throughput systems while leveraging the Stratix 10 TX device family capabilities.

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