1ST280EY2F55E2VG

IC FPGA 296 I/O 2912BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 296 2800000 2912-BBGA, FCBGA

Quantity 1,943 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2912-FBGA, FC (55x55)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2912-BBGA, FCBGANumber of I/O296Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1ST280EY2F55E2VG – Stratix® 10 TX FPGA, 2.8M logic elements, 2912-BBGA

The 1ST280EY2F55E2VG is a Stratix® 10 TX field programmable gate array (FPGA) in a 2912-ball FCBGA package. It integrates a high-density monolithic core fabric with large embedded RAM and extensive I/O to address high-bandwidth, compute-heavy system designs.

Built on the Stratix 10 TX device family architecture, this device emphasizes high-performance logic, advanced transceiver capability, and system-level integration suitable for next-generation networking, communications, and compute applications.

Key Features

  • High-density core: 2,800,000 logic elements provide significant programmability and parallel processing capacity for complex algorithms and large-scale logic implementations.
  • Large on-chip memory: 240,123,904 total RAM bits to support large buffering, packet processing, and on-chip data storage requirements.
  • Advanced transceiver and I/O capability: 296 I/O pins and heterogeneous transceiver tiles in the Stratix 10 TX family provide high-bandwidth connectivity for chip-to-chip, module, and backplane applications.
  • HyperFlex core architecture: Series-level HyperFlex architecture delivers improved core performance for timing and throughput (as described in the device overview).
  • Hardened system IP (series-level): Family documentation describes hardened PCI Express Gen3 and multi-rate Ethernet MAC IP blocks and Reed-Solomon FEC options for high-speed serial protocols.
  • Package and mounting: 2912-BBGA (2912-FBGA, FC 55×55) FCBGA surface-mount package suitable for dense board integration.
  • Power and thermal: Supported core supply range 770 mV to 970 mV and specified operating temperature range 0 °C to 100 °C.
  • Compliance: RoHS compliant.

Typical Applications

  • High-speed networking: Use in 10/25/100 Gbps Ethernet and multi-rate backplane systems where large logic capacity and dense on-chip RAM support packet processing and FEC functions.
  • Data center interconnect and switching: Deploy for switch fabrics and aggregation layers that require massive parallel processing and high aggregate transceiver bandwidth.
  • Compute acceleration: Implement custom accelerators and offloads that leverage the large logic element count and substantial on-chip memory to increase throughput.
  • Telecommunications equipment: Integrate into line cards and modules that benefit from the device family’s multi-rate transceiver capability and hardened protocol IP.

Unique Advantages

  • Massive programmable capacity: 2.8 million logic elements enable complex, large-scale designs without immediate need for multi-chip partitioning.
  • Substantial on-chip memory: 240 million bits of RAM reduce reliance on external memory for buffering and mid-stage processing, simplifying board-level design.
  • High I/O and transceiver support: 296 I/Os and family-level high-speed transceiver tiles support demanding bandwidth and connectivity requirements.
  • Family-level hardened IP: Integrated PCIe and Ethernet MAC options (documented for the Stratix 10 TX family) reduce development time for common system interfaces.
  • Advanced packaging: 2912-ball FCBGA package integrates large die and transceiver tiles in a surface-mount form factor for compact system layouts.
  • Design flexibility features: Series documentation lists capabilities such as partial and dynamic reconfiguration and device-level security options to support evolving system requirements.

Why Choose 1ST280EY2F55E2VG?

The 1ST280EY2F55E2VG positions itself as a high-capacity, high-bandwidth FPGA for engineers building systems that require extensive logic, large on-chip memory, and robust I/O/transceiver resources. Its specifications—2.8 million logic elements, 240 million bits of RAM, 296 I/O, and a high-density 2912-BBGA package—make it well suited for networking, data-center, and compute-acceleration applications that demand scalable programmable fabric and integrated protocol support.

Design teams benefit from family-level innovations such as the HyperFlex core architecture, hardened protocol IP blocks, and advanced packaging approaches that enable dense, performance-oriented system designs while supporting features for system reconfiguration and security.

Request a quote or submit an inquiry to our sales team for pricing, availability, and technical assistance on integrating the 1ST280EY2F55E2VG into your next design.

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