1ST280EY2F55E2VG
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 296 2800000 2912-BBGA, FCBGA |
|---|---|
| Quantity | 1,943 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2912-FBGA, FC (55x55) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2912-BBGA, FCBGA | Number of I/O | 296 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1ST280EY2F55E2VG – Stratix® 10 TX FPGA, 2.8M logic elements, 2912-BBGA
The 1ST280EY2F55E2VG is a Stratix® 10 TX field programmable gate array (FPGA) in a 2912-ball FCBGA package. It integrates a high-density monolithic core fabric with large embedded RAM and extensive I/O to address high-bandwidth, compute-heavy system designs.
Built on the Stratix 10 TX device family architecture, this device emphasizes high-performance logic, advanced transceiver capability, and system-level integration suitable for next-generation networking, communications, and compute applications.
Key Features
- High-density core: 2,800,000 logic elements provide significant programmability and parallel processing capacity for complex algorithms and large-scale logic implementations.
- Large on-chip memory: 240,123,904 total RAM bits to support large buffering, packet processing, and on-chip data storage requirements.
- Advanced transceiver and I/O capability: 296 I/O pins and heterogeneous transceiver tiles in the Stratix 10 TX family provide high-bandwidth connectivity for chip-to-chip, module, and backplane applications.
- HyperFlex core architecture: Series-level HyperFlex architecture delivers improved core performance for timing and throughput (as described in the device overview).
- Hardened system IP (series-level): Family documentation describes hardened PCI Express Gen3 and multi-rate Ethernet MAC IP blocks and Reed-Solomon FEC options for high-speed serial protocols.
- Package and mounting: 2912-BBGA (2912-FBGA, FC 55×55) FCBGA surface-mount package suitable for dense board integration.
- Power and thermal: Supported core supply range 770 mV to 970 mV and specified operating temperature range 0 °C to 100 °C.
- Compliance: RoHS compliant.
Typical Applications
- High-speed networking: Use in 10/25/100 Gbps Ethernet and multi-rate backplane systems where large logic capacity and dense on-chip RAM support packet processing and FEC functions.
- Data center interconnect and switching: Deploy for switch fabrics and aggregation layers that require massive parallel processing and high aggregate transceiver bandwidth.
- Compute acceleration: Implement custom accelerators and offloads that leverage the large logic element count and substantial on-chip memory to increase throughput.
- Telecommunications equipment: Integrate into line cards and modules that benefit from the device family’s multi-rate transceiver capability and hardened protocol IP.
Unique Advantages
- Massive programmable capacity: 2.8 million logic elements enable complex, large-scale designs without immediate need for multi-chip partitioning.
- Substantial on-chip memory: 240 million bits of RAM reduce reliance on external memory for buffering and mid-stage processing, simplifying board-level design.
- High I/O and transceiver support: 296 I/Os and family-level high-speed transceiver tiles support demanding bandwidth and connectivity requirements.
- Family-level hardened IP: Integrated PCIe and Ethernet MAC options (documented for the Stratix 10 TX family) reduce development time for common system interfaces.
- Advanced packaging: 2912-ball FCBGA package integrates large die and transceiver tiles in a surface-mount form factor for compact system layouts.
- Design flexibility features: Series documentation lists capabilities such as partial and dynamic reconfiguration and device-level security options to support evolving system requirements.
Why Choose 1ST280EY2F55E2VG?
The 1ST280EY2F55E2VG positions itself as a high-capacity, high-bandwidth FPGA for engineers building systems that require extensive logic, large on-chip memory, and robust I/O/transceiver resources. Its specifications—2.8 million logic elements, 240 million bits of RAM, 296 I/O, and a high-density 2912-BBGA package—make it well suited for networking, data-center, and compute-acceleration applications that demand scalable programmable fabric and integrated protocol support.
Design teams benefit from family-level innovations such as the HyperFlex core architecture, hardened protocol IP blocks, and advanced packaging approaches that enable dense, performance-oriented system designs while supporting features for system reconfiguration and security.
Request a quote or submit an inquiry to our sales team for pricing, availability, and technical assistance on integrating the 1ST280EY2F55E2VG into your next design.

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