1ST280EY1F55I1VG

IC FPGA 296 I/O 2912BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 296 2800000 2912-BBGA, FCBGA

Quantity 973 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2912-FBGA, FC (55x55)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2912-BBGA, FCBGANumber of I/O296Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1ST280EY1F55I1VG – Stratix® 10 TX FPGA, 2912-BBGA (Industrial)

The 1ST280EY1F55I1VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) in a 2912-BBGA FCBGA package designed for high-density, high-bandwidth system designs. It combines a monolithic 14 nm FPGA fabric with Stratix 10 TX family innovations—including HyperFlex core architecture and heterogeneous 3D SiP transceiver tiles—to target demanding applications that require large logic capacity, extensive on-chip memory, and advanced high-speed serial connectivity.

This device is specified for industrial operation and offers a broad supply voltage range and thermal tolerance suited to robust applications where sustained performance and integration of hardened interface features are required.

Key Features

  • HyperFlex Core Architecture  Intel HyperFlex core architecture delivers significantly improved core performance compared to previous-generation devices according to the Stratix 10 TX family overview.
  • High Logic Density  Contains 2,800,000 logic elements, enabling complex, large-scale FPGA designs and substantial programmable logic resources on a single device.
  • Large On-Chip Memory  Provides 240,123,904 total RAM bits for deep buffering, large lookup tables, and memory-intensive algorithms.
  • Advanced Transceivers  Stratix 10 TX family transceivers support dual-mode operation (PAM4 and NRZ) and high single-lane data rates; family-level architecture supports many high-speed channels on heterogeneous 3D SiP transceiver tiles.
  • Hardened Interface IP  Family documentation describes hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks with dedicated FEC options—allowing integration of common high-speed protocols in hardware.
  • DSP and Memory Subsystems  Includes family-level hardened variable precision DSP blocks and internal embedded memory blocks suitable for signal processing and computational workloads.
  • Package and I/O  Surface-mount 2912-BBGA (2912-FBGA, FC 55×55) package with 296 I/Os for flexible board-level integration and routing.
  • Power and Thermal  Core supply voltage range specified at 770 mV to 970 mV and an operating temperature range of −40 °C to 100 °C for industrial environments.
  • RoHS Compliant  Device is listed as RoHS compliant.

Typical Applications

  • High‑performance networking and switching  Use the large logic capacity and family-level hardened Ethernet MACs with FEC to implement high-throughput packet processing, line cards, and aggregation switches.
  • Telecommunications and optical transport  Dual-mode, high-speed transceivers and large on-chip memory make this device suitable for backplane and module-level transport functions requiring PAM4/NRZ serial links.
  • Data center acceleration  The combination of massive logic resources and DSP blocks supports custom acceleration and offload engines for compute and storage systems.
  • Test, measurement and instrumentation  High I/O count, wide memory, and advanced timing/clocking features in the family enable precision data capture and real-time processing in instrumentation platforms.

Unique Advantages

  • Highly integrated package  Monolithic 14 nm core fabric combined with 3D SiP transceiver tiles delivers system-level integration that reduces external component count.
  • Extreme logic capacity  2,800,000 logic elements provide headroom for large FPGA designs, complex protocol stacks, and multi-function systems on a single device.
  • Substantial on-chip memory  240,123,904 bits of RAM provide large buffers and storage for high-throughput dataflows without immediate reliance on external memory.
  • Broad industrial operating range  Rated from −40 °C to 100 °C to meet the thermal requirements of industrial deployments.
  • Flexible I/O and packaging  296 general-purpose I/Os in a 2912-BBGA footprint support dense routing and connectivity in compact board designs.
  • Protocol-ready IP  Family-level hardened PCIe Gen3 and multi-rate Ethernet MACs simplify integration of standard high-speed interfaces in hardware.

Why Choose 1ST280EY1F55I1VG?

The 1ST280EY1F55I1VG Stratix 10 TX FPGA positions itself as a high-density, high-bandwidth programmable platform for engineers building demanding systems. With 2.8 million logic elements, extensive on-chip memory, and family-level hardened high-speed interface IP, it supports large-scale designs that require integrated transceiver capability and substantial processing resources.

This device is suitable for teams needing a scalable FPGA foundation for networking, telecom, data-center acceleration, or instrumentation applications—where high logic capacity, robust thermal range, and advanced transceiver architecture are key design drivers. The Stratix 10 TX family feature set enables long-term design scalability and reduces the need for extensive external protocol handling.

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