1ST280EY1F55I1VG
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 296 2800000 2912-BBGA, FCBGA |
|---|---|
| Quantity | 973 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2912-FBGA, FC (55x55) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2912-BBGA, FCBGA | Number of I/O | 296 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1ST280EY1F55I1VG – Stratix® 10 TX FPGA, 2912-BBGA (Industrial)
The 1ST280EY1F55I1VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) in a 2912-BBGA FCBGA package designed for high-density, high-bandwidth system designs. It combines a monolithic 14 nm FPGA fabric with Stratix 10 TX family innovations—including HyperFlex core architecture and heterogeneous 3D SiP transceiver tiles—to target demanding applications that require large logic capacity, extensive on-chip memory, and advanced high-speed serial connectivity.
This device is specified for industrial operation and offers a broad supply voltage range and thermal tolerance suited to robust applications where sustained performance and integration of hardened interface features are required.
Key Features
- HyperFlex Core Architecture Intel HyperFlex core architecture delivers significantly improved core performance compared to previous-generation devices according to the Stratix 10 TX family overview.
- High Logic Density Contains 2,800,000 logic elements, enabling complex, large-scale FPGA designs and substantial programmable logic resources on a single device.
- Large On-Chip Memory Provides 240,123,904 total RAM bits for deep buffering, large lookup tables, and memory-intensive algorithms.
- Advanced Transceivers Stratix 10 TX family transceivers support dual-mode operation (PAM4 and NRZ) and high single-lane data rates; family-level architecture supports many high-speed channels on heterogeneous 3D SiP transceiver tiles.
- Hardened Interface IP Family documentation describes hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks with dedicated FEC options—allowing integration of common high-speed protocols in hardware.
- DSP and Memory Subsystems Includes family-level hardened variable precision DSP blocks and internal embedded memory blocks suitable for signal processing and computational workloads.
- Package and I/O Surface-mount 2912-BBGA (2912-FBGA, FC 55×55) package with 296 I/Os for flexible board-level integration and routing.
- Power and Thermal Core supply voltage range specified at 770 mV to 970 mV and an operating temperature range of −40 °C to 100 °C for industrial environments.
- RoHS Compliant Device is listed as RoHS compliant.
Typical Applications
- High‑performance networking and switching Use the large logic capacity and family-level hardened Ethernet MACs with FEC to implement high-throughput packet processing, line cards, and aggregation switches.
- Telecommunications and optical transport Dual-mode, high-speed transceivers and large on-chip memory make this device suitable for backplane and module-level transport functions requiring PAM4/NRZ serial links.
- Data center acceleration The combination of massive logic resources and DSP blocks supports custom acceleration and offload engines for compute and storage systems.
- Test, measurement and instrumentation High I/O count, wide memory, and advanced timing/clocking features in the family enable precision data capture and real-time processing in instrumentation platforms.
Unique Advantages
- Highly integrated package Monolithic 14 nm core fabric combined with 3D SiP transceiver tiles delivers system-level integration that reduces external component count.
- Extreme logic capacity 2,800,000 logic elements provide headroom for large FPGA designs, complex protocol stacks, and multi-function systems on a single device.
- Substantial on-chip memory 240,123,904 bits of RAM provide large buffers and storage for high-throughput dataflows without immediate reliance on external memory.
- Broad industrial operating range Rated from −40 °C to 100 °C to meet the thermal requirements of industrial deployments.
- Flexible I/O and packaging 296 general-purpose I/Os in a 2912-BBGA footprint support dense routing and connectivity in compact board designs.
- Protocol-ready IP Family-level hardened PCIe Gen3 and multi-rate Ethernet MACs simplify integration of standard high-speed interfaces in hardware.
Why Choose 1ST280EY1F55I1VG?
The 1ST280EY1F55I1VG Stratix 10 TX FPGA positions itself as a high-density, high-bandwidth programmable platform for engineers building demanding systems. With 2.8 million logic elements, extensive on-chip memory, and family-level hardened high-speed interface IP, it supports large-scale designs that require integrated transceiver capability and substantial processing resources.
This device is suitable for teams needing a scalable FPGA foundation for networking, telecom, data-center acceleration, or instrumentation applications—where high logic capacity, robust thermal range, and advanced transceiver architecture are key design drivers. The Stratix 10 TX family feature set enables long-term design scalability and reduces the need for extensive external protocol handling.
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