1ST280EU3F50I3XG

The 1ST280EU3F50I3XG is an Intel Stratix® 10 TX field programmable gate array supplied in a 2397-ball FCBGA package. It combines a high-density monolithic core with Stratix 10 TX series innovations such as the HyperFlex core architecture and heterogeneous transceiver tiles to address demanding, high-bandwidth system designs.

Designed for industrial-grade applications, this device offers 2,800,000 logic elements, 240,123,904 bits of on-chip RAM, and up to 440 general-purpose I/O. Its capabilities target high-performance networking, datacenter, and communications systems where integrated bandwidth, logic capacity, and robust power/thermal behavior matter.

Key Features

• Core & Architecture  HyperFlex core architecture derived from the Stratix 10 TX family, providing high core performance in a monolithic 14 nm fabric.
• Logic Capacity  2,800,000 logic elements for complex, high-density logic implementations and large-scale FPGA designs.
• On‑chip Memory  240,123,904 total RAM bits to support large buffering, packet processing, and dataflow-centric architectures.
• Transceivers & Bandwidth  Stratix 10 TX devices feature dual-mode transceivers capable of PAM4 and NRZ operation; the family supports very high aggregate bandwidth for high-speed serial links (details described in the Stratix 10 TX device overview).
• I/O  440 general-purpose I/O pins to interface with external memory, peripherals, and system I/O requirements.
• Package & Mounting  2397-BBGA (FCBGA) supplier package; supplier device package listed as 2397-FBGA, FC (50×50). Surface-mount mounting type for standard PCB assembly processes.
• Power Supply  Core voltage specified between 820 mV and 880 mV to match Stratix 10 TX power domains.
• Operating Temperature  Industrial-grade operating range from −40°C to 100°C for deployment in demanding thermal environments.
• Compliance  RoHS compliant.

Typical Applications

• High-speed Communications  Use in network line cards and transceiver-rich modules that require large logic capacity and high aggregate serial bandwidth.
• Data Center Networking  Packet processing, switching, and aggregation systems that benefit from abundant on-chip RAM and extensive I/O.
• Telecommunications Infrastructure  Baseband and fronthaul/transport equipment where deterministic performance and industrial temperature operation are required.
• High-performance Compute & Acceleration  Hardware acceleration and DSP-intensive tasks leveraging the device’s high logic density and memory resources.

Unique Advantages

• High-density programmable fabric: 2,800,000 logic elements enable consolidation of complex system functions into a single FPGA, reducing board-level component count.
• Large on-chip memory: 240,123,904 bits of RAM support deep buffering and data-path storage without immediate dependence on external memory.
• Extensive I/O count: 440 I/O pins provide flexibility for broad peripheral and memory interfacing, simplifying system routing and partitioning.
• Industrial temperature rating: −40°C to 100°C operation supports deployment in industrial and demanding environmental conditions.
• Compact FCBGA package: 2397-ball FCBGA (50×50) balances die integration with standard surface-mount assembly for dense system designs.
• RoHS compliant: Meets environmental compliance expectations for new designs.

Why Choose 1ST280EU3F50I3XG?

The 1ST280EU3F50I3XG offers a combination of very high logic density, substantial on-chip RAM, and large I/O in a single industrial-grade FCBGA package. It aligns with Stratix 10 TX family capabilities—delivering the core architecture and transceiver-focused innovations featured across the series—making it suitable for designers tackling high-bandwidth communications, data center, and telecom infrastructure challenges.

For teams building systems that require scalability, significant programmable resources, and industrial temperature operation, this FPGA provides a platform that consolidates functionality while supporting complex I/O and memory needs. Its electrical and thermal specifications enable integration into robust production-grade designs.

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