1ST280EU3F50I3XG
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 2800000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 763 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 440 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1ST280EU3F50I3XG – Stratix® 10 TX FPGA IC, 2,800,000 logic elements, 440 I/O, 2397-BBGA
The 1ST280EU3F50I3XG is an Intel Stratix® 10 TX field programmable gate array supplied in a 2397-ball FCBGA package. It combines a high-density monolithic core with Stratix 10 TX series innovations such as the HyperFlex core architecture and heterogeneous transceiver tiles to address demanding, high-bandwidth system designs.
Designed for industrial-grade applications, this device offers 2,800,000 logic elements, 240,123,904 bits of on-chip RAM, and up to 440 general-purpose I/O. Its capabilities target high-performance networking, datacenter, and communications systems where integrated bandwidth, logic capacity, and robust power/thermal behavior matter.
Key Features
- Core & Architecture HyperFlex core architecture derived from the Stratix 10 TX family, providing high core performance in a monolithic 14 nm fabric.
- Logic Capacity 2,800,000 logic elements for complex, high-density logic implementations and large-scale FPGA designs.
- On‑chip Memory 240,123,904 total RAM bits to support large buffering, packet processing, and dataflow-centric architectures.
- Transceivers & Bandwidth Stratix 10 TX devices feature dual-mode transceivers capable of PAM4 and NRZ operation; the family supports very high aggregate bandwidth for high-speed serial links (details described in the Stratix 10 TX device overview).
- I/O 440 general-purpose I/O pins to interface with external memory, peripherals, and system I/O requirements.
- Package & Mounting 2397-BBGA (FCBGA) supplier package; supplier device package listed as 2397-FBGA, FC (50×50). Surface-mount mounting type for standard PCB assembly processes.
- Power Supply Core voltage specified between 820 mV and 880 mV to match Stratix 10 TX power domains.
- Operating Temperature Industrial-grade operating range from −40°C to 100°C for deployment in demanding thermal environments.
- Compliance RoHS compliant.
Typical Applications
- High-speed Communications Use in network line cards and transceiver-rich modules that require large logic capacity and high aggregate serial bandwidth.
- Data Center Networking Packet processing, switching, and aggregation systems that benefit from abundant on-chip RAM and extensive I/O.
- Telecommunications Infrastructure Baseband and fronthaul/transport equipment where deterministic performance and industrial temperature operation are required.
- High-performance Compute & Acceleration Hardware acceleration and DSP-intensive tasks leveraging the device’s high logic density and memory resources.
Unique Advantages
- High-density programmable fabric: 2,800,000 logic elements enable consolidation of complex system functions into a single FPGA, reducing board-level component count.
- Large on-chip memory: 240,123,904 bits of RAM support deep buffering and data-path storage without immediate dependence on external memory.
- Extensive I/O count: 440 I/O pins provide flexibility for broad peripheral and memory interfacing, simplifying system routing and partitioning.
- Industrial temperature rating: −40°C to 100°C operation supports deployment in industrial and demanding environmental conditions.
- Compact FCBGA package: 2397-ball FCBGA (50×50) balances die integration with standard surface-mount assembly for dense system designs.
- RoHS compliant: Meets environmental compliance expectations for new designs.
Why Choose 1ST280EU3F50I3XG?
The 1ST280EU3F50I3XG offers a combination of very high logic density, substantial on-chip RAM, and large I/O in a single industrial-grade FCBGA package. It aligns with Stratix 10 TX family capabilities—delivering the core architecture and transceiver-focused innovations featured across the series—making it suitable for designers tackling high-bandwidth communications, data center, and telecom infrastructure challenges.
For teams building systems that require scalability, significant programmable resources, and industrial temperature operation, this FPGA provides a platform that consolidates functionality while supporting complex I/O and memory needs. Its electrical and thermal specifications enable integration into robust production-grade designs.
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