1ST280EU2F50I2VGAS

IC FPGA 440 I/O 2397BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 2800000 2397-BBGA, FCBGA

Quantity 256 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O440Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1ST280EU2F50I2VGAS – Stratix® 10 TX FPGA, 2397-BBGA FCBGA, 2.8M logic elements

The 1ST280EU2F50I2VGAS is an Intel Stratix® 10 TX field programmable gate array in a 2397-BBGA FCBGA package. It combines a high-density FPGA fabric with the Stratix 10 TX device family innovations—including the HyperFlex® core architecture and high-speed, dual‑mode transceivers—to address demanding bandwidth- and compute‑centric system designs.

This device is aimed at industrial applications requiring large logic capacity, extensive on-chip RAM, and high port density, providing a platform for high-performance networking, data center interconnects, and advanced communications subsystems.

Key Features

  • Core Logic  2,800,000 logic elements provide very large programmable capacity for complex FPGA implementations.
  • On‑Chip Memory  Total RAM of 240,123,904 bits supports large buffering, packet processing, and state storage requirements.
  • I/O Density  440 I/O pins enable extensive interfacing for high‑port-count designs and complex board-level connectivity.
  • High‑Speed Transceiver Technology  Stratix 10 TX series supports dual‑mode transceivers capable of 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation for chip‑to‑chip, chip‑to‑module, and backplane links.
  • Aggregate Bandwidth  Series architecture is designed to deliver multi‑Tbps aggregate bandwidth to meet next‑generation system throughput needs.
  • Power Supply  Core voltage range of 770–970 mV accommodates low‑voltage system designs and power-optimized architectures.
  • Package & Mounting  2397‑BBGA (FCBGA, 50×50) package, surface‑mount, for high-density board integration.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Reliability & Security (Series Features)  Stratix 10 TX family documentation highlights features such as device security, configuration management, and single‑event upset detection and correction.

Typical Applications

  • High‑Performance Networking  Use for line cards, packet processors, and switch fabrics where large logic capacity, on‑chip RAM, and high aggregate bandwidth are required.
  • Data Center Interconnects  Suitable for optical transceiver aggregation, protocol bridging, and backplane interfaces leveraging the device family’s high‑speed transceivers.
  • Telecom & Carrier Systems  Implement channel aggregation, FEC, and protocol acceleration across high‑speed links in carrier-grade equipment.
  • High‑Speed Board‑Level Interfaces  Ideal for chip‑to‑chip and chip‑to‑module links in systems that require PAM4 or NRZ transceiver modes.

Unique Advantages

  • Extreme Logic Density:  2.8 million logic elements allow consolidation of multiple functions into a single device, reducing BOM and board complexity.
  • Large On‑Chip RAM:  240+ million bits of RAM support deep buffering and high‑performance dataflow without relying solely on external memory.
  • High I/O Count:  440 I/Os provide flexibility for complex system interfaces and high port counts without multiple devices.
  • Advanced Transceiver Flexibility:  Dual‑mode transceivers support both PAM4 and NRZ signaling, enabling compatibility with a range of high‑speed link standards and topologies.
  • Industrial Temperature Range:  Operation from −40 °C to 100 °C simplifies thermal planning for industrial deployments.
  • Compact High‑Density Package:  2397‑BBGA FCBGA provides a compact footprint for dense board designs while supporting the device’s extensive I/O and routing needs.

Why Choose 1ST280EU2F50I2VGAS?

The 1ST280EU2F50I2VGAS brings Stratix 10 TX family capabilities into a single, high‑density FPGA—combining large logic capacity, substantial on‑chip RAM, and extensive I/O in an industrial‑grade package. Its low core voltage and advanced transceiver options target systems that must balance performance with power efficiency and high link speeds.

This device is well suited to engineering teams building bandwidth‑intensive communications, networking, and data center equipment that require scalable logic resources, deep on‑chip memory, and robust thermal tolerance. Choosing this FPGA supports long‑term design scalability within the Stratix 10 TX family and access to documented family‑level features for configuration, security, and reliability.

If you would like pricing, availability, or a formal quote for 1ST280EU2F50I2VGAS, request a quote or submit your requirements and a sales representative will respond with details.

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