1ST280EU3F50E3XG

The 1ST280EU3F50E3XG is an Intel Stratix 10 TX field programmable gate array (FPGA) delivered in a 2397‑ball FCBGA package. It integrates a monolithic 14 nm HyperFlex® core fabric with a large logic capacity and extensive on-chip memory to address demanding high‑bandwidth system designs.

Targeted at applications that require dense logic, massive internal RAM, and high‑speed serial connectivity, this device provides a platform for next‑generation communications, backplane and module interfaces, and compute‑intensive FPGA implementations while operating within a specified 0 °C to 100 °C temperature range and an 820 mV–880 mV core supply window.

Key Features

• Core Architecture  HyperFlex® core architecture implemented in Intel 14 nm tri‑gate (FinFET) technology; monolithic fabric supporting up to 2,800,000 logic elements for high logic density.
• Logic and Memory  2,800,000 logic elements and 240,123,904 total RAM bits (on‑die memory resources and M20K blocks referenced in the device family) to support large, stateful designs.
• High‑Speed Transceivers  Dual‑mode transceivers in the Stratix 10 TX family support PAM4 up to 57.8 Gbps and NRZ up to 28.9 Gbps for chip‑to‑chip, chip‑to‑module, and backplane links; family supports up to 144 full‑duplex transceiver channels.
• Hard IP Blocks  Hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC blocks (with Reed–Solomon FEC variants noted in the device family) to simplify high‑throughput interface implementation.
• Embedded Processing and DSP  The Stratix 10 TX family includes options with an embedded quad‑core 64‑bit Arm Cortex‑A53 hard processor system and hardened floating point DSP blocks in select devices.
• Package & I/O  2397‑ball BGA (FCBGA) package (supplier package: 2397‑FBGA, FC 50×50) with 440 I/O pins and surface‑mount package type for dense board integration.
• Power and Clocking  Fractional synthesis PLLs and ultra‑low jitter LC tank transmit PLLs are documented for precise clocking; device core supply specified from 820 mV to 880 mV.
• Temperature & Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C and RoHS compliance.

Typical Applications

• Telecom and Networking Equipment  High‑speed backplane, module and chip‑to‑chip links using PAM4/NRZ transceivers and hardened Ethernet MACs for multi‑Tbps switching and transport.
• Data Center Infrastructure  Accelerators and PCIe‑attached functions leveraging hardened PCI Express Gen3 IP and large logic/memory resources for data plane and control plane tasks.
• High‑Performance Interconnects  Chip‑to‑module and backplane interface implementations that require many high‑rate serial channels and deterministic clocking.
• Compute‑Intensive FPGA Designs  Large logic capacity and abundant on‑die RAM for algorithms that demand extensive parallelism and local memory.

Unique Advantages

• Large Logic Capacity:  2.8 million logic elements enable high‑density designs and consolidate multiple functions into a single device.
• Massive On‑Die RAM:  240,123,904 total RAM bits support deep buffering, large state machines, and memory‑intensive algorithms without immediate external memory dependence.
• High‑Rate SerDes:  Dual‑mode transceivers capable of PAM4 and NRZ operation provide flexibility for evolving link standards and high aggregate bandwidth.
• Integrated Interface IP:  Hardened PCIe and Ethernet MAC blocks reduce design time and risk for common high‑throughput interfaces.
• Compact, Surface‑Mount Package:  2397‑ball FCBGA (50×50) package with 440 I/Os allows dense board layouts while supporting extensive routing for high‑pin‑count designs.
• Documented Power and Clocking:  Core supply range and advanced PLL options support precise timing and power planning for complex systems.

Why Choose 1ST280EU3F50E3XG?

The 1ST280EU3F50E3XG brings a combination of large logic capacity, substantial internal RAM, and family‑level high‑speed transceiver capability in a single Stratix 10 TX FCBGA package. Its HyperFlex core architecture and documented hardened interface IP make it suitable for designs that require dense FPGA logic, deterministic clocking, and multi‑Gbps serial connectivity.

This device is well suited to engineering teams building next‑generation communications equipment, high‑bandwidth interconnects, and compute‑intensive FPGA subsystems that benefit from on‑chip resources, integrated IP, and an extended operating temperature range.

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