1ST280EU3F50E3VG

The 1ST280EU3F50E3VG is an Intel Stratix® 10 TX field programmable gate array packaged in a 2397-BBGA FCBGA. It combines the Intel Hyperflex® core architecture and advanced packaging technology to deliver large fabric capacity and high-speed serial connectivity for demanding system designs.

Designed for high-bandwidth, compute- and I/O-intensive applications, this device provides 2,800,000 logic elements, extensive on-chip RAM, hardened IP blocks and high-rate transceivers suited to communications, networking and compute acceleration use cases.

Key Features

• Core and Architecture  Intel Hyperflex® core architecture implemented in Intel 14 nm tri-gate (FinFET) technology, providing the architecture foundation described for Stratix 10 TX devices.
• Logic Capacity  2,800,000 logic elements (LEs) for large-scale logic integration and complex design partitioning.
• On‑Chip Memory  Total RAM capacity of 240,123,904 bits, with support for embedded SRAM and M20K memory blocks referenced for Stratix 10 TX devices.
• High-Speed Transceivers  Dual-mode transceivers capable of PAM4 at 57.8 Gbps and NRZ at 28.9 Gbps, supporting chip-to-chip, chip-to-module and backplane applications and up to 144 full-duplex channels in the device family.
• Hardened IP and Processing  Family-level features include hardened PCI Express Gen3 and high-speed Ethernet MACs with Reed-Solomon FEC options; select devices can include an embedded quad-core 64-bit Arm Cortex‑A53 HPS.
• I/O and Package  440 I/O pins in a surface-mount FCBGA package (2397-BBGA / supplier package 2397-FBGA, FC 50×50) for dense routing and system integration.
• Power and Clocking  Core supply voltage range specified from 770 mV to 970 mV and fractional synthesis and low-jitter PLL architectures referenced for precise clock generation.
• Operating Range and Compliance  Extended grade device with an operating temperature range of 0 °C to 100 °C and RoHS compliance.

Typical Applications

• High-speed Networking & Switches  Implements large switching fabrics and packet-processing pipelines using massive logic and hardened Ethernet MAC/FEC IP.
• Data Center Interconnects  Supports high aggregate bandwidth and dual-mode transceivers for module and backplane links in data center equipment.
• Telecommunications Infrastructure  Suitable for transport and aggregation systems that require multi-gigabit serial links and large on‑chip memory for buffering and FEC.
• Compute Acceleration & DSP  Large logic and memory resources plus hardened DSP capabilities (as described for the Stratix 10 TX family) enable hardware acceleration and signal processing tasks.

Unique Advantages

• Highly integrated fabric: 2,800,000 logic elements and extensive on‑chip RAM reduce external component count and simplify board-level design.
• High-speed serial capability: Dual-mode transceivers (PAM4 and NRZ) and family-level support for up to 144 full-duplex channels enable versatile, high-bandwidth links.
• Hardened networking and I/O IP: Built-in PCIe Gen3 and high-rate Ethernet MACs with FEC reduce integration time and improve system determinism.
• Compact, manufacturable package: 2397-BBGA FCBGA surface-mount package (50×50 supplier outline) allows dense integration in space-constrained systems.
• Power and clock flexibility: Narrow core supply window (770 mV–970 mV) and advanced PLL options support optimized power/clock tradeoffs.
• Extended-grade reliability: Extended grade rating and a 0 °C to 100 °C operating range accommodate typical commercial and some constrained industrial environments.

Why Choose 1ST280EU3F50E3VG?

The 1ST280EU3F50E3VG positions itself as a high-capacity Stratix 10 TX device suited to designs that require a combination of massive programmable logic, substantial on-chip memory and multi-gigabit serial connectivity. Its Hyperflex-based architecture, family-level hardened IP and advanced transceiver capabilities make it appropriate for networking, telecom and compute-acceleration applications where integration density and high I/O bandwidth are key.

Choosing this part provides a scalable hardware foundation: designers can leverage the large logic element count and memory footprint to consolidate functions on a single device while using the device family’s hardened interfaces and transceiver options to simplify system-level integration and speed time-to-market.

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