1ST280EU3F50I3VG

IC FPGA 440 I/O 2397BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 2800000 2397-BBGA, FCBGA

Quantity 401 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O440Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1ST280EU3F50I3VG – Stratix® 10 TX FPGA, 2,800,000 logic elements, 440 I/O

The 1ST280EU3F50I3VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) supplied in a 2397-BBGA FCBGA package. This industrial-grade device integrates a high-performance monolithic core fabric and supports advanced transceiver and interface capabilities targeted at high-bandwidth, system-level designs.

Designed for applications that require large FPGA fabrics and extensive I/O, the part pairs up to 2,800,000 logic elements and 240,123,904 total RAM bits with 440 I/O pins, offering a platform for complex, high-density programmable logic and system integration.

Key Features

  • Core Architecture  Monolithic Stratix® 10 TX fabric with the Intel HyperFlex® core architecture as described in the device family overview, delivering a substantial performance-focused FPGA fabric; device-specific logic capacity is 2,800,000 logic elements.
  • Memory  Large on-chip RAM capacity with 240,123,904 total RAM bits to support extensive buffering, state machines, and large on-chip data structures.
  • Transceivers & High-Speed I/O  Series-level transceiver innovations include dual-mode operation (PAM4 and NRZ) and high line-rate capability; the Stratix 10 TX family supports up to 144 full-duplex transceiver channels (family-level specification).
  • Logic I/O  440 user I/O pins provide broad connectivity for external interfaces, peripherals, and high-speed signaling.
  • Package & Mounting  2397-BBGA (FCBGA) package, supplier device package listed as 2397-FBGA, FC (50×50); surface-mount configuration for board-level assembly.
  • Power  Core voltage supply range specified at 770 mV–970 mV.
  • Operating Temperature  Industrial-grade operating range from −40 °C to 100 °C, suitable for systems requiring extended temperature performance.
  • System Integration Features  Family-level features in the Stratix 10 TX overview include hardened PCI Express Gen3 and high-performance Ethernet MACs, embedded memory blocks, and optional embedded processor subsystems in select devices.
  • Compliance  RoHS compliant.

Typical Applications

  • High‑bandwidth networking and switching  Large logic capacity, extensive I/O, and family-level high-speed transceivers support packet processing, MAC/FEC implementations, and backplane or chip‑to‑module links.
  • Telecom and data center infrastructure  Industrial temperature range and series transceiver options enable use in routers, optical transport, and line-card applications.
  • Compute acceleration and system integration  Deep on-chip RAM and abundant logic elements suit algorithm acceleration, data-plane processing, and integration with embedded processor subsystems available in select family members.
  • High-speed test and measurement  Large fabric and high-density I/O enable complex signal processing and protocol handling for advanced instrumentation.

Unique Advantages

  • Massive programmable fabric: 2,800,000 logic elements provide the scale needed for complex, multi-function designs and deep pipelining.
  • Extensive on-chip RAM: 240,123,904 total RAM bits reduce dependence on external memory for many buffering and processing tasks.
  • Broad I/O and package density: 440 I/O pins in a 2397-BBGA FCBGA package enable high signal density while keeping PCB area optimized.
  • Industrial temperature support: Specified operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Family-level high-speed connectivity: Stratix 10 TX series features (including high-rate PAM4/NRZ transceivers and hardened interface IP) support demanding bandwidth requirements.
  • RoHS compliant: Meets common regulatory requirements for material compliance.

Why Choose 1ST280EU3F50I3VG?

The 1ST280EU3F50I3VG delivers a very large Stratix 10 TX FPGA fabric with substantial on-chip memory and extensive I/O, packaged for surface-mount assembly in a high-density 2397-BBGA FCBGA. Its industrial temperature rating and defined core voltage range make it suitable for robust, high-performance programmable systems that require scalability and integration.

This part is well suited for designers building high-bandwidth networking equipment, telecom infrastructure, compute accelerators, and advanced instrumentation that need a combination of large logic capacity, significant RAM resources, and broad I/O connectivity. The device draws on Stratix 10 TX family features to provide system-level integration and performance for complex, long-lived designs.

Request a quote or submit an inquiry to evaluate 1ST280EU3F50I3VG for your next high-performance FPGA design.

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