1ST280EU3F50I3VG
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 2800000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 401 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 440 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1ST280EU3F50I3VG – Stratix® 10 TX FPGA, 2,800,000 logic elements, 440 I/O
The 1ST280EU3F50I3VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) supplied in a 2397-BBGA FCBGA package. This industrial-grade device integrates a high-performance monolithic core fabric and supports advanced transceiver and interface capabilities targeted at high-bandwidth, system-level designs.
Designed for applications that require large FPGA fabrics and extensive I/O, the part pairs up to 2,800,000 logic elements and 240,123,904 total RAM bits with 440 I/O pins, offering a platform for complex, high-density programmable logic and system integration.
Key Features
- Core Architecture Monolithic Stratix® 10 TX fabric with the Intel HyperFlex® core architecture as described in the device family overview, delivering a substantial performance-focused FPGA fabric; device-specific logic capacity is 2,800,000 logic elements.
- Memory Large on-chip RAM capacity with 240,123,904 total RAM bits to support extensive buffering, state machines, and large on-chip data structures.
- Transceivers & High-Speed I/O Series-level transceiver innovations include dual-mode operation (PAM4 and NRZ) and high line-rate capability; the Stratix 10 TX family supports up to 144 full-duplex transceiver channels (family-level specification).
- Logic I/O 440 user I/O pins provide broad connectivity for external interfaces, peripherals, and high-speed signaling.
- Package & Mounting 2397-BBGA (FCBGA) package, supplier device package listed as 2397-FBGA, FC (50×50); surface-mount configuration for board-level assembly.
- Power Core voltage supply range specified at 770 mV–970 mV.
- Operating Temperature Industrial-grade operating range from −40 °C to 100 °C, suitable for systems requiring extended temperature performance.
- System Integration Features Family-level features in the Stratix 10 TX overview include hardened PCI Express Gen3 and high-performance Ethernet MACs, embedded memory blocks, and optional embedded processor subsystems in select devices.
- Compliance RoHS compliant.
Typical Applications
- High‑bandwidth networking and switching Large logic capacity, extensive I/O, and family-level high-speed transceivers support packet processing, MAC/FEC implementations, and backplane or chip‑to‑module links.
- Telecom and data center infrastructure Industrial temperature range and series transceiver options enable use in routers, optical transport, and line-card applications.
- Compute acceleration and system integration Deep on-chip RAM and abundant logic elements suit algorithm acceleration, data-plane processing, and integration with embedded processor subsystems available in select family members.
- High-speed test and measurement Large fabric and high-density I/O enable complex signal processing and protocol handling for advanced instrumentation.
Unique Advantages
- Massive programmable fabric: 2,800,000 logic elements provide the scale needed for complex, multi-function designs and deep pipelining.
- Extensive on-chip RAM: 240,123,904 total RAM bits reduce dependence on external memory for many buffering and processing tasks.
- Broad I/O and package density: 440 I/O pins in a 2397-BBGA FCBGA package enable high signal density while keeping PCB area optimized.
- Industrial temperature support: Specified operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
- Family-level high-speed connectivity: Stratix 10 TX series features (including high-rate PAM4/NRZ transceivers and hardened interface IP) support demanding bandwidth requirements.
- RoHS compliant: Meets common regulatory requirements for material compliance.
Why Choose 1ST280EU3F50I3VG?
The 1ST280EU3F50I3VG delivers a very large Stratix 10 TX FPGA fabric with substantial on-chip memory and extensive I/O, packaged for surface-mount assembly in a high-density 2397-BBGA FCBGA. Its industrial temperature rating and defined core voltage range make it suitable for robust, high-performance programmable systems that require scalability and integration.
This part is well suited for designers building high-bandwidth networking equipment, telecom infrastructure, compute accelerators, and advanced instrumentation that need a combination of large logic capacity, significant RAM resources, and broad I/O connectivity. The device draws on Stratix 10 TX family features to provide system-level integration and performance for complex, long-lived designs.
Request a quote or submit an inquiry to evaluate 1ST280EU3F50I3VG for your next high-performance FPGA design.

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