1ST280EY1F55E1VG

IC FPGA 296 I/O 2912BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 296 2800000 2912-BBGA, FCBGA

Quantity 428 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2912-FBGA, FC (55x55)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2912-BBGA, FCBGANumber of I/O296Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1ST280EY1F55E1VG – Stratix® 10 TX FPGA, 2,800,000 Logic Elements, 2912-BBGA (55×55)

The 1ST280EY1F55E1VG is an Intel Stratix® 10 TX field programmable gate array supplied in a 2912-BBGA FCBGA package (supplier package: 2912-FBGA, FC 55×55). It provides a high-density FPGA fabric with 2,800,000 logic elements and large on-chip memory, designed for designs that require substantial logic capacity and integrated high-speed interfaces.

As part of the Stratix 10 TX family, this device leverages the HyperFlex® core architecture and dual‑mode transceivers to address high-bandwidth applications such as networking, telecommunications, and high-performance compute acceleration, while offering extended-grade operation and RoHS compliance.

Key Features

  • Logic Capacity  2,800,000 logic elements for complex, high-density designs.
  • Memory  240,123,904 total RAM bits of on-chip memory to support large buffering and in‑fabric data storage.
  • High-Speed Transceivers  Dual-mode transceivers supporting PAM4 up to 57.8 Gbps and NRZ up to 28.9 Gbps as described for Stratix 10 TX devices, enabling chip-to-chip, chip-to-module, and backplane applications.
  • Aggregate Bandwidth  Stratix 10 TX family devices can deliver aggregate transceiver bandwidth suitable for multi-terabit applications (series-level capability described in product documentation).
  • I/O and Packaging  296 I/O pins in a surface-mount 2912-BBGA (2912-FBGA, FC 55×55) package to support extensive external interfacing.
  • Power and Operating Range  Core voltage supply: 770 mV to 970 mV; operating temperature range: 0 °C to 100 °C; device grade: Extended.
  • System Integration  Family-level features include hardened IP blocks such as PCI Express Gen3 and Ethernet MACs, and options for embedded processor subsystems in select devices (series documentation).
  • Compliance  RoHS compliant materials.

Typical Applications

  • Data Center & Networking  High logic density and high-speed transceivers make the device suitable for switches, routers, and packet-processing engines where large logic and memory resources are required.
  • Telecommunications & Optical Transport  Dual-mode transceivers and family-level Reed-Solomon FEC support enable use in backplane and optical line systems needing PAM4 or NRZ signaling.
  • High-Performance Compute Acceleration  Large on-chip memory and extensive logic enable custom accelerators and compute offload functions for data-intensive workloads.
  • Test, Measurement & Protocol Processing  High I/O count and programmable fabric support complex protocol handling, aggregation, and real-time processing tasks.

Unique Advantages

  • High Logic Density: 2,800,000 logic elements provide headroom for very large, integrated FPGA designs and complex algorithms.
  • Substantial On-Chip Memory: 240,123,904 RAM bits support deep buffering, large lookup tables, and in‑fabric data structures without relying on external memory.
  • Flexible High-Speed I/O: Dual-mode transceivers (PAM4 and NRZ) enable flexible deployment across chip-to-chip, module, and backplane topologies.
  • Robust Packaging and I/O Count: The 2912-BBGA (2912-FBGA, FC 55×55) surface-mount package with 296 I/O supports dense board-level integration.
  • Extended Temperature Grade: Rated for 0 °C to 100 °C operation to meet a range of commercial and enterprise environmental conditions.
  • Standards-Oriented Family Capabilities: Family documentation highlights hardened PCIe and Ethernet MAC IP options, enabling integration with common high-speed standards.

Why Choose 1ST280EY1F55E1VG?

The 1ST280EY1F55E1VG combines very high logic density, large on-chip memory, and versatile high-speed transceiver capability in a single Stratix 10 TX device package. Its extended-grade rating, surface-mount 2912-BBGA package, and broad I/O count make it a strong candidate for enterprise networking, telecom infrastructure, and compute-acceleration applications that require integrated, high-bandwidth programmable logic.

Choosing this device provides scalability within the Stratix 10 TX family and access to series-level architectural features such as the HyperFlex® core architecture and dual-mode transceivers, supporting development of long-lived designs that demand both logic capacity and high I/O throughput.

Request a quote or submit a product inquiry to learn about availability, pricing, and engineering support for the 1ST280EY1F55E1VG.

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