1ST280EY1F55E2LG

The 1ST280EY1F55E2LG is a Stratix® 10 TX FPGA in a 2912-BBGA (FCBGA) package designed for high-density, high-bandwidth systems. Based on the Stratix 10 TX architecture, this device combines a monolithic 14 nm core fabric with advanced transceiver tiles and packaging innovations to address demanding communication, compute, and board-level interconnect applications.

With 2,800,000 logic elements, extensive on-chip RAM and hardened IP described in the Stratix 10 TX family overview, this device targets applications that require large programmable logic capacity, significant internal memory, and substantial I/O and transceiver resources while operating within a low core-voltage range.

Key Features

• Core Logic 2,800,000 logic elements (LEs) provide dense programmable logic capacity for large designs and complex algorithms.
• On-Chip Memory 240,123,904 total RAM bits of embedded memory to support large buffering, caching, and data-path requirements.
• I/O Density 296 user I/O pins available in the 2912-BBGA (FCBGA) package for flexible high-pin-count system interfaces.
• Transceiver & Architecture (Series Notes) Stratix 10 TX series devices feature power-efficient, dual-mode transceivers and Intel HyperFlex core architecture as described in the device overview, enabling high aggregate bandwidth in supported system configurations.
• Power Core voltage supply operating range of 820 mV to 880 mV for the FPGA core.
• Package & Mounting 2912-FBGA, FC (55×55) package case, surface-mount mounting type for compact board-level integration.
• Operating Temperature Rated for 0 °C to 100 °C operation (extended grade).
• Compliance RoHS-compliant manufacturing.

Typical Applications

• High-Speed Networking Used in systems that require large programmable fabrics and high aggregate bandwidth for packet processing, switching, or Ethernet MAC/heavy FEC offload as described for the Stratix 10 TX family.
• Data Center and Telecom Equipment Ideal for board-level and module-level designs that need dense logic, large on-chip memory, and many I/O for backplane and chip-to-module interconnects.
• Chip-to-Chip and Chip-to-Module Links Matches designs that leverage the Stratix 10 TX transceiver capabilities for high-rate serial links across board and module boundaries.
• Embedded Compute and Acceleration Suited to FPGA-based acceleration tasks where a high count of logic elements and significant internal RAM enable complex algorithms and large data-path implementations.

Unique Advantages

• High Logic Density: 2.8 million logic elements enable consolidation of large, complex designs into a single device.
• Substantial On-Chip Memory: 240,123,904 total RAM bits reduce dependence on external memory for many buffering and temporary-storage needs.
• Robust I/O Count: 296 I/O pins in the 2912-BBGA package provide flexibility for diverse interface requirements without immediate external multiplexing.
• Advanced Packaging: 2912-FBGA, FC (55×55) package and surface-mount mounting support compact, high-density board layouts.
• Low Core Voltage Operation: Core supply range of 820 mV to 880 mV aligns with modern low-voltage system designs to help manage power delivery.
• Extended Temperature Grade: 0 °C to 100 °C operating range for deployments that require extended commercial-temperature operation.

Why Choose 1ST280EY1F55E2LG?

The 1ST280EY1F55E2LG brings the large logic capacity and memory resources of the Stratix 10 TX family into a 2912-BBGA package suited for high-bandwidth, high-density system designs. Its combination of 2.8 million logic elements, extensive on-chip RAM, and nearly 300 I/O pins makes it a strong option for designs that demand consolidated programmable logic, large data-paths, and flexible interfacing while operating within a low core-voltage envelope.

This device is well suited to engineering teams building next-generation networking, data-center, or compute-acceleration hardware who need scalability of logic and memory resources in a single, surface-mount FPGA package backed by the Stratix 10 TX device architecture.

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