1ST280EU2F50I2VG

IC FPGA 440 I/O 2397BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 2800000 2397-BBGA, FCBGA

Quantity 886 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O440Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1ST280EU2F50I2VG – Stratix® 10 TX FPGA, 2.8M Logic Elements, 2397-BBGA

The 1ST280EU2F50I2VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) device built on the Stratix 10 TX family architecture. It combines a monolithic 14 nm FPGA fabric with high-density logic, large embedded RAM, and advanced transceiver and hard-IP capabilities suited to high-bandwidth, compute- and I/O-intensive designs.

Targeted at industrial-grade applications, this device offers up to 2,800,000 logic elements, 240,123,904 total RAM bits, and 440 general-purpose I/O in a 2397-BBGA (FCBGA) package, with an operating range designed for -40 °C to 100 °C and RoHS compliance.

Key Features

  • Core & architecture  Intel Hyperflex® core architecture with a monolithic core fabric delivering up to 2,800,000 logic elements (LEs), enabling high-density logic implementations.
  • Logic & memory  2,800,000 logic elements and 240,123,904 total RAM bits of on-chip memory for large, complex designs and heavy buffering requirements.
  • High-speed transceivers & interfaces  Dual-mode transceiver capability documented for the Stratix 10 TX family, supporting PAM4 at 57.8 Gbps and NRZ at 28.9 Gbps for demanding serial I/O applications.
  • Hardened IP and processing  Family-level availability of hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC with Reed-Solomon FEC; select devices in the family include an embedded quad-core 64-bit Arm Cortex‑A53 Hard Processor System (HPS).
  • Power and supply  Documented device supply range from 770 mV to 970 mV, reflecting the device’s defined operating voltage window.
  • Package, I/O and mounting  2397-BBGA FCBGA package (supplier package: 2397-FBGA, FC 50×50) with 440 I/O pins; surface-mount package suitable for high-density board designs.
  • Operating and environmental  Industrial-grade operating temperature range from -40 °C to 100 °C and RoHS-compliant status for regulatory conformance.

Typical Applications

  • Data center and network switching  Use the device’s high logic density, large on-chip RAM, and high‑speed transceivers to implement packet processing, switching fabrics, and line-rate Ethernet MAC functions.
  • Telecom and optical transport  Leverage dual-mode PAM4/NRZ transceivers and hardened FEC-enabled Ethernet IP for backplane and long-reach optical line interfaces.
  • High-performance compute acceleration  Deploy large logic and memory resources for custom accelerators and data-path offloads that require substantial on-chip resources and high aggregate bandwidth.
  • Embedded systems with integrated processing  In devices within the family that include the HPS, pair application-class processing with FPGA fabric for control, virtualization, and system integration tasks.

Unique Advantages

  • High-density programmable fabric: 2,800,000 logic elements provide the capacity to consolidate complex system functions into a single FPGA design.
  • Large on-chip memory footprint: 240,123,904 total RAM bits allow significant buffering, caching, and state storage without immediate dependence on external memory.
  • Advanced serial I/O capability: Dual-mode transceiver support for PAM4 and NRZ modalities enables flexible deployment across chip-to-chip, module, and backplane links.
  • Industrial-grade thermal range: Rated for -40 °C to 100 °C operation, suitable for a wide range of industrial environments.
  • System integration-ready packaging: 2397-BBGA FCBGA 50×50 package with 440 I/O simplifies board-level design for high I/O-count systems.
  • Regulatory and supply transparency: RoHS-compliant status and documented supply voltage range (770 mV–970 mV) support procurement and power system planning.

Why Choose 1ST280EU2F50I2VG?

The 1ST280EU2F50I2VG combines the Stratix 10 TX family’s Hyperflex architecture and high-density fabric with extensive on-chip RAM and high-speed transceiver capabilities, delivering a programmable platform targeted at high-bandwidth, compute-intensive industrial applications. Its industrial operating range, surface-mount BBGA package, and comprehensive on-chip resources make it suitable for designers consolidating complex digital, networking, and acceleration functions into a single FPGA solution.

This device is positioned for customers who require scalable logic capacity, substantial embedded memory, and advanced serial I/O within an industrial-grade package, backed by Intel’s Stratix 10 TX family-level features and documentation.

Request a quote or submit a purchase inquiry to receive pricing and availability for 1ST280EU2F50I2VG and to discuss lead time and volume options.

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