1ST280EU2F50I1VGAS

IC FPGA 440 I/O 2397BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 2800000 2397-BBGA, FCBGA

Quantity 343 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O440Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1ST280EU2F50I1VGAS – Stratix® 10 TX FPGA, 2,800,000 logic elements, 440 I/O, 2397-BBGA

The 1ST280EU2F50I1VGAS is an Intel Stratix® 10 TX field programmable gate array (FPGA) supplied in a 2397‑BBGA FCBGA package. This device integrates a high‑performance HyperFlex® core architecture with a large logic fabric and extensive on‑chip memory to address demanding, high‑bandwidth system designs.

Stratix 10 TX devices in this family deliver multi‑terabit aggregate bandwidth through dual‑mode transceivers (PAM4 and NRZ), hardened protocol IP such as PCI Express Gen3 and multi‑rate Ethernet MACs, and advanced packaging technologies—making the device suitable for next‑generation communications, networking and compute applications that require high integration, bandwidth and industrial temperature operation.

Key Features

  • Core Logic  2,800,000 logic elements provide large programmable fabric capacity for complex logic, control and dataplane functions.
  • Advanced Architecture  Intel HyperFlex® core architecture delivering higher core performance compared to previous generations (as described in the device overview).
  • High‑Speed Transceivers  Dual‑mode transceivers supporting up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ for chip‑to‑chip, chip‑to‑module, and backplane links.
  • Hard Protocol IP  Hardened PCI Express Gen3 IP and 10/25/100 Gbps Ethernet MACs with Reed‑Solomon FEC options, enabling high‑speed serial protocol offload.
  • On‑Chip Memory  240,123,904 total RAM bits of internal memory to support large buffering, packet processing and application state storage.
  • I/O and Packaging  440 I/O pins in a 2397‑BBGA (2397‑FBGA, FC 50×50) surface‑mount package for dense board integration.
  • Power and Clocking  Operates from a core voltage supply range of 770 mV to 970 mV and includes fractional synthesis and low‑jitter PLLs (documented in the device overview).
  • Industrial Temperature Grade  Rated for operation from −40°C to 100°C for use in industrial environments.
  • Packaging and Integration  Monolithic 14 nm FPGA fabric combined with heterogeneous 3D SiP transceiver tiles and advanced packaging technology described in the Stratix 10 TX overview.
  • Standards Compliance  RoHS compliant.

Typical Applications

  • High‑Performance Networking  Backplane, chip‑to‑module and line‑card applications that require multi‑terabit switching and 10/25/100 Gbps Ethernet MAC offload.
  • Data Center & Telecom  Aggregation and transport systems that leverage high‑speed PAM4/NRZ transceivers for chip‑to‑chip and chip‑to‑module links.
  • Compute Acceleration  Complex dataflow and signal processing where large logic capacity and abundant on‑chip RAM are needed for packet processing, FEC or DSP pipelines.

Unique Advantages

  • Highly integrated, large FPGA fabric: 2.8 million logic elements and extensive on‑chip RAM reduce external components and simplify system partitioning.
  • Multi‑terabit transceiver capability: Dual‑mode transceivers with PAM4 and NRZ support provide flexible high‑speed links for modern communications topologies.
  • Hardened protocol IP: Built‑in PCIe Gen3 and multi‑rate Ethernet MACs with FEC reduce design effort and accelerate time to market for protocol‑heavy designs.
  • Industrial temperature operation: −40°C to 100°C rating enables deployment in a wide range of industrial environments where extended temperature range is required.
  • Advanced packaging and clocking: 14 nm fabric with heterogeneous SiP transceiver tiles and fractional synthesis PLLs support high performance and low‑jitter clocking for demanding applications.
  • Compliance and manufacturability: Surface‑mount 2397‑BBGA packaging and RoHS compliance facilitate standard production and environmental requirements.

Why Choose 1ST280EU2F50I1VGAS?

The 1ST280EU2F50I1VGAS places a large, HyperFlex®‑based Stratix 10 TX fabric into a high‑density 2397‑BBGA package, combining substantial logic resources, large internal RAM, and high‑speed transceivers for applications that demand both bandwidth and programmable flexibility. Its industrial temperature rating and RoHS compliance make it suitable for robust deployments.

This device is well suited to system designers building high‑bandwidth networking, telecom and compute acceleration platforms who need integrated protocol IP, flexible transceiver modes, and a scalable logic/memory platform backed by the Stratix 10 TX device family documentation and features.

If you would like pricing or availability information for 1ST280EU2F50I1VGAS, request a quote or submit a pricing inquiry and our team will respond with the next steps.

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