1ST280EU2F50E1VG

The 1ST280EU2F50E1VG is a Stratix® 10 TX field-programmable gate array (FPGA) packaged in a 2397-BBGA (FCBGA) surface-mount package. It combines a high-density logic fabric with industry-grade transceiver capabilities and on-chip memory to address designs that require large logic capacity and high aggregate bandwidth.

Built on the Stratix 10 TX family architecture, the device targets high-bandwidth board- and system-level applications such as chip-to-chip, chip-to-module, and backplane interconnects, where dense logic, extensive on-chip RAM, and advanced SERDES capability are required.

Key Features

• Core Logic  2,800,000 logic elements provide very large programmable logic capacity for complex FPGA implementations.
• Architecture  Based on the Stratix 10 TX family architecture, including the HyperFlex core approach described for this device family.
• High-speed Transceivers  Dual-mode transceivers in the family support PAM4 up to 57.8 Gbps and NRZ up to 28.9 Gbps for chip-to-chip, chip-to-module, and backplane use; the family supports up to 144 full-duplex transceiver channels.
• On-chip Memory  240,123,904 total RAM bits available on-chip to support large buffering, packet processing, and stateful logic.
• Hard IP and DSP  Family-level features include hardened PCI Express Gen3 IP, 10/25/100 Gbps Ethernet MAC with Reed-Solomon FEC, and variable-precision/hardened DSP blocks for arithmetic- and signal-processing tasks.
• I/O and Package  440 I/O pins in a 2397-BBGA (supplier package 2397-FBGA, FC 50×50) surface-mount package for high-density board integration.
• Power and Clocking  Supply voltage range: 770 mV to 970 mV; family-level features include fractional synthesis and ultra-low-jitter PLLs for precise clocking.
• Operating Range and Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-speed Networking and Telecom  Backplane, line-card, and module designs that require large logic capacity and multi-gigabit transceiver channels for 10/25/100 Gbps Ethernet and PAM4 links.
• Data Center Infrastructure  Switches, NICs, and accelerator front-ends needing dense logic, substantial on-chip RAM, and hardened PCI Express connectivity.
• Board-level High-speed Interconnects  Chip-to-chip and chip-to-module links where the family’s dual-mode transceivers and high aggregate bandwidth enable low-latency, high-throughput data paths.
• Signal Processing and Acceleration  Compute offload and DSP-heavy functions that leverage the family’s variable-precision DSP blocks and large logic/memory resources.

Unique Advantages

• Very high logic density: 2.8 million logic elements enable implementation of large, complex designs without partitioning across multiple devices.
• Built for high aggregate bandwidth: Dual-mode transceivers and support for many full-duplex channels let designs achieve multi-terabit aggregate throughput.
• Integrated memory resources: 240,123,904 total RAM bits on-chip reduce reliance on external memory for buffering and state storage.
• Hardened I/O and IP: Family-level hard IP for PCI Express and high-speed Ethernet with FEC reduces development time and simplifies integration of industry-standard interfaces.
• Compact, board-ready package: 2397-BBGA surface-mount package with 440 I/O supports dense PCB layouts and high-pin-count system designs.
• Low-voltage operation: 770 mV–970 mV supply range supports designs targeting lower core voltages for power-managed systems.

Why Choose 1ST280EU2F50E1VG?

The 1ST280EU2F50E1VG delivers a combination of very large programmable logic capacity, significant on-chip RAM, and family-level high-speed transceiver technology suitable for bandwidth- and compute-intensive designs. Its extended-grade operating range, surface-mount 2397-BBGA package, and RoHS compliance make it appropriate for demanding board-level applications that require high integration density.

This device is well suited to system architects and engineers building high-throughput networking, data center, and board-level interconnect solutions who need a single, high-capacity FPGA to consolidate functions and minimize external components while leveraging the Stratix 10 TX family’s advanced fabric and transceiver capabilities.

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