1ST280EU1F50I2VGAS

The 1ST280EU1F50I2VGAS is an Intel Stratix 10 TX FPGA in a 2397-BBGA (FCBGA) package, designed for high-density, high-bandwidth programmable logic implementations. Built on the Stratix 10 TX family architecture, it targets applications that require large logic capacity, substantial on-chip RAM, and advanced high-speed transceiver capability.

With a HyperFlex core architecture and heterogeneous packaging innovations in the Stratix 10 TX family, this device provides a combination of performance, integration and transceiver bandwidth suitable for demanding networking, communications, and high-performance compute designs.

Key Features

• Core Architecture  HyperFlex core architecture from the Stratix 10 TX family, designed to increase core performance compared to previous generations.
• Logic Capacity  2,800,000 logic elements for large-scale programmable designs and complex custom logic implementations.
• On‑chip Memory  240,123,904 total RAM bits to support deep buffering, large LUT-based structures, and on-chip data storage.
• High-speed Transceivers  Family-level dual-mode transceivers capable of 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation for chip-to-chip, chip-to-module, and backplane links; the Stratix 10 TX family supports high aggregate transceiver bandwidth.
• I/O  440 general-purpose I/O pins to interface with external devices, memory, and board-level interconnects.
• Package & Mounting  2397-BBGA (FCBGA) supplier package (2397-FBGA, FC, 50×50) optimized for high-pin-count, high-density designs; surface-mount mounting type.
• Power Supply Range  Voltage supply range from 770 mV to 970 mV to match advanced core voltage requirements.
• Industrial Temperature Grade  Rated operating temperature range from −40 °C to 100 °C for deployment in industrial environments.
• System-Level IP and Fabric Features  Stratix 10 TX family-level features include hardened PCI Express Gen3 and Ethernet MAC options, fractional synthesis and ultra-low jitter PLLs, variable-precision DSP blocks, and advanced packaging technologies (as described in the device family overview).
• Compliance  RoHS compliant for environmental regulatory adherence.

Typical Applications

• High-speed Networking & Telecommunications  Used for line cards, packet processing, and protocol offload where large logic capacity and high-speed transceivers are required.
• Data Center Interconnects  Applies to switch and router fabric implementations that need high aggregate bandwidth and extensive on-chip memory for buffering and flow control.
• Backplane and Chip-to-Module Interfaces  Supports backplane links and module-to-module connections leveraging dual-mode transceiver operation.
• Compute Acceleration  Suitable for hardware acceleration tasks that demand wide logic resources and substantial internal RAM for state and data storage.

Unique Advantages

• Large, Scalable Logic Resource: 2.8 million logic elements enable implementation of complex algorithms and extensive custom logic without partitioning across multiple devices.
• High On‑Chip Memory: 240 million bits of RAM reduce dependence on external memory for many buffering and scratchpad requirements, improving latency and system integration.
• Advanced High‑Speed I/O: Dual-mode transceiver capability and 440 I/O pins provide the physical bandwidth and connectivity options needed for high-throughput systems.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in industrial environments and temperature-variable deployments.
• Compact, High‑Pin Package: 2397-BBGA FCBGA footprint supports high pin-count routing in a compact surface-mount form factor, simplifying dense board layouts.
• Vendor Family Features: Stratix 10 TX family innovations—such as HyperFlex architecture, advanced PLLs, DSP capabilities, hardened protocol IP, and heterogeneous packaging—provide a platform-level ecosystem for high-performance designs.

Why Choose 1ST280EU1F50I2VGAS?

The 1ST280EU1F50I2VGAS offers a high-density Stratix 10 TX FPGA solution that combines large logic capacity, extensive on-chip RAM, and advanced high-speed transceiver technology in a single 2397-BBGA package. Its electrical and thermal ratings—including the 770 mV–970 mV core supply range and −40 °C to 100 °C operating window—support demanding, board-level system designs in industrial environments.

This device is suited to engineering teams building high-throughput networking, compute acceleration, or backplane interface systems that require significant programmable fabric, abundant memory, and robust I/O. Choosing this FPGA delivers a scalable platform with family-level innovations and ecosystem support appropriate for long-lived, high-performance designs.

Request a quote or submit an inquiry to receive pricing and availability for 1ST280EU1F50I2VGAS and to discuss how it fits your design requirements.