1ST280EU2F50E2LG
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 2800000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 930 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 440 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1ST280EU2F50E2LG – Stratix® 10 TX FPGA, 2,800,000 logic elements, 440 I/Os, 2397‑BBGA
The 1ST280EU2F50E2LG is a Stratix® 10 TX field programmable gate array (FPGA) in a 2397‑BBGA flip‑chip package. It combines a high‑density FPGA fabric with the Stratix 10 TX series architecture to address high‑bandwidth system designs that require large logic capacity, significant on‑chip memory, and extensive I/O.
This device targets applications demanding large programmable logic resources, substantial internal RAM, and high‑speed transceiver and I/O support. Key value propositions include very high logic density, broad on‑chip memory, and a package and power envelope sized for advanced system integration.
Key Features
- Core architecture — Stratix 10 TX family architecture including Intel HyperFlex core concepts as described for the series, providing the foundation for high core performance.
- Logic capacity — 2,800,000 logic elements, enabling complex designs and large FPGA implementations on a single device.
- On‑chip memory — 240,123,904 total RAM bits to support large buffering, packet processing, and deep pipeline requirements.
- High I/O count — 440 I/Os for broad external connectivity and dense board‑level interfacing.
- Transceiver and connectivity (series capability) — Stratix 10 TX series devices feature dual‑mode transceivers supporting PAM4 and NRZ operation for chip‑to‑chip, chip‑to‑module, and backplane applications (series‑level capability documented in the device family overview).
- Package and mounting — 2397‑BBGA (FCBGA) in a 50 × 50 supplier package footprint; surface mount mounting type for PCB integration.
- Voltage supply — Core supply specified from 820 mV to 880 mV for power rail planning and system design.
- Operating temperature — 0 °C to 100 °C operating range (Extended grade), suitable for a wide range of commercial and thermal environments.
- Environmental compliance — RoHS compliant.
Typical Applications
- High‑speed networking and switching — Use the device’s large logic capacity and series transceiver capabilities to implement packet processing, MAC aggregation, and other networking functions.
- Data center and telecom infrastructure — Supports designs requiring substantial on‑chip memory and many I/Os for buffering, protocol handling, and system interfacing.
- Backplane and chip‑to‑chip interconnects — Series transceiver modes documented for chip‑to‑chip and backplane use cases provide flexibility for high‑bandwidth links.
- Compute acceleration and custom processing — High logic element count and large RAM enable hardware acceleration engines and custom DSP/processing pipelines.
Unique Advantages
- High logic density: 2.8 million logic elements let you consolidate large designs into a single FPGA, reducing BOM and board complexity.
- Extensive on‑chip memory: 240,123,904 total RAM bits provide headroom for deep FIFOs, large tables, and data buffering without relying solely on external memory.
- Broad I/O reach: 440 I/Os enable dense connectivity to peripherals, memory, and mezzanine interfaces for flexible system partitioning.
- Package readiness for complex boards: The 2397‑BBGA FCBGA package and surface mount profile support compact, high‑pin‑count PCB designs.
- Power rail clarity: A defined core voltage range (820–880 mV) helps simplify power‑supply design and thermal planning.
- Extended grade and compliance: Extended temperature range (0 °C to 100 °C) and RoHS compliance align with many commercial and advanced applications.
Why Choose 1ST280EU2F50E2LG?
The 1ST280EU2F50E2LG positions itself as a high‑capacity Stratix 10 TX family FPGA suited for designs that need very large programmable logic, substantial on‑chip RAM, and a high count of I/Os packaged for dense board integration. Its power and thermal characteristics are defined for system planning, and family‑level Stratix 10 TX innovations provide a platform aligned with high‑bandwidth, compute‑intensive designs.
This device is ideal for teams building advanced networking, data center, backplane, or acceleration systems that require consolidation of complex functions into a single FPGA and a clear specification set for logic, memory, I/O, package, and operating conditions.
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