1ST280EU2F50E2LG

IC FPGA 440 I/O 2397BGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 2800000 2397-BBGA, FCBGA

Quantity 930 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O440Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1ST280EU2F50E2LG – Stratix® 10 TX FPGA, 2,800,000 logic elements, 440 I/Os, 2397‑BBGA

The 1ST280EU2F50E2LG is a Stratix® 10 TX field programmable gate array (FPGA) in a 2397‑BBGA flip‑chip package. It combines a high‑density FPGA fabric with the Stratix 10 TX series architecture to address high‑bandwidth system designs that require large logic capacity, significant on‑chip memory, and extensive I/O.

This device targets applications demanding large programmable logic resources, substantial internal RAM, and high‑speed transceiver and I/O support. Key value propositions include very high logic density, broad on‑chip memory, and a package and power envelope sized for advanced system integration.

Key Features

  • Core architecture — Stratix 10 TX family architecture including Intel HyperFlex core concepts as described for the series, providing the foundation for high core performance.
  • Logic capacity — 2,800,000 logic elements, enabling complex designs and large FPGA implementations on a single device.
  • On‑chip memory — 240,123,904 total RAM bits to support large buffering, packet processing, and deep pipeline requirements.
  • High I/O count — 440 I/Os for broad external connectivity and dense board‑level interfacing.
  • Transceiver and connectivity (series capability) — Stratix 10 TX series devices feature dual‑mode transceivers supporting PAM4 and NRZ operation for chip‑to‑chip, chip‑to‑module, and backplane applications (series‑level capability documented in the device family overview).
  • Package and mounting — 2397‑BBGA (FCBGA) in a 50 × 50 supplier package footprint; surface mount mounting type for PCB integration.
  • Voltage supply — Core supply specified from 820 mV to 880 mV for power rail planning and system design.
  • Operating temperature — 0 °C to 100 °C operating range (Extended grade), suitable for a wide range of commercial and thermal environments.
  • Environmental compliance — RoHS compliant.

Typical Applications

  • High‑speed networking and switching — Use the device’s large logic capacity and series transceiver capabilities to implement packet processing, MAC aggregation, and other networking functions.
  • Data center and telecom infrastructure — Supports designs requiring substantial on‑chip memory and many I/Os for buffering, protocol handling, and system interfacing.
  • Backplane and chip‑to‑chip interconnects — Series transceiver modes documented for chip‑to‑chip and backplane use cases provide flexibility for high‑bandwidth links.
  • Compute acceleration and custom processing — High logic element count and large RAM enable hardware acceleration engines and custom DSP/processing pipelines.

Unique Advantages

  • High logic density: 2.8 million logic elements let you consolidate large designs into a single FPGA, reducing BOM and board complexity.
  • Extensive on‑chip memory: 240,123,904 total RAM bits provide headroom for deep FIFOs, large tables, and data buffering without relying solely on external memory.
  • Broad I/O reach: 440 I/Os enable dense connectivity to peripherals, memory, and mezzanine interfaces for flexible system partitioning.
  • Package readiness for complex boards: The 2397‑BBGA FCBGA package and surface mount profile support compact, high‑pin‑count PCB designs.
  • Power rail clarity: A defined core voltage range (820–880 mV) helps simplify power‑supply design and thermal planning.
  • Extended grade and compliance: Extended temperature range (0 °C to 100 °C) and RoHS compliance align with many commercial and advanced applications.

Why Choose 1ST280EU2F50E2LG?

The 1ST280EU2F50E2LG positions itself as a high‑capacity Stratix 10 TX family FPGA suited for designs that need very large programmable logic, substantial on‑chip RAM, and a high count of I/Os packaged for dense board integration. Its power and thermal characteristics are defined for system planning, and family‑level Stratix 10 TX innovations provide a platform aligned with high‑bandwidth, compute‑intensive designs.

This device is ideal for teams building advanced networking, data center, backplane, or acceleration systems that require consolidation of complex functions into a single FPGA and a clear specification set for logic, memory, I/O, package, and operating conditions.

Request a quote or submit an inquiry to receive pricing and availability information for 1ST280EU2F50E2LG.

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