1ST280EU1F50I2VG

The 1ST280EU1F50I2VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) supplied in a 2397-BBGA FCBGA package. It delivers a high-capacity programmable fabric with 2,800,000 logic elements and extensive on-chip memory, targeted at designs that require large logic density, high I/O count, and advanced transceiver capability.

As part of the Stratix 10 TX family, the device leverages the HyperFlex® core architecture, heterogeneous 3D SiP transceiver tiles and high-speed dual-mode transceivers for demanding chip-to-chip, chip-to-module, and backplane applications.

Key Features

• Core Architecture HyperFlex® core architecture and Intel 14 nm tri-gate (FinFET) technology as described for the Stratix 10 TX family, providing significant core performance for complex designs.
• Logic Capacity 2,800,000 logic elements, enabling very large, resource-intensive designs.
• On-chip Memory 240,123,904 total RAM bits of on-chip memory for buffering, lookup tables, and state storage.
• High-speed Transceivers Dual-mode transceivers capable of PAM4 up to 57.8 Gbps and NRZ up to 28.9 Gbps; family supports up to 144 full-duplex transceiver channels for high-bandwidth interconnects.
• Hard IP Blocks (Family) Hardened IP in the Stratix 10 TX family includes PCI Express Gen3 and 10/25/100 Gbps Ethernet MACs with Reed-Solomon FEC for NRZ and PAM4 modes (family-level feature set).
• I/O and Packaging 440 I/O pins in a surface-mount 2397-BBGA FCBGA package (supplier package listed as 2397-FBGA, FC 50×50), suitable for dense board-level integration.
• Power and Operating Range Core voltage supply range of 770 mV to 970 mV and industrial operating temperature range of −40 °C to 100 °C.
• Manufacturing and Compliance Surface-mount device optimized for high-density assembly; RoHS compliant.

Typical Applications

• High-bandwidth Networking and Backplanes Dual-mode transceivers and hardened Ethernet MAC IP in the Stratix 10 TX family enable high-speed chip-to-chip, module, and backplane communications.
• PCI Express-based Systems Family-level hardened PCIe Gen3 IP supports integration into systems requiring PCI Express interfacing and configuration via PCIe.
• Compute Acceleration and System Integration Large logic element count and substantial on-chip RAM support complex hardware acceleration, custom processing pipelines, and system-level feature integration.

Unique Advantages

• High Logic Density: 2.8 million logic elements provide headroom for large-scale designs and complex algorithms.
• Substantial On-chip Memory: Over 240 million bits of RAM reduces dependency on external memory for many buffering and state storage needs.
• High-speed I/O and Transceivers: Dual-mode transceivers with PAM4 and NRZ capability and up to 144 full-duplex channels (family) allow direct support for very high aggregate bandwidths.
• Industrial Temperature Range: −40 °C to 100 °C operating range suits deployments requiring extended temperature operation.
• Compact Surface-mount Package: 2397-BBGA FCBGA (50×50) package provides a high-density, board-level form factor for space-constrained systems.
• Low-voltage Core Operation: 770–970 mV core voltage window supports modern low-voltage FPGA power architectures.

Why Choose 1ST280EU1F50I2VG?

The 1ST280EU1F50I2VG combines very high logic capacity, extensive on-chip RAM, and a high I/O count in a compact surface-mount FCBGA package. As part of the Stratix 10 TX family, it benefits from the HyperFlex core architecture and high-speed dual-mode transceivers that address demanding bandwidth and integration requirements.

This device is well suited for engineers developing large, performance-sensitive systems that need substantial programmable logic, high-speed connectivity, and industrial-class operating range. Its combination of resources and family-level hardened IP supports scalable designs and long-term deployment in advanced networking, compute acceleration, and system integration applications.

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