1ST280EU2F50E2VG

The 1ST280EU2F50E2VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) supplied in a 2397-BBGA FCBGA package. It integrates a high-density FPGA fabric with a broad memory footprint and a large number of I/O to address demanding, high-performance designs.

Built on the Stratix 10 TX family architecture, this device targets applications requiring high logic capacity, extensive on-chip RAM, and advanced I/O and transceiver support as described in the Stratix 10 TX device overview.

Key Features

• Logic Capacity — 2,800,000 logic elements (LEs) provide large-scale programmable fabric for complex algorithms and deep pipelines.
• On-chip Memory — 240,123,904 total RAM bits deliver substantial block RAM resources for buffering, packet buffering, and intermediate storage.
• I/O Count — 440 user I/O pins to support wide parallel interfaces and high-density board connectivity.
• Power and Supply — Core voltage supply range of 770 mV to 970 mV to match platform power-rail requirements.
• Package — 2397-BBGA (FCBGA) package; supplier device package specified as 2397-FBGA, FC (50×50) for integration into dense module and board designs.
• Operating Conditions — Rated operating temperature range of 0 °C to 100 °C and listed as Extended grade.
• Stratix 10 TX Family Innovations — Series-level features include the HyperFlex core architecture, heterogeneous 3D SiP transceiver tiles, dual-mode high-speed transceivers (57.8 Gbps PAM4 / 28.9 Gbps NRZ), hardened PCIe Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks, and optional embedded quad-core 64-bit Arm Cortex‑A53 hard processor system (HPS) in select devices.

Typical Applications

• High-performance networking and switching — Leverages the large logic count, substantial on-chip RAM, and family-level Ethernet MAC and FEC support for packet processing, switching fabric, and line-rate traffic management.
• Backplane and chip-to-module interconnect — Dual-mode transceiver capability and abundant I/O make the device suitable for backplane, chip-to-module, and chip-to-chip high-speed links.
• Compute acceleration and FPGA-based processing — Large logic capacity and memory resources support hardware acceleration, custom compute pipelines, and DSP-intensive workloads.

Unique Advantages

• High integration density: 2.8M logic elements and ~240Mbits of on-chip RAM reduce the need for external logic and memory, simplifying system design.
• Versatile high-speed I/O: 440 I/O pins and series-level dual-mode transceivers enable flexible connectivity for a wide range of link types and topologies.
• Advanced packaging: The 2397-BBGA FCBGA package and 50×50 supplier package footprint support compact board layouts and high pin-count routing.
• Series-level performance innovations: HyperFlex core architecture and heterogeneous 3D SiP transceiver tiles provide the architectural building blocks described for the Stratix 10 TX family.
• Design scalability: Family-level hardened IP options such as PCI Express Gen3 and high-speed Ethernet MACs facilitate system-level feature integration without relying solely on soft-IP.

Why Choose 1ST280EU2F50E2VG?

The 1ST280EU2F50E2VG positions itself as a high-capacity Stratix 10 TX FPGA option for designs that require extensive logic resources, significant on-chip RAM, and a high I/O count packaged in a 2397-BBGA FCBGA form factor. Its Stratix 10 TX family characteristics—such as HyperFlex core architecture and high-speed transceiver technology—align with demanding bandwidth and compute requirements described in the device overview.

This device is suited for customers building scalable, high-performance systems where integration of large programmable fabric, robust memory resources, and advanced connectivity are critical. The Extended grade operating range and specified voltage window support deployment across a range of production platforms.

To request a quote or submit a purchase inquiry for 1ST280EU2F50E2VG, please reach out with your quantity and delivery requirements and our team will provide pricing and availability details.