1ST280EU2F50I1VG

The 1ST280EU2F50I1VG is an Intel Stratix® 10 TX field‑programmable gate array provided in a 2397‑BBGA FCBGA package and designed for high‑bandwidth, transceiver‑intensive systems. This device integrates a monolithic 14 nm FPGA fabric based on the Intel HyperFlex® core architecture and delivers a large logic and memory resource set for complex system designs.

Stratix 10 TX devices feature power‑efficient, dual‑mode transceivers (57.8 Gbps PAM4 and 28.9 Gbps NRZ), hardened PCI Express Gen3 and multi‑rate Ethernet MAC IP blocks, and optional embedded processing. The 1ST280EU2F50I1VG is supplied for surface‑mount assembly, operates from 770 mV to 970 mV, and supports an industrial temperature range of –40 °C to 100 °C.

Key Features

• Core Architecture  Built on Intel HyperFlex® core architecture with a monolithic 14 nm FPGA fabric and approximately 2,800,000 logic elements for large-scale logic integration.
• High‑Speed Transceivers  Dual‑mode transceivers supporting 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation, with heterogeneous 3D SiP transceiver tiles and up to 144 full‑duplex transceiver channels (series capability).
• Memory Resources  Large on‑chip memory totaling 240,123,904 bits; select family devices include embedded eSRAM (47.25 Mbit) and M20K internal SRAM blocks.
• I/O and Interfaces  440 device I/O pins and hardened IP blocks including PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC with Reed‑Solomon FEC options for high‑throughput interfaces.
• Processing and DSP  Series includes options for an embedded quad‑core 64‑bit Arm Cortex‑A53 Hard Processor System (HPS) in select devices and hardened floating point DSP blocks for compute‑intensive tasks.
• Packaging and Mounting  2397‑BBGA, FCBGA package (2397‑FBGA, FC 50×50) for surface‑mount assembly, enabling dense board integration.
• Power and Thermal  Voltage supply range from 770 mV to 970 mV; rated operating temperature range −40 °C to 100 °C and specified as Industrial grade.
• Compliance  RoHS compliant.

Typical Applications

• High‑Bandwidth Networking  Implement aggregation, switching, and protocol offload using the device’s multi‑rate Ethernet MAC blocks and high‑speed transceivers.
• Backplane and Chip‑to‑Module Connectivity  Support chip‑to‑chip, chip‑to‑module, and backplane links using PAM4 and NRZ transceiver modes at data center interconnect and carrier‑grade rates.
• PCI Express Systems  Deploy in PCIe Gen3 based platforms leveraging the hardened PCIe Gen3 IP for host or endpoint integration and high‑throughput data flow.
• Compute‑Intensive Acceleration  Use the large logic capacity, extensive on‑chip RAM, and hardened DSP blocks for hardware acceleration and data‑path processing; select devices also provide an embedded quad‑core Cortex‑A53 HPS for application processing.

Unique Advantages

• Extensive Logic Capacity:  Approximately 2.8 million logic elements enable consolidation of large designs into a single FPGA device, reducing cross‑device interfacing.
• Dual‑Mode High‑Speed I/O:  Support for 57.8 Gbps PAM4 and 28.9 Gbps NRZ transceiver operation provides flexibility to target both next‑generation and legacy link standards.
• Integrated Hardened IP:  Built‑in PCIe Gen3 and 10/25/100 Gbps Ethernet MACs with FEC reduce soft‑IP overhead and accelerate time to market for high‑performance systems.
• Scalable On‑Chip Memory:  Over 240 million bits of total RAM and selectable embedded eSRAM options support large buffers, packet processing, and algorithmic storage needs.
• Advanced Packaging:  Monolithic 14 nm core fabric combined with heterogeneous 3D SiP and EMIB packaging options in the series enables high transceiver density and board‑level integration.
• Industrial Temperature Range:  Rated for −40 °C to 100 °C operation, suitable for designs requiring extended temperature tolerance.

Why Choose 1ST280EU2F50I1VG?

The 1ST280EU2F50I1VG places the performance characteristics of the Stratix® 10 TX family into a single, high‑capacity FPGA package: large logic element count, substantial on‑chip RAM, and extensive high‑speed transceiver capability. Its combination of HyperFlex® architecture, hardened interface IP, and optional embedded processing addresses demanding data‑path and control‑plane requirements in transceiver‑heavy applications.

This device is well suited for system designs that require dense logic integration, multi‑terabit I/O bandwidth, and dependable operation across an industrial temperature range. The Stratix 10 TX architecture and on‑chip resources provide a clear upgrade path for development teams targeting high‑performance networking, backplane, and accelerator platforms.

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