1ST280EU2F50I2LGAS

The 1ST280EU2F50I2LGAS is an Intel Stratix 10 TX family FPGA in a 2397-ball FCBGA package, provided as a surface-mount, industrial-grade device. It pairs a large monolithic core fabric with high-density I/O and a low-voltage supply to support bandwidth‑intensive, performance-focused system designs.

Designed for next‑generation applications that demand high transceiver bandwidth, advanced logic capacity and system integration, the Stratix 10 TX series delivers features such as HyperFlex core architecture, hardened protocol IP and heterogeneous 3D packaging technologies described in the device overview.

Key Features

• Core Architecture — Monolithic core fabric with 2,800,000 logic elements and Intel HyperFlex® core architecture for improved core performance at the series level.
• High‑Speed Transceivers — Dual‑mode transceivers in the Stratix 10 TX family support up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation for high‑bandwidth chip‑to‑chip, chip‑to‑module and backplane links.
• Hardened Protocol IP — Series-level hard IP includes PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC with dedicated Reed‑Solomon FEC as described in the device overview.
• On‑Chip Memory — 240,123,904 total RAM bits available on the device; the family also references embedded eSRAM and M20K memory blocks in select devices.
• I/O and Package — 440 user I/O pins in a 2397‑BBGA (FCBGA) package; supplier device package specified as 2397‑FBGA, FC (50×50). Surface mount mounting type.
• Power and Operating Range — Core supply range specified at 820 mV to 880 mV; industrial operating temperature range from −40 °C to 100 °C.
• Heterogeneous Packaging — Series overview highlights Intel EMIB and heterogeneous 3D SiP transceiver tile technology for integrated high‑speed connectivity (series‑level feature).
• Compliance — RoHS compliant.

Typical Applications

• High‑Performance Networking — Platforms requiring high aggregate transceiver bandwidth and hardened Ethernet MACs for switch, router and network appliance designs.
• Data Center and Cloud Infrastructure — Accelerators and interface cards that need large logic capacity, PCIe Gen3 connectivity and high‑speed serial links.
• Telecommunications and Optical Transport — Backplane and module designs that leverage dual‑mode transceivers for PAM4 and NRZ signaling.
• Compute‑Intensive Systems — FPGA‑based compute and DSP tasks that benefit from a large internal memory pool and the Stratix 10 TX family’s hardened DSP/block architectures described in the device overview.

Unique Advantages

• Large Logic Fabric: 2.8 million logic elements provide headroom for complex custom logic and large-scale system integration on a single device.
• High Bandwidth I/O: 440 I/O pins plus series‑level transceiver capability enable dense, high‑speed interconnect for modern data paths.
• Industrial‑Grade Operation: Specified operating range of −40 °C to 100 °C supports deployment in industrial environments.
• Integrated Packaging Technologies: Heterogeneous 3D SiP and EMIB approaches (series overview) unify high‑speed transceivers with the monolithic fabric for compact system designs.
• Low‑Voltage Core: Core supply defined between 820 mV and 880 mV for designs targeting precise power budgeting.
• Standards‑Oriented Connectivity: Series‑level hard IP for PCIe Gen3 and multi‑rate Ethernet simplifies integration of common high‑performance protocols.

Why Choose 1ST280EU2F50I2LGAS?

The 1ST280EU2F50I2LGAS brings the Stratix 10 TX family’s high logic density, industrial temperature range and advanced transceiver capability into a 2397‑ball FCBGA package for developers building bandwidth‑heavy, performance‑sensitive systems. With 2.8 million logic elements, 240 million bits of on‑chip RAM and 440 I/Os, this device is positioned for complex networking, data center acceleration and telecom applications that require integrated high‑speed connectivity and robust system-level features described in the device overview.

Choosing this device leverages the Stratix 10 TX series innovations—HyperFlex core architecture, heterogeneous packaging and hardened protocol IP—offering a scalable platform for designs that demand high integration, predictable operating limits and RoHS compliance.

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