1ST280EU1F50I2LGAS

The 1ST280EU1F50I2LGAS is an Intel Stratix® 10 TX field programmable gate array (FPGA) in a 2397‑BBGA FCBGA package, designed for industrial applications. It integrates a high‑performance HyperFlex® core architecture and on‑package heterogeneous transceiver tiles to address high‑bandwidth, high‑integration system designs.

With 2,800,000 logic elements, 240,123,904 bits of internal RAM, and up to 440 general‑purpose I/Os, this device targets systems that require large programmable fabric, extensive I/O, and advanced high‑speed serial connectivity.

Key Features

• Core Architecture Intel HyperFlex® core architecture implemented in 14 nm FinFET technology, delivering high core performance across large FPGA fabric.
• Logic Capacity 2,800,000 logic elements to implement large, complex digital designs and deep custom logic pipelines.
• On‑Chip Memory 240,123,904 total RAM bits supporting large buffering, packet processing, and on‑chip data storage requirements.
• High‑Speed Transceivers Dual‑mode transceivers capable of PAM4 and NRZ operation, with family support for up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ data rates for chip‑to‑chip, chip‑to‑module, and backplane links.
• Hard IP and Networking Hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MACs with dedicated Reed‑Solomon FEC support, enabling high‑throughput I/O subsystems.
• Embedded Processor Option Family documentation includes an embedded hard processor system (HPS) option with a quad‑core 64‑bit Arm Cortex‑A53 in select devices for application‑class processing integration.
• Power and Clocking Supports fractional synthesis and ultra‑low jitter PLLs for precise clocking; documented device supply range from 820 mV to 880 mV.
• Package and Mounting Surface‑mount 2397‑BBGA FCBGA (2397‑FBGA, FC 50×50) package suitable for high‑density board designs.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C, suitable for industrial environment deployments.
• Standards and Compliance RoHS compliant.

Typical Applications

• High‑Speed Networking & Telecom Implement line cards, packet processors, and backplane interfaces using the device’s high‑speed transceivers and hardened Ethernet MACs.
• Data Center & Switch Infrastructure Use the large logic capacity and hardened PCIe/ethernet IP to build switching, routing, and accelerator front‑ends with significant aggregate bandwidth.
• Chip‑to‑Module and Backplane Systems Leverage dual‑mode transceivers and EMIB‑style packaging to connect across modules and backplanes at PAM4 or NRZ rates.
• High‑Performance Compute and DSP Deploy large custom compute fabrics and variable precision DSP blocks for signal processing and computational acceleration.

Unique Advantages

• Massive Programmable Fabric: 2.8 million logic elements enable very large, complex designs without partitioning across multiple devices.
• Integrated High‑Speed I/O: Dual‑mode transceivers and hardened Ethernet/PCIe IP reduce external PHY and MAC complexity for high‑bandwidth systems.
• On‑Package Heterogeneous Integration: SiP/transceiver tile approach provides dense transceiver integration while keeping the core fabric monolithic.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in demanding industrial environments.
• Extensive On‑Chip Memory: 240+ million bits of RAM enable large buffers and state storage directly in fabric, simplifying board‑level memory requirements.
• Power and Clocking Flexibility: Fractional synthesis PLLs and documented supply range allow designers to meet stringent timing and power budgets.

Why Choose 1ST280EU1F50I2LGAS?

The 1ST280EU1F50I2LGAS positions itself as a high‑capacity, industrial‑grade Stratix 10 TX FPGA for designs that demand large programmable fabric, extensive on‑chip memory, and advanced high‑speed serial connectivity. Its HyperFlex® core architecture and family features such as hardened PCIe and Ethernet MACs enable integration of complex system functions while reducing external IP and component count.

This device suits engineers building high‑bandwidth network infrastructure, data center switching, backplane interconnects, and compute acceleration front‑ends who need a scalable, reliable FPGA platform with industrial temperature support and RoHS compliance.

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